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CC2420

Texas Instruments

CC2420 by Texas Instruments

The Texas Instruments CC2420 is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has power supplies of 1.8V and 3.3V, making it ideal for telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 2,958 parts In-Stock

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Digiode

USA . 2,700 parts In-Stock

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2,700

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First Choice Components Inc.

USA . 26 parts In-Stock

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Prism Electronics

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Native Components

USA . 796 parts In-Stock

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$9.366

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796

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Northwest PG Solutions

USA . 1,710 parts In-Stock

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$10.303

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$9.272

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Parana Technologies

USA . 2,277 parts In-Stock

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$15.626

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$15.996

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$15.626

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$15.996

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ChromeModa Solutions

Germany . 4,880 parts In-Stock

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$17.557

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$14.397

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IDEA Electronic Components Group

UK . 1,639 parts In-Stock

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$17.557

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$16.679

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$15.801

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AZTECH Wire

Italy . 715 parts In-Stock

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$18.065

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715

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One Stop Electronics

USA . 1,397 parts In-Stock

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$224.000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Metaverse IC Inc.

Canada . 3,658 parts In-Stock

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DigiPath Technology Company

USA . 2,236 parts In-Stock

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$15.829

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A-Z Elektronik GmbH

Germany . 1,965 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,310 parts In-Stock

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Corphita

USA . 733 parts In-Stock

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Perfect Parts

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Computer Components Inc. - USA

USA . 5 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the CC2420 by Texas Instruments. Designed to meet the highest standards of quality and reliability, this Cellphone IC is a game-changer in the telecom industry. With its surface mount capability and versatile package style, the CC2420 offers unmatched performance and flexibility for a wide range of applications. Experience seamless connectivity and superior functionality with this innovative product that delivers value, benefits, and advantages like no other. Elevate your projects to new heights with the CC2420 - the ultimate choice for discerning customers seeking excellence.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient assembly processes, saving time and resources.

Package Shape: SQUARE

The square package shape provides a stable and compact design for the IC, optimizing space on the circuit board.

Power Supplies (V): 1.8,1.8/3.3

Multiple power supply options give flexibility in voltage requirements, making it compatible with a variety of systems.

No. of Terminals: 48

Having 48 terminals allows for a high level of connectivity and functionality within the device.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

The chip carrier and heat sink/slug package styles help in dissipating heat efficiently, improving overall performance and longevity.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high temperatures in industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliability in extreme conditions.

Terminal Position: QUAD

Quad terminal position enables secure connections and enhances signal transmission.

Width: 7 mm

The compact width of 7 mm allows for efficient use of space on the circuit board.

Length: 7 mm

The 7 mm length complements the width, providing a square shape for stable placement on the board.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring durability and reliability in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient performance.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and enhances reliability.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuitry in one IC enables seamless communication and signal processing in telecommunications applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting, maximizing connectivity on the circuit board.

Technical Specifications

Cellphone ICs CC2420 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Power Supplies (V):

1.8,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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