Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MAX2010ETI+ by Analog Devices is a Cellphone IC with BICMOS tech. It operates b/w -40 to 85 °C, has 28 terminals in a square package style, and requires 5V nominal voltage. Ideal for RF and baseband circuits in telecom applications due to its compact size and surface mount capability.
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DigiKey
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Digiode
$24.187
Vyrian
Anansix
Semtec, LLC
ACDS - Activité Composants Distribution Service
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$9.696
MARBEL Systems
$10.804
Texas Native Microelectronics
$12.418
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Component Stockers USA
$18.040
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Corphita
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Qasali Group International
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Authorized Procurement Solutions
Allows for easy and efficient assembly onto circuit boards, saving time and space during production.
Square shape allows for efficient use of space on the circuit board, maximizing component density.
Provides ample connectivity options for various functions and features of the cellphone IC.
Ensures reliable operation even in elevated temperature environments, making it suitable for industrial applications.
Wide temperature range allows for operation in extreme cold conditions, increasing the versatility of the IC.
Matte tin finish provides good conductivity and corrosion resistance, ensuring long-term reliability of the terminals.
Combination of package styles allows for efficient heat dissipation and compact design, ideal for space-constrained applications.
BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption.
Operates at standard voltage level, making it compatible with a wide range of systems and power sources.
Cellphone ICs MAX2010ETI+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
MAX2010ETI+ Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.
CEO
Vincent Roche
Interim CFO
James Mollica
CAO
Michael Sondel
Limerick Fab
Fabrication
Fab Initiation
1977
Ireland
Limerick
Wafer Capacity
30,000
Hillview Fab
2001
USA
Milpitas
15,000
Wilmington Fab
1967
Wilmington
50,000
Camas Fab
1997
Camas
18,000
Beaverton-Portland
1987
Beaverton
14,000
2N7002
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
LM107H/883C
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
STM32F401CDY6TR
STMicroelectronics
STM32F401CDY6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words, 50 MHz clock frequency, and 36 I/O lines. It is used in applications requiring high-speed processing, such as industrial automation and consumer electronics.
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDN306P
Onsemi
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
1N4148WS
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138BKW,115
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
Silicon Standard
Microsemi
RYZ024A000FZ00#HD0
Renesas Electronics
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3;
CC2511F16RSPRG3
Texas Instruments
CC2511F16RSPRG3 by Texas Instruments is a cellphone IC with 36 terminals in a square package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology features a very thin profile, making it ideal for industrial telecom applications.
CC1100RTKR
CC1100RTKR by Texas Instruments is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. With RF and baseband circuit technology, it has a supply voltage of 3V and terminal pitch of 0.5mm, making it ideal for telecommunications applications.
TCM4400EPET
Texas Instruments TCM4400EPET is a BICMOS technology Cellphone IC with 80 terminals in a square flatpack package. Operating b/w -25 to 85 °C, it has a supply voltage of 3V and max current of 0.03mA. Ideal for baseband circuits in telecom applications due to its compact size and low power consumption.
HMC422MS8ETR
Analog Devices
HMC422MS8ETR by Analog Devices is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85°C and has a nominal voltage of 3V. This RF and baseband circuit is designed for telecom applications requiring high performance in a compact form factor.
CC2511F32RSP
CC2511F32RSP by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. Operating b/w 0-85°C, it features CMOS technology and RF/baseband circuitry for telecom applications. With a nominal voltage of 3.3V, this surface-mount IC has a terminal pitch of 0.5mm and low profile at 0.9mm seated height.
TS3A26746EYZPR
TS3A26746EYZPR by Texas Instruments is a 6-terminal cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature range -40 to 85°C with 2 channels for baseband circuits at a nominal voltage of 3.3V. Ideal for compact mobile devices due to its small dimensions 1.4mm x 0.9mm x 0.5mm.
TCM8010-37FR
Texas Instruments TCM8010-37FR is a Cellphone IC with 44 terminals in a square package. Operating at -30 to 70°C, it has a supply voltage of 3.7/4V and BICMOS technology. Ideal for baseband circuits, this IC is surface mountable and features GULL WING terminals in a flatpack style.
MAX2051ETP+T
Analog Devices' MAX2051ETP+T is a cellphone IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, BICMOS technology, and 5V nominal voltage make it ideal for RF and baseband circuits in telecom applications.
CC1020RUZ
The Texas Instruments CC1020RUZ is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
SARA-R422-01B
U-blox Ag
RF AND BASEBAND CIRCUIT;
CC1050-RTB1
CC1050-RTB1 by Texas Instruments is a cellphone IC with 24 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
GC5325IZND
GC5325IZND by Texas Instruments is a cellphone IC with 352 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 1.2V, making it ideal for telecom applications.
MAX5865ETM+T
Maxim Integrated
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
TRF4400PW
TRF4400PW by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.
BC66NB-04-STD
Quectel Wireless Solutions
Quectel Wireless Solutions BC66NB-04-STD is a CELL IC with 58 terminals, operating temp -35 to 75°C. Telecom IC for RF and baseband circuits, package style MICROELECTRONIC ASSEMBLY. Ideal for compact applications requiring low power consumption.
TRF372017IRGZT
TRF372017IRGZT by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features power supplies of 3.3V and 5V, suitable for RF and baseband circuits in telecom applications. The package style includes chip carrier and heat sink/slug, with a terminal pitch of 0.5mm.
ADRF6602ACPZ-R7
Analog Devices' ADRF6602ACPZ-R7 is a 40-terminal cellphone IC in a square chip carrier package. With BICMOS technology, it operates b/w -40 to 85°C and has a nominal voltage of 5V. This RF and baseband circuit is ideal for telecom applications due to its compact size and industrial temperature grade suitability.
AD6688BBPZRL-3000
AD6688BBPZRL-3000 by Analog Devices is a CELLPHONE IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for INDUSTRIAL telecom applications. Features include 0.975V supply voltage, RF and baseband circuitry, and low profile design for compact devices.
MAX2306ETI+
Analog Devices' MAX2306ETI+ is a cellphone IC with 28 terminals in a square chip carrier package. It operates at -40 to 85°C, with power supplies of 3/3.3V and a max supply current of 0.0415mA. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and is suitable for industrial temperature grade applications.
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ADPA7005CHIP
ADPA7005CHIP by Analog Devices is a wide band medium power RF amplifier with 11.5 dB gain, operating from 20-44 GHz. It can handle up to 27 dBm CW input power and operates in temperatures ranging from -55 °C to 85°C. Ideal for applications requiring high frequency amplification in RF & microwave systems.
ADN4693E-1BCPZ-RL7
ADN4693E-1BCPZ-RL7 by Analog Devices is a Line Driver & Receiver with 16 terminals, operating at 3.3V. It offers a max transmit delay of 2.4ns and max supply current of 24mA. Ideal for applications requiring differential output and EIA/TIA interface standards compliance in tight spaces due to its very thin profile chip carrier package style.
AD3542RBCPZ16
AD3542RBCPZ16 by Analog Devices is a 16-bit D/A converter with max analog output voltage of 7.5V and linearity error of 0.006103%. It features a nominal settling time of 0.1us, making it ideal for applications requiring precise analog signal generation in temperature-sensitive environments. With a compact square package shape and surface mount capability, this chip carrier is suitable for space-constrained designs where high performance is essential.
ADN4693E-1BCPZ
ADN4693E-1BCPZ by Analog Devices is a Line Driver & Receiver with 16 terminals, operating at 3.3V nominal voltage. It features a max transmit delay of 2.4ns and differential output for EIA/TIA-899 interface standard applications in industrial settings.
AD3542RBCPZ16-RL7
AD3542RBCPZ16-RL7 by Analog Devices is a 16-bit D/A converter with max analog output voltage of 7.5V, 0.006103% linearity error, and 0.1us settling time. Ideal for applications requiring precise analog signal generation in temperature-sensitive environments.
ADAQ23876BBCZ
Analog Devices' ADAQ23876BBCZ is a 16-bit ADC with 0.00125% EL, 15 MHz sample rate, and 2'S COMPLEMENT BINARY output. Ideal for wireless data acquisition applications due to its compact GRID ARRAY package and fast 0.063 us conversion time. Operating from -40 to 85 °C, it offers precise analog-to-digital conversion in a small form factor.
ADPA7005AEHZ
ADPA7005AEHZ by Analog Devices is a wide band medium power RF amplifier with 12 dB gain. It operates b/w 18-44 GHz, handling up to 27 dBm CW input power. Ideal for applications requiring high frequency amplification in temperatures ranging from -40 to 85°C.
ADMV8420ACPZ
Analog Devices' ADMV8420ACPZ is a 24-terminal BAND PASS FILTER with a Center Frequency of 15500 MHz and Input Impedance of 50Ω. Operating b/w -40°C to 85°C, it's ideal for applications requiring precise filtering in electronic systems.
ADPA7005AEHZ-R7
ADPA7005AEHZ-R7 by Analog Devices is a wide band medium power RF amplifier with 12 dB gain, operating from 18-44 GHz. It can handle up to 27 dBm CW input power and operates in temperatures ranging from -40 °C to 85°C. Ideal for applications requiring high frequency amplification in RF & microwave systems.
ADMV8420ACPZ-R5
ADMV8420ACPZ-R5 by Analog Devices is a 24-terminal BAND PASS FILTER with a Center Frequency of 15500 MHz and Input Impedance of 50 OHM. It operates b/w -40 to 85 °C and is ideal for applications requiring precise frequency filtering in electronic circuits.
MAX2606EUT+T
MAX2606EUT+T by Analog Devices is a cellphone IC in small outline package with 6 terminals. Operating temp range -40 to 85°C, peak reflow temp 260°C. Telecom IC for baseband circuits with nominal voltage of 2.75V, ideal for industrial applications.
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;
MAX2606EUT-T
MAX2620EUA+T
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
MAX2620EUA+T by Analog Devices is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
MAX2620EUA-T
MAX2902ETI+
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2029ETP+
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2044ETP+
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2042AETP+
MAX2044ETP+T
MAX20461AATJA/V+
BASEBAND CIRCUIT; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; Terminal Finish: Matte Tin (Sn) - annealed;
MAX2042AETP+T
MAX20461AATJD/V+
BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn) - annealed;
MAX2041ETP+
MAX20461AATJP/V+
BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
MAX2041ETP+T
MAX2021ETX+
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2031ETP+
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