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AD6643BCPZ-250

Analog Devices

AD6643BCPZ-250 by Analog Devices

AD6643BCPZ-250 by Analog Devices is a cellphone IC with 2 functions, operating at 1.8V. It features a square package style, -40 to 85°C temperature range, and RF and baseband circuit for telecom applications.

Median Price

$138.765

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 1,604 parts In-Stock

1+ parts

$182.070

100+ parts

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$110.450

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1,604

$182.070

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$110.450

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Rochester

USA . 143 parts In-Stock

1+ parts

-

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$95.460

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$85.410

10k+ parts

$80.380

143

-

$95.460

$85.410

$80.380

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 760 parts In-Stock

1+ parts

$101.023

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760

$101.023

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Vyrian

USA . 6,079 parts In-Stock

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6,079

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Cyclops Electronics Ltd

UK . 723 parts In-Stock

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723

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Distributors (Availability)

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Parana Technologies

USA . 380 parts In-Stock

1+ parts

$16.722

100+ parts

-

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$15.552

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380

$16.722

-

$15.552

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IDEA Electronic Components Group

UK . 2,077 parts In-Stock

1+ parts

$17.981

100+ parts

$17.082

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$17.082

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2,077

$17.981

$17.082

$17.082

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DigiPath Technology Company

USA . 1,646 parts In-Stock

1+ parts

$28.050

100+ parts

$26.928

1k+ parts

-

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$26.928

1,646

$28.050

$26.928

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$26.928

Semicontronic

India . 453 parts In-Stock

1+ parts

$90.390

100+ parts

$88.130

1k+ parts

$87.678

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453

$90.390

$88.130

$87.678

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Ampacity Inc.

Singapore . 328 parts In-Stock

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$90.390

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328

$90.390

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Corphita

USA . 139 parts In-Stock

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$95.706

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139

$95.706

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RC Electronics

USA . 3,153 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,742 parts In-Stock

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1,742

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Native Components

USA . 431 parts In-Stock

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Kepictronics

USA . 128 parts In-Stock

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128

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Northwest PG Solutions

USA . 89 parts In-Stock

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89

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iodParts Technologies Inc.

India . 53 parts In-Stock

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53

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Overview

Elevate your cellphone technology with the AD6643BCPZ-250 by Analog Devices. Known for their superior quality and reliability, Analog Devices brings you a cutting-edge Cellphone IC that offers unmatched performance and efficiency. With its advanced features and innovative design, this IC is perfect for a wide range of applications, delivering exceptional value and benefits to customers. Upgrade your devices today and experience the difference with Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

Easy to integrate into PCBs, allows for compact and efficient design.

No. of Functions: 2

Provides multiple functionalities in a single IC, saving space and reducing component count.

Package Shape: SQUARE

Square shape is typically easier to handle and place on PCBs compared to irregular shapes.

Power Supplies (V): 1.8

Operates at low voltage which can help in reducing power consumption and heat dissipation.

No. of Terminals: 64

Sufficient number of terminals for connecting various components and interfaces.

Maximum Operating Temperature: 85 °C

Can operate in harsh environments with high temperatures without malfunctioning.

Minimum Operating Temperature: -40 °C

Can operate in cold environments without affecting performance.

Terminal Finish: MATTE TIN

Provides good solderability and corrosion resistance for reliable connections.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for portable devices.

Nominal Supply Voltage: 1.8 V

Low supply voltage helps in reducing power consumption and extending battery life.

Moisture Sensitivity Level (MSL): 3

Can withstand moderate exposure to moisture during manufacturing and usage.

Technical Specifications

Cellphone ICs AD6643BCPZ-250 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.275 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

AD6643BCPZ-250 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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