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CC2400-RTR1

Texas Instruments

CC2400-RTR1 by Texas Instruments

CC2400-RTR1 by Texas Instruments is a cellphone IC with 48 terminals, operating b/w -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuitry, and low current draw at 0.005mA. Ideal for telecom applications due to its compact square package shape and CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,748 parts In-Stock

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8,748

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Digiode

USA . 4,108 parts In-Stock

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Sensible Micro Corp

USA . 103 parts In-Stock

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103

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Distributors (Availability)

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$1.020

100+ parts

$0.928

1k+ parts

$0.836

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-

2,000

$1.020

$0.928

$0.836

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Corohmni

South Africa . 101 parts In-Stock

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$1.844

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101

$1.844

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Parana Technologies

USA . 2,277 parts In-Stock

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$9.579

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$10.175

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2,277

$9.579

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$10.175

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ChromeModa Solutions

Germany . 3,273 parts In-Stock

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$10.763

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$8.826

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3,273

$10.763

$8.826

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IDEA Electronic Components Group

UK . 422 parts In-Stock

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$10.763

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$10.225

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$9.687

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422

$10.763

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$9.687

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AZTECH Wire

Italy . 724 parts In-Stock

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$19.783

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724

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Component Stockers USA

USA . 354 parts In-Stock

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$99.990

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One Stop Electronics

USA . 819 parts In-Stock

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$784.000

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$784.000

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Alle Elektronik GmbH

Germany . 3,845 parts In-Stock

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Kepictronics

USA . 3,653 parts In-Stock

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Corphita

USA . 1,369 parts In-Stock

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Native Components

USA . 817 parts In-Stock

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$3.521

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DigiPath Technology Company

USA . 603 parts In-Stock

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$9.704

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$9.704

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Northwest PG Solutions

USA . 51 parts In-Stock

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$3.557

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51

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$3.557

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Overview

Unlock seamless connectivity and superior performance with the CC2400-RTR1 by Texas Instruments. Manufactured with precision and expertise, this cellphone IC offers unparalleled reliability and efficiency. Perfect for a wide range of applications in the telecom industry, this advanced technology guarantees optimal results. Experience the value and benefits of cutting-edge innovation with the CC2400-RTR1, delivering a seamless experience like no other.

Feature Benefit Bullets

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on circuit boards, saving time and space.

Package Shape: SQUARE

Square package shape provides stability and easy handling during the assembly process.

Power Supplies (V): 1.8,1.8/3.3

Provides flexibility in power supply options, enabling compatibility with different systems and designs.

No. of Terminals: 48

With a high number of terminals, this IC offers versatile connectivity and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles cater to different installation requirements and thermal management needs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability under extreme conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in diverse environments.

Terminal Position: QUAD

Quad terminal position facilitates efficient signal routing and transmission.

Maximum Seated Height: 1 mm

Low seated height enables compact and slim device designs.

Width: 7 mm

Narrow width saves space on the circuit board and allows for more components to be integrated.

Length: 7 mm

Compact length contributes to overall space-saving design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations.

Maximum Supply Current: 0.005 mA

Low maximum supply current requirement contributes to energy efficiency and reduced power consumption.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit functionality in one IC simplifies design complexity and enhances performance in telecommunications applications.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation of the IC.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging and precise signal routing.

Technical Specifications

Cellphone ICs CC2400-RTR1 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.005 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

CC2400-RTR1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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