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CC1101IRHBRG4Q1

Texas Instruments

CC1101IRHBRG4Q1 by Texas Instruments

CC1101IRHBRG4Q1 by Texas Instruments is a cellphone IC with 32 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and AEC-Q100 screening for industrial applications. The package is square-shaped, measures 5x5mm, and has a terminal pitch of 0.5mm for surface mounting.

Median Price

$3.370

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,540 parts In-Stock

1+ parts

$3.370

100+ parts

$3.300

1k+ parts

$3.240

10k+ parts

-

1,540

$3.370

$3.300

$3.240

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,488

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-

-

-

Digiode

USA . 660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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660

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 246 parts In-Stock

1+ parts

$0.282

100+ parts

-

1k+ parts

-

10k+ parts

$0.271

246

$0.282

-

-

$0.271

Northwest PG Solutions

USA . 1,413 parts In-Stock

1+ parts

$0.311

100+ parts

-

1k+ parts

-

10k+ parts

$0.274

1,413

$0.311

-

-

$0.274

AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$5.973

100+ parts

-

1k+ parts

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520

$5.973

-

-

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Parana Technologies

USA . 641 parts In-Stock

1+ parts

$6.800

100+ parts

-

1k+ parts

$7.448

10k+ parts

-

641

$6.800

-

$7.448

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DigiPath Technology Company

USA . 655 parts In-Stock

1+ parts

$7.488

100+ parts

-

1k+ parts

-

10k+ parts

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655

$7.488

-

-

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ChromeModa Solutions

Germany . 1,979 parts In-Stock

1+ parts

$7.641

100+ parts

$6.266

1k+ parts

-

10k+ parts

-

1,979

$7.641

$6.266

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IDEA Electronic Components Group

UK . 1,312 parts In-Stock

1+ parts

$7.641

100+ parts

-

1k+ parts

$6.877

10k+ parts

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1,312

$7.641

-

$6.877

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One Stop Electronics

USA . 1,293 parts In-Stock

1+ parts

$298.000

100+ parts

-

1k+ parts

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10k+ parts

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1,293

$298.000

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Semicontronic

India . 264 parts In-Stock

1+ parts

$915.000

100+ parts

$892.125

1k+ parts

$887.550

10k+ parts

-

264

$915.000

$892.125

$887.550

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Corphita

USA . 3,293 parts In-Stock

1+ parts

-

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3,293

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Corohmni

South Africa . 460 parts In-Stock

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460

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Overview

Discover the cutting-edge CC1101IRHBRG4Q1 by Texas Instruments, a top-of-the-line Cellphone IC designed for superior performance and reliability. With a reputation for excellence, Texas Instruments delivers unmatched quality in telecommunications technology. This innovative RF and baseband circuit offers seamless integration and high-speed connectivity, making it ideal for a wide range of applications. Elevate your projects with the CC1101IRHBRG4Q1 and experience the benefits of advanced engineering and precision design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and cost-effective, making the product suitable for mobile devices where weight and cost are important factors.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and quality standards, making the product suitable for automotive and industrial applications.

Power Supplies (V): 1.8/3.6

Support for multiple power supply voltages allows for flexibility in integrating the IC into various devices.

Package Shape: SQUARE

Square package shape enables efficient use of board space and facilitates easy integration into the overall system design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating environments with wide temperature fluctuations.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuits in a single IC simplifies design complexity and reduces overall system cost.

Nominal Supply Voltage: 3 V

The 3V supply voltage is a common standard in mobile devices, ensuring compatibility and ease of integration.

Technical Specifications

Cellphone ICs CC1101IRHBRG4Q1 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CC1101IRHBRG4Q1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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