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CC1070-RTY1

Texas Instruments

CC1070-RTY1 by Texas Instruments

CC1070-RTY1 by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 105°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This square-shaped chip carrier is surface-mountable with a very thin profile, ideal for industrial telecom applications.

Median Price

$6.300

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 107 parts In-Stock

1+ parts

-

100+ parts

$5.040

1k+ parts

$4.510

10k+ parts

$4.240

107

-

$5.040

$4.510

$4.240

DigiKey

USA . 107 parts In-Stock

1+ parts

-

100+ parts

$6.630

1k+ parts

-

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-

107

-

$6.630

-

-

Verical

USA . 107 parts In-Stock

1+ parts

-

100+ parts

$6.300

1k+ parts

$5.638

10k+ parts

$5.300

107

-

$6.300

$5.638

$5.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 742 parts In-Stock

1+ parts

$4.588

100+ parts

-

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-

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742

$4.588

-

-

-

Vyrian

USA . 9,792 parts In-Stock

1+ parts

-

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9,792

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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3

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Distributors (Availability)

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Native Components

USA . 850 parts In-Stock

1+ parts

$0.493

100+ parts

-

1k+ parts

-

10k+ parts

$0.473

850

$0.493

-

-

$0.473

Northwest PG Solutions

USA . 1,794 parts In-Stock

1+ parts

$0.542

100+ parts

-

1k+ parts

-

10k+ parts

$0.478

1,794

$0.542

-

-

$0.478

Corphita

USA . 3,751 parts In-Stock

1+ parts

$4.347

100+ parts

-

1k+ parts

-

10k+ parts

-

3,751

$4.347

-

-

-

Component Stockers USA

USA . 113 parts In-Stock

1+ parts

$4.900

100+ parts

$4.600

1k+ parts

-

10k+ parts

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113

$4.900

$4.600

-

-

Parana Technologies

USA . 1,789 parts In-Stock

1+ parts

$12.678

100+ parts

-

1k+ parts

$13.141

10k+ parts

-

1,789

$12.678

-

$13.141

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DigiPath Technology Company

USA . 1,063 parts In-Stock

1+ parts

$13.960

100+ parts

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1,063

$13.960

-

-

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ChromeModa Solutions

Germany . 1,336 parts In-Stock

1+ parts

$14.245

100+ parts

$11.681

1k+ parts

-

10k+ parts

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1,336

$14.245

$11.681

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IDEA Electronic Components Group

UK . 237 parts In-Stock

1+ parts

$14.245

100+ parts

$13.533

1k+ parts

$12.820

10k+ parts

-

237

$14.245

$13.533

$12.820

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A-Z Elektronik GmbH

Germany . 6,534 parts In-Stock

1+ parts

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6,534

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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5,000

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Alle Elektronik GmbH

Germany . 4,356 parts In-Stock

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4,356

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Perfect Parts

USA . 7 parts In-Stock

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7

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Cyclops Electronics Ltd (Excess)

UK . 3 parts In-Stock

1+ parts

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3

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Overview

Upgrade your cellphone's performance with the CC1070-RTY1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their Cellphone ICs. Perfect for various applications, this product offers unmatched value and benefits to customers. Experience seamless connectivity and enhanced functionality with the CC1070-RTY1, designed to meet all your communication needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and costs in production.

Package Shape: SQUARE

The square shape of the package provides a compact and efficient design, optimizing space on the circuit board.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows for flexibility in design and compatibility with different systems.

No. of Terminals: 20

Having a higher number of terminals enables more connectivity options and functions within the IC.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The diverse package styles offer versatility in application and cooling options, making it suitable for a range of environments and conditions.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the IC can withstand and perform well in demanding conditions without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the IC remains functional even in extremely cold environments.

Terminal Position: QUAD

The quad terminal position allows for efficient signal routing and connectivity, contributing to overall performance.

Maximum Seated Height: 1 mm

The low seated height profile contributes to a compact and slim form factor, ideal for space-constrained applications.

Width: 5 mm

The narrow width of the IC makes it suitable for compact device designs while maintaining functionality.

Length: 5 mm

The short length of the IC further adds to its compact and space-saving design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh industrial environments where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the IC energy-efficient and responsive.

Terminal Form: NO LEAD

The no lead terminal form contributes to increased reliability and durability, as well as compatibility with lead-free manufacturing processes.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Support for both RF and baseband circuits makes the IC versatile and suitable for various telecommunications applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is a common standard, ensuring compatibility with existing systems and components.

Terminal Pitch: 0.65 mm

The narrow terminal pitch allows for high density integration on the circuit board, enabling more functionality in a limited space.

Technical Specifications

Cellphone ICs CC1070-RTY1 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Length:

5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.20SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

CC1070-RTY1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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