Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Analog Devices' MAX5865ETM+ is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, CMOS technology, and a nominal voltage of 3V for telecom applications.
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Perfect Parts
Surface mount technology allows for easier and faster assembly of the product onto a circuit board, saving time and labor costs.
The square package shape helps in efficient use of space on the circuit board, allowing for higher component density and compact design.
Having 48 terminals provides flexibility in connectivity options and allows for multiple functions to be supported within the IC.
With a high maximum operating temperature, the IC can withstand harsher environments and operate reliably in a wide range of conditions.
The low minimum operating temperature ensures the IC can function in cold environments without any performance issues.
The matte tin finish provides good solderability and the annealed form ensures better reliability and durability of the terminals.
CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of other devices, making the IC energy-efficient and versatile.
Operating at a nominal supply voltage of 3V makes the IC suitable for a variety of portable electronic devices and helps in reducing power consumption.
Cellphone ICs MAX5865ETM+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
MAX5865ETM+ Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.
CEO
Vincent Roche
Interim CFO
James Mollica
CAO
Michael Sondel
Limerick Fab
Fabrication
Fab Initiation
1977
Ireland
Limerick
Wafer Capacity
30,000
Hillview Fab
2001
USA
Milpitas
15,000
Wilmington Fab
1967
Wilmington
50,000
Camas Fab
1997
Camas
18,000
Beaverton-Portland
1987
Beaverton
14,000
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
2N2222A
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
2N7002
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
1N4148
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
LL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
OHN3140U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
Silicon Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MBRM140T1G
Onsemi
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
Weitron Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Terminal Finish: TIN LEAD; Maximum Operating Temperature: 150 Cel;
Central Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BAV99
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
Itt Semiconductor
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
BAV99LT1G
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
LMV228TLX
Texas Instruments
LMV228TLX by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature grades from -40 to 85°C and has a nominal voltage of 2.7V. This RF and baseband circuit IC is designed for telecom applications requiring precise performance in compact spaces.
SKY53735-11
Skyworks Solutions
SKY53735-11 by Skyworks Solutions is a cellphone IC with 47 terminals in a rectangular chip carrier package. Operating b/w -30°C to 85°C, it features RF and baseband circuits for telecom applications. With a low profile of 0.7mm, this IC has a terminal pitch of 0.4mm and operates at 1.8V supply voltage.
SI4721-B20-GMR
Silicon Labs
Silicon Labs' SI4721-B20-GMR is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this IC has a compact size of 3x3mm suitable for surface mount designs.
SKY66122-11
SKY66122-11 by Skyworks Solutions is a cellphone IC with 36 terminals in a square chip carrier package. Operating b/w -40°C to 85°C, it integrates RF and baseband circuits at 3.3V supply voltage. With a compact size of 6x6mm and terminal pitch of 0.5mm, it's ideal for telecom applications requiring high performance in a small form factor.
SI4721-B20-GM
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
ADF7020BCP
Analog Devices
Analog Devices' ADF7020BCP is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The chip carrier package style with a square shape makes it suitable for industrial temperature-grade applications.
CC1021-RTR1
CC1021-RTR1 by Texas Instruments is a cellphone IC with 32 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it features RF and baseband circuit technology, CMOS design, and a 3V supply voltage. Ideal for telecom applications requiring compact size and high performance.
MAX2309ETI+
MAX2309ETI+ by Analog Devices is a cellphone IC with 28 terminals in a square package. It operates at -40 to 85°C, with power supplies of 3/3.3V and max supply current of 0.0415mA. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and is suitable for industrial temperature grades.
TLV320AC57IPT
TLV320AC57IPT by Texas Instruments is a 48-terminal cellphone IC with 3V supply voltage, operating from -40 to 85°C. It features A-LAW companding law, 13-bit linear coding, and a baseband circuit for telecom applications. The package is a low-profile flatpack with gull wing terminals, suitable for industrial temperature grades.
ADRF5547BCPZN-RL
Analog Devices' ADRF5547BCPZN-RL is a 40-terminal cellphone IC with a square package shape and chip carrier style. It operates b/w -40 to 105 °C, suitable for industrial telecom applications requiring RF front end circuits. With a nominal voltage of 5V, it features a terminal pitch of 0.5mm and can withstand peak reflow temperature of 260°C for up to 30 seconds.
SI4711-B30-GM
SI4711-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -20 to 85°C. It features RF and baseband circuit technology, suitable for cellphone applications.
CC2511F8RSPRG3
CC2511F8RSPRG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology features a terminal pitch of 0.5mm, making it suitable for industrial telecom applications.
TRF37T05IRGET
TRF37T05IRGET by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Telecom IC type for RF and baseband circuits, with nominal voltage of 3.3V.
TCM320AC57DW
Texas Instruments TCM320AC57DW is a cellphone IC with 20 terminals, operating from -40 to 85°C. It features GULL WING terminals, 5V supply voltage, and is ideal for BASEBAND CIRCUIT applications in the telecom industry.
AD6688BBPZRL-3000
AD6688BBPZRL-3000 by Analog Devices is a CELLPHONE IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for INDUSTRIAL telecom applications. Features include 0.975V supply voltage, RF and baseband circuitry, and low profile design for compact devices.
LMV228URX/NOPB
RF AND BASEBAND CIRCUIT; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;
SARA-R500S-61B
U-blox Ag
RF AND BASEBAND CIRCUIT;
AD6635XBC
AD6635XBC by Analog Devices is a Cellphone IC with 324 terminals in a GRID ARRAY package. Operating temperature ranges from -40 to 70 °C, with power supplies of 2.5V and 3.3V. This CMOS technology BASEBAND CIRCUIT is ideal for cellphone applications due to its compact SQUARE shape and BALL terminal form.
CC1000YZ
CC1000YZ by Texas Instruments is a cellphone IC with 28 terminals in a rectangular grid array package. Operating at temperatures from -40 to 85°C, it features CMOS technology and RF/baseband circuitry for telecom applications. With a thin profile of 0.652mm, it supports power supplies of 2.5/3.3V for industrial-grade performance.
HMC420QS16E
Analog Devices' HMC420QS16E is a 16-terminal cellphone IC with a small outline, shrink pitch package. It operates in industrial temperature range (-40 to 85°C) and has matte tin terminal finish. Ideal for RF and baseband circuits in telecom applications with a nominal voltage of 5V.
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ADN4693E-1BCPZ
ADN4693E-1BCPZ by Analog Devices is a Line Driver & Receiver with 16 terminals, operating at 3.3V nominal voltage. It features a max transmit delay of 2.4ns and differential output for EIA/TIA-899 interface standard applications in industrial settings.
ADPA7005AEHZ-R7
ADPA7005AEHZ-R7 by Analog Devices is a wide band medium power RF amplifier with 12 dB gain, operating from 18-44 GHz. It can handle up to 27 dBm CW input power and operates in temperatures ranging from -40 °C to 85°C. Ideal for applications requiring high frequency amplification in RF & microwave systems.
ADMV8420ACPZ-R5
ADMV8420ACPZ-R5 by Analog Devices is a 24-terminal BAND PASS FILTER with a Center Frequency of 15500 MHz and Input Impedance of 50 OHM. It operates b/w -40 to 85 °C and is ideal for applications requiring precise frequency filtering in electronic circuits.
ADMV8420ACPZ
Analog Devices' ADMV8420ACPZ is a 24-terminal BAND PASS FILTER with a Center Frequency of 15500 MHz and Input Impedance of 50Ω. Operating b/w -40°C to 85°C, it's ideal for applications requiring precise filtering in electronic systems.
AD3542RBCPZ16
AD3542RBCPZ16 by Analog Devices is a 16-bit D/A converter with max analog output voltage of 7.5V and linearity error of 0.006103%. It features a nominal settling time of 0.1us, making it ideal for applications requiring precise analog signal generation in temperature-sensitive environments. With a compact square package shape and surface mount capability, this chip carrier is suitable for space-constrained designs where high performance is essential.
ADPA7005AEHZ
ADPA7005AEHZ by Analog Devices is a wide band medium power RF amplifier with 12 dB gain. It operates b/w 18-44 GHz, handling up to 27 dBm CW input power. Ideal for applications requiring high frequency amplification in temperatures ranging from -40 to 85°C.
ADPA7005CHIP
ADPA7005CHIP by Analog Devices is a wide band medium power RF amplifier with 11.5 dB gain, operating from 20-44 GHz. It can handle up to 27 dBm CW input power and operates in temperatures ranging from -55 °C to 85°C. Ideal for applications requiring high frequency amplification in RF & microwave systems.
AD3542RBCPZ16-RL7
AD3542RBCPZ16-RL7 by Analog Devices is a 16-bit D/A converter with max analog output voltage of 7.5V, 0.006103% linearity error, and 0.1us settling time. Ideal for applications requiring precise analog signal generation in temperature-sensitive environments.
ADAQ23876BBCZ
Analog Devices' ADAQ23876BBCZ is a 16-bit ADC with 0.00125% EL, 15 MHz sample rate, and 2'S COMPLEMENT BINARY output. Ideal for wireless data acquisition applications due to its compact GRID ARRAY package and fast 0.063 us conversion time. Operating from -40 to 85 °C, it offers precise analog-to-digital conversion in a small form factor.
ADN4693E-1BCPZ-RL7
ADN4693E-1BCPZ-RL7 by Analog Devices is a Line Driver & Receiver with 16 terminals, operating at 3.3V. It offers a max transmit delay of 2.4ns and max supply current of 24mA. Ideal for applications requiring differential output and EIA/TIA interface standards compliance in tight spaces due to its very thin profile chip carrier package style.
MAX5865ETM-T
Maxim Integrated
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
MAX5865ETM+T
MAX5865ETM+
MAX5865ETM
MAX5865E/D
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED;
MAX5864E/D
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; JESD-30 Code: X-XUUC-N;
MAX5866ETM+
MAX5866ETM+T
MAX5863E/D
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Technology: CMOS;
MAX5864ETM+
MAX5863ETM+T
MAX5864ETM+T
MAX5863ETM
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES;
MAX5864ETM
MAX5863ETM-T
Supply Digital Components
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