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LMH6523SQE/NOPB

Texas Instruments

LMH6523SQE/NOPB by Texas Instruments

Texas Instruments LMH6523SQE/NOPB is a 54-terminal cellphone IC with 4 channels, RF and baseband circuit type. It operates b/w -40 to 85°C, with a gain tolerance of 25.74 dB. Suitable for telecom applications due to its compact rectangular chip carrier package style.

Median Price

$17.857

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 440 parts In-Stock

1+ parts

$17.857

100+ parts

$15.598

1k+ parts

$10.757

10k+ parts

-

440

$17.857

$15.598

$10.757

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,975 parts In-Stock

1+ parts

$16.964

100+ parts

-

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-

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4,975

$16.964

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Vyrian

USA . 4,804 parts In-Stock

1+ parts

-

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4,804

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 913 parts In-Stock

1+ parts

$9.490

100+ parts

-

1k+ parts

-

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913

$9.490

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-

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Parana Technologies

USA . 2,338 parts In-Stock

1+ parts

$11.604

100+ parts

-

1k+ parts

$12.001

10k+ parts

-

2,338

$11.604

-

$12.001

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DigiPath Technology Company

USA . 148 parts In-Stock

1+ parts

$12.777

100+ parts

$11.755

1k+ parts

-

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148

$12.777

$11.755

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ChromeModa Solutions

Germany . 4,571 parts In-Stock

1+ parts

$13.038

100+ parts

$10.691

1k+ parts

-

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4,571

$13.038

$10.691

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IDEA Electronic Components Group

UK . 1,507 parts In-Stock

1+ parts

$13.038

100+ parts

$12.386

1k+ parts

$11.734

10k+ parts

-

1,507

$13.038

$12.386

$11.734

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Ampacity Inc.

Singapore . 11 parts In-Stock

1+ parts

$15.180

100+ parts

-

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-

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11

$15.180

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-

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Corphita

USA . 4,806 parts In-Stock

1+ parts

$16.071

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4,806

$16.071

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Corohmni

South Africa . 78 parts In-Stock

1+ parts

$17.857

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78

$17.857

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Semicontronic

India . 361 parts In-Stock

1+ parts

$33.040

100+ parts

$32.214

1k+ parts

$32.049

10k+ parts

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361

$33.040

$32.214

$32.049

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Microchip USA

USA . 2,015 parts In-Stock

1+ parts

$44.110

100+ parts

$43.480

1k+ parts

$43.160

10k+ parts

$42.850

2,015

$44.110

$43.480

$43.160

$42.850

QUARKTWIN TECHNOLOGY LTD

USA . 7,608 parts In-Stock

1+ parts

-

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7,608

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Component Stockers USA

USA . 2,107 parts In-Stock

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2,107

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Overview

Elevate your cellphone performance with the LMH6523SQE/NOPB by Texas Instruments. Known for its top-notch quality and reliability, Texas Instruments sets the standard in manufacturing cutting-edge Cellphone ICs. This innovative product offers unparalleled value, delivering seamless connectivity and enhanced functionality for your mobile devices. With a sleek rectangular package shape and a maximum operating temperature of 85°C, this RF and baseband circuit is perfect for a wide range of telecom applications. Experience the difference with Texas Instruments and take your cellphone experience to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost in production.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor that is easy to handle and integrate into various designs.

No. of Terminals: 54

Having a high number of terminals allows for more connectivity options and functionality within the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding environmental conditions and maintain performance.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation even in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and conductivity, ensuring a reliable connection to the circuit board.

Maximum Seated Height: 0.8 mm

Low seated height allows for compact and thin designs, ideal for space-constrained applications.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuitry in one IC simplifies the design and reduces the number of components needed in a cellular device.

Technical Specifications

Cellphone ICs LMH6523SQE/NOPB attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Maximum Gain Tolerance:

25.74 dB

JESD-30 Code:

R-XQCC-N54

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current:

485 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.5 mm

Trade Compliance

LMH6523SQE/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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