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SI4712-B30-GMR

Silicon Labs

SI4712-B30-GMR by Silicon Labs

SI4712-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, utilizing CMOS technology and requiring 3.3V supply voltage. This RF and baseband circuit is ideal for compact mobile devices due to its very thin profile and small dimensions of 3mm x 3mm.

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Advanced Electronics

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Overview

Experience the superior quality of Silicon Labs with the SI4712-B30-GMR, a cutting-edge Cellphone IC that boasts exceptional performance and reliability. Designed with advanced technology, this product offers customers the advantage of seamless integration into their devices, ensuring optimal functionality and efficiency. Whether used in smartphones or other telecommunications equipment, the SI4712-B30-GMR delivers unmatched value, benefits, and advantages that cater to the diverse needs of consumers. Trust Silicon Labs to provide you with top-of-the-line solutions for all your cellphone IC requirements.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards, saving space and simplifying manufacturing processes.

Package Shape: SQUARE

Square packages are commonly used for ICs and provide better thermal dissipation and easier handling during production.

No. of Terminals: 20

Having 20 terminals allows for flexibility in functionality and connectivity within the cellphone IC.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers efficient heat dissipation, protection, and compact size for space-constrained cellphone designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding thermal conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows the cellphone IC to function in cold environments without issues.

Terminal Position: QUAD

Quad terminal position provides stable connectivity and efficient signal transmission within the device.

Maximum Seated Height: 0.6 mm

The low maximum seated height enables slim and compact cellphone designs.

Width: 3 mm

The compact width allows for efficient integration into the cellphone's circuit board layout.

Length: 3 mm

Similar to width, the compact length ensures space-saving integration within the cellphone design.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and scalability, making the cellphone IC energy-efficient and high-performing.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and compliant with regulations, ensuring the cellphone IC is safe for use.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuitry within the same IC simplifies design, reduces component count, and improves overall system efficiency.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is a common standard in cellphone electronics, ensuring compatibility and stable operation.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density integration of components on the circuit board, optimizing space and design efficiency.

Technical Specifications

Cellphone ICs SI4712-B30-GMR attributes and parameters. Explore more Cellphone ICs devices from Silicon Labs

Specs

JESD-30 Code:

S-XQCC-N20

Length:

3 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

SI4712-B30-GMR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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