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AD6642BBCZ

Analog Devices

AD6642BBCZ by Analog Devices

AD6642BBCZ by Analog Devices is a cellphone IC with 144 terminals in a square package. It operates at temperatures from -40 to 85 °C, with a supply voltage of 1.8V. This RF and baseband circuit technology has low profile grid array packaging for industrial applications.

Median Price

$116.660

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,347 parts In-Stock

1+ parts

-

100+ parts

$116.660

1k+ parts

$104.380

10k+ parts

$98.240

3,347

-

$116.660

$104.380

$98.240

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 303 parts In-Stock

1+ parts

$115.368

100+ parts

-

1k+ parts

-

10k+ parts

-

303

$115.368

-

-

-

Vyrian

USA . 160 parts In-Stock

1+ parts

$121.440

100+ parts

-

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-

10k+ parts

-

160

$121.440

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,846 parts In-Stock

1+ parts

$16.312

100+ parts

-

1k+ parts

$15.170

10k+ parts

-

1,846

$16.312

-

$15.170

-

IDEA Electronic Components Group

UK . 751 parts In-Stock

1+ parts

$17.540

100+ parts

$16.663

1k+ parts

$16.663

10k+ parts

-

751

$17.540

$16.663

$16.663

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DigiPath Technology Company

USA . 197 parts In-Stock

1+ parts

$27.362

100+ parts

$26.268

1k+ parts

-

10k+ parts

$26.268

197

$27.362

$26.268

-

$26.268

Native Components

USA . 430 parts In-Stock

1+ parts

$84.007

100+ parts

-

1k+ parts

-

10k+ parts

$80.647

430

$84.007

-

-

$80.647

Northwest PG Solutions

USA . 856 parts In-Stock

1+ parts

$92.408

100+ parts

-

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856

$92.408

-

-

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Semicontronic

India . 3,030 parts In-Stock

1+ parts

$103.220

100+ parts

$100.640

1k+ parts

$100.123

10k+ parts

-

3,030

$103.220

$100.640

$100.123

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Corphita

USA . 880 parts In-Stock

1+ parts

$109.296

100+ parts

-

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880

$109.296

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-

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RC Electronics

USA . 593 parts In-Stock

1+ parts

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593

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Kepictronics

USA . 500 parts In-Stock

1+ parts

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500

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A-Z Elektronik GmbH

Germany . 207 parts In-Stock

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207

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Overview

Elevate your cellphone technology with the AD6642BBCZ by Analog Devices. This cutting-edge Cellphone IC offers unparalleled quality and reliability, backed by a trusted manufacturer in the industry. With applications ranging from RF to baseband circuits, this innovative product provides customers with superior performance and efficiency. Experience the value of seamless connectivity and enhanced functionality with the AD6642BBCZ, setting new standards in mobile device technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the IC, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Power Supplies (V): 1.8

Operating at a low voltage of 1.8V helps in reducing power consumption and improving energy efficiency.

No. of Terminals: 144

Having a high number of terminals allows for connectivity with multiple other devices, enabling versatile functionality.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC can function reliably even under demanding environmental conditions.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the IC can withstand harsh temperature variations encountered in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable for various applications.

Terminal Pitch: 0.8 mm

Having a small terminal pitch of 0.8mm allows for compact design and efficient use of PCB space.

Technical Specifications

Cellphone ICs AD6642BBCZ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.291 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

AD6642BBCZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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