Loading...

CC1111F16RSPG3

Texas Instruments

CC1111F16RSPG3 by Texas Instruments

CC1111F16RSPG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. Operating b/w 0-85°C, it has a supply voltage of 3V and uses CMOS technology for RF and baseband circuits. Ideal for telecom applications due to its nickel palladium gold terminal finish and moisture sensitivity level of 3.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,059 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,059

-

-

-

-

Digiode

USA . 3,222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,222

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 785 parts In-Stock

1+ parts

$9.067

100+ parts

-

1k+ parts

-

10k+ parts

-

785

$9.067

-

-

-

Parana Technologies

USA . 2,075 parts In-Stock

1+ parts

$15.213

100+ parts

-

1k+ parts

$15.612

10k+ parts

-

2,075

$15.213

-

$15.612

-

DigiPath Technology Company

USA . 2,015 parts In-Stock

1+ parts

$16.751

100+ parts

$15.411

1k+ parts

-

10k+ parts

-

2,015

$16.751

$15.411

-

-

ChromeModa Solutions

Germany . 6,579 parts In-Stock

1+ parts

$17.093

100+ parts

$14.016

1k+ parts

-

10k+ parts

-

6,579

$17.093

$14.016

-

-

IDEA Electronic Components Group

UK . 778 parts In-Stock

1+ parts

$17.093

100+ parts

$16.238

1k+ parts

$15.384

10k+ parts

-

778

$17.093

$16.238

$15.384

-

Native Components

USA . 775 parts In-Stock

1+ parts

$17.095

100+ parts

-

1k+ parts

-

10k+ parts

-

775

$17.095

-

-

-

Northwest PG Solutions

USA . 867 parts In-Stock

1+ parts

$18.804

100+ parts

$16.924

1k+ parts

-

10k+ parts

-

867

$18.804

$16.924

-

-

One Stop Electronics

USA . 213 parts In-Stock

1+ parts

$543.000

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$543.000

-

-

-

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,790

-

-

-

-

Corphita

USA . 1,316 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,316

-

-

-

-

Overview

Enhance the performance of your cellphone with the CC1111F16RSPG3 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge Cellphone ICs that are essential for seamless communication and connectivity. This versatile chip carrier package offers customers unparalleled value and benefits, providing a smooth and efficient user experience. Upgrade your device today and experience the advantages of advanced RF and baseband circuit technology without compromising on quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the IC, making it reliable for long-term use.

Surface Mount: YES

Being surface mount allows for easy and efficient installation onto circuit boards, saving time and effort during manufacturing processes.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand harsh environmental conditions without compromising its performance.

Technology: CMOS

The CMOS technology used in this IC ensures low power consumption while maintaining high performance, making it energy-efficient and cost-effective.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is standard and widely compatible with various devices, maximizing the versatility of this IC.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that this IC can withstand moderate exposure to moisture during handling and storage, reducing the risk of damage.

Technical Specifications

Cellphone ICs CC1111F16RSPG3 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

CC1111F16RSPG3 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20