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AD6672BCPZ-250

Analog Devices

AD6672BCPZ-250 by Analog Devices

AD6672BCPZ-250 by Analog Devices is a cellphone IC with 32 terminals, operating at -40 to 85°C. It features a 1.8V supply voltage, RF and baseband circuitry, and matte tin finish. This square chip carrier is surface mountable, with a terminal pitch of 0.5mm, making it ideal for industrial telecom applications.

Median Price

$81.570

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,229 parts In-Stock

1+ parts

-

100+ parts

$81.570

1k+ parts

$72.980

10k+ parts

$68.690

4,229

-

$81.570

$72.980

$68.690

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 540 parts In-Stock

1+ parts

$80.684

100+ parts

-

1k+ parts

-

10k+ parts

-

540

$80.684

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$89.880

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$89.880

-

-

-

Vyrian

USA . 3,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,171

-

-

-

-

VNN

France . 1,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,309

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 444 parts In-Stock

1+ parts

$6.956

100+ parts

-

1k+ parts

$6.469

10k+ parts

-

444

$6.956

-

$6.469

-

IDEA Electronic Components Group

UK . 808 parts In-Stock

1+ parts

$7.480

100+ parts

-

1k+ parts

$7.106

10k+ parts

-

808

$7.480

-

$7.106

-

DigiPath Technology Company

USA . 86 parts In-Stock

1+ parts

$11.669

100+ parts

$11.202

1k+ parts

-

10k+ parts

$11.202

86

$11.669

$11.202

-

$11.202

Aztec Data Supply Inc.

USA . 4,179 parts In-Stock

1+ parts

$14.730

100+ parts

-

1k+ parts

-

10k+ parts

-

4,179

$14.730

-

-

-

Ampacity Inc.

Singapore . 2,890 parts In-Stock

1+ parts

$72.190

100+ parts

-

1k+ parts

-

10k+ parts

-

2,890

$72.190

-

-

-

Semicontronic

India . 2,700 parts In-Stock

1+ parts

$72.190

100+ parts

$70.385

1k+ parts

$70.024

10k+ parts

-

2,700

$72.190

$70.385

$70.024

-

Corphita

USA . 909 parts In-Stock

1+ parts

$76.437

100+ parts

-

1k+ parts

-

10k+ parts

-

909

$76.437

-

-

-

Corohmni

South Africa . 457 parts In-Stock

1+ parts

$87.035

100+ parts

-

1k+ parts

-

10k+ parts

-

457

$87.035

-

-

-

Continental Prestige Electronics

USA . 1,444 parts In-Stock

1+ parts

$89.880

100+ parts

-

1k+ parts

-

10k+ parts

$88.082

1,444

$89.880

-

-

$88.082

QUARKTWIN TECHNOLOGY LTD

USA . 21,087 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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21,087

-

-

-

-

Argo Parts USA

USA . 3,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,680

-

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$88.082

1k+ parts

$85.386

10k+ parts

$83.588

500

-

$88.082

$85.386

$83.588

Overview

Elevate your cellphone technology with the AD6672BCPZ-250 by Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers exceptional Cellphone ICs that are designed to optimize performance and enhance user experience. This surface mount device offers a compact square package shape with a very thin profile, making it ideal for a wide range of applications. With a nominal supply voltage of 1.8V and industrial temperature grade, this RF and baseband circuit is a game-changer in the telecommunications industry. Upgrade your devices with the AD6672BCPZ-250 and experience the difference Analog Devices can make.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient and compact design, making the product suitable for smaller electronic devices.

Package Shape: SQUARE

The square shape of the package provides a stable and uniform mounting option, ensuring reliable performance in various applications.

Power Supplies (V): 1.8

Operating at 1.8V provides low power consumption and efficient energy usage, making the product ideal for battery-powered devices.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile allows for effective heat dissipation and space-saving design, enhancing the product's performance and reliability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand extended use in various environmental conditions without compromising its performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product's functionality even in extremely cold environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, enhancing the product's durability and reliability in different operating conditions.

Terminal Position: QUAD

Quad terminal position offers efficient connectivity and signal transmission, contributing to the overall performance of the product in electronic devices.

Width: 5 mm

With a width of 5mm, the product can be easily integrated into various electronic systems, providing flexibility in design and installation.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly processes, maintaining the product's quality and reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C supports robust soldering connections, ensuring the product's stability and performance under thermal stress.

Length: 5 mm

With a length of 5mm, the product can fit efficiently within compact electronic devices, contributing to a space-saving design and improved functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation indicates the product's reliability and suitability for use in rugged and demanding industrial environments.

Terminal Form: NO LEAD

The no-lead terminal form promotes environmentally-friendly manufacturing practices and ensures compliance with RoHS regulations, making the product a sustainable choice.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V provides stable and efficient power delivery, contributing to the product's performance and longevity.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for precise electrical connections and signal transmission, enhancing the product's overall functionality in electronic devices.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product's resilience to moisture exposure during storage and handling, ensuring consistent performance and product reliability.

Technical Specifications

Cellphone ICs AD6672BCPZ-250 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.145 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

AD6672BCPZ-250 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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