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CC2400-STR1

Texas Instruments

CC2400-STR1 by Texas Instruments

CC2400-STR1 by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include CMOS technology, RF and baseband circuit for telecom applications, and nominal voltage of 1.8V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,634 parts In-Stock

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7,634

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Digiode

USA . 1,227 parts In-Stock

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1,227

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Distributors (Availability)

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Parana Technologies

USA . 1,903 parts In-Stock

1+ parts

$13.050

100+ parts

-

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$13.543

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1,903

$13.050

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$13.543

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DigiPath Technology Company

USA . 578 parts In-Stock

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$14.370

100+ parts

$13.220

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578

$14.370

$13.220

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ChromeModa Solutions

Germany . 1,864 parts In-Stock

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$14.663

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$12.024

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1,864

$14.663

$12.024

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IDEA Electronic Components Group

UK . 1,195 parts In-Stock

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$14.663

100+ parts

$13.930

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$13.197

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1,195

$14.663

$13.930

$13.197

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AZTECH Wire

Italy . 314 parts In-Stock

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$15.339

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314

$15.339

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Native Components

USA . 322 parts In-Stock

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$17.695

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322

$17.695

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Northwest PG Solutions

USA . 1,900 parts In-Stock

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$19.464

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$17.518

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$19.464

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One Stop Electronics

USA . 168 parts In-Stock

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$149.000

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Corphita

USA . 1,442 parts In-Stock

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Overview

Enhance the performance of your cellphone with the CC2400-STR1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Cellphone ICs that guarantee reliability and efficiency. With its surface mount capability and advanced technology, this product offers seamless integration and optimal functionality for various applications. Experience the value and benefits of this innovative solution, from improved signal transmission to enhanced power efficiency. Upgrade your device today and enjoy the advantages of cutting-edge technology with the CC2400-STR1.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto printed circuit boards, saving space and reducing assembly time.

Power Supplies (V): 1.8,1.8/3.3

The availability of multiple power supply options makes this product versatile and compatible with various systems.

No. of Terminals: 48

Having a high number of terminals allows for more connectivity options and functionality.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The chip carrier package style with a very thin profile enables compact and space-saving designs for cellphones.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand extended use and maintain reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in a wide range of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and is more environmentally friendly.

Nominal Supply Voltage: 1.8 V

The 1.8V nominal supply voltage meets the standard power requirements for many modern cellphones.

Technical Specifications

Cellphone ICs CC2400-STR1 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Power Supplies (V):

1.8,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

CC2400-STR1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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