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AD6655ABCPZRL7-150

Analog Devices

AD6655ABCPZRL7-150 by Analog Devices

AD6655ABCPZRL7-150 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85 °C. It has a supply voltage of 1.8V and consumes 0.805mA current. This BASEBAND CIRCUIT IC comes in a SQUARE package style, suitable for telecom applications.

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1k+

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Vyrian

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Digiode

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Parana Technologies

USA . 1,032 parts In-Stock

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$5.960

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$5.543

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IDEA Electronic Components Group

UK . 650 parts In-Stock

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$6.409

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$6.089

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AZTECH Wire

Italy . 848 parts In-Stock

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DigiPath Technology Company

USA . 445 parts In-Stock

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$9.598

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Semicontronic

India . 893 parts In-Stock

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$697.000

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$679.575

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$676.090

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One Stop Electronics

USA . 1,636 parts In-Stock

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Corphita

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Northwest PG Solutions

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Overview

Revolutionize your cellphone technology with the AD6655ABCPZRL7-150 by Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers exceptional performance in the Cellphone ICs category. This surface mount package offers a square shape, 64 terminals, and a nominal supply voltage of 1.8V. With industrial-grade temperature tolerance and advanced baseband circuit design, this product is perfect for enhancing your mobile device capabilities. Upgrade to Analog Devices and experience the value and benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a PCB, saving time and reducing production costs.

Package Shape: SQUARE

The square package shape can help optimize space on the PCB and ensure efficient use of available board real estate.

Power Supplies (V): 1.8

Operating at a low supply voltage of 1.8V can result in reduced power consumption and improved energy efficiency of the device.

No. of Terminals: 64

Having 64 terminals allows for multiple connection points, enabling the IC to perform complex functions and interface with various components.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC can withstand high temperature environments, providing reliability and optimal performance.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40 °C ensures the IC's functionality in cold conditions, making it suitable for a wide range of applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and conductivity, enhancing the reliability of the IC's connections and overall performance.

Terminal Position: QUAD

Having a quad terminal position allows for secure and stable connections, reducing the risk of signal loss or interference.

Width: 9 mm

The compact width of 9mm makes the IC suitable for space-constrained applications, enabling versatile integration into various devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow temperature time of 30 seconds ensures quick and efficient assembly during production, improving turnaround time and reducing manufacturing costs.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the IC can withstand high-temperature soldering processes without compromising its performance or reliability.

Length: 9 mm

The compact length of 9mm further contributes to the IC's space-saving design, allowing for flexible placement on the PCB.

Temperature Grade: INDUSTRIAL

Having an industrial temperature grade means the IC is rugged and reliable, capable of operating in harsh environmental conditions typically found in industrial settings.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination, making the IC environmentally friendly and compliant with RoHS regulations.

Maximum Supply Current: 0.805 mA

With a maximum supply current of 0.805mA, the IC consumes low power, contributing to energy efficiency and longer battery life in mobile devices.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit IC type indicates that the product is optimized for telecommunications applications, offering reliable signal processing and connectivity capabilities.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V ensures compatibility with a wide range of devices and power sources, enhancing the IC's versatility.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm allows for fine-pitch connections, enabling high-density integration and precise signal routing, essential for complex circuit designs.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the IC can withstand moderate exposure to moisture during handling and assembly, ensuring long-term reliability.

Technical Specifications

Cellphone ICs AD6655ABCPZRL7-150 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.805 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

AD6655ABCPZRL7-150 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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