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CC1101RTKR

Texas Instruments

CC1101RTKR by Texas Instruments

CC1101RTKR by Texas Instruments is a cellphone IC with power supplies of 1.8/3.6V, operating temperature range of -40 to 85°C, and RF & baseband circuit type. Its package style is chip carrier with very thin profile, suitable for industrial telecom applications due to its nickel palladium gold terminal finish and moisture sensitivity level of 3 MSL.

Median Price

$4.900

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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Forefront Electronics and Design

USA . 10 parts In-Stock

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$4.900

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Vyrian

USA . 9,344 parts In-Stock

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Dark Horse Electronics

USA . 2,841 parts In-Stock

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Digiode

USA . 1,327 parts In-Stock

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Rebound Electronics

UK . 557 parts In-Stock

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Lantek

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LIBRA Elektronik GmbH

Germany . 356 parts In-Stock

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Holdelec - ElecDif-Pro

France . 288 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Cyclops Electronics Ltd

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ComSIT Distribution GmbH

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ComSIT USA

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Odi Ramu Company

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Bristol Electronics

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Speed Components Ltd

Israel . 6 parts In-Stock

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Prism Electronics

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LittleDiode

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AZTECH Wire

Italy . 450 parts In-Stock

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$5.769

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$5.769

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Parana Technologies

USA . 2,227 parts In-Stock

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$15.686

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$16.056

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$15.686

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DigiPath Technology Company

USA . 1,993 parts In-Stock

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$17.272

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$15.891

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ChromeModa Solutions

Germany . 3,429 parts In-Stock

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$17.625

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$14.452

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IDEA Electronic Components Group

UK . 2,255 parts In-Stock

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$17.625

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$16.744

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$15.862

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One Stop Electronics

USA . 1,179 parts In-Stock

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$102.000

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Legend Electronics Inc. (Excess)

USA . 630,000 parts In-Stock

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Kepictronics

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Metaverse IC Inc.

Canada . 21,475 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

USA . 10,012 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,568 parts In-Stock

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GreenTree Electronics

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XScomponents

USA . 4,500 parts In-Stock

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Glotronic Ltd.

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Authorized Procurement Solutions

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Perfect Parts

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Corphita

USA . 2,376 parts In-Stock

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Northwest PG Solutions

USA . 1,724 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,316 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Native Components

USA . 845 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 199 parts In-Stock

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Overview

Elevate your cellphone technology with the CC1101RTKR by Texas Instruments. This cutting-edge RF and baseband circuit offers unparalleled quality and reliability, thanks to its industry-leading manufacturer. With a wide range of applications in the telecommunications sector, this product provides customers with exceptional value through its advanced features and high-performance capabilities. Upgrade your devices today with the CC1101RTKR and experience the difference in communication technology.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and provides good protection for the IC, ensuring a longer lifespan.

Surface Mount : YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Power Supplies (V) : 1.8/3.6

Supports a wide range of power supplies, making it versatile and compatible with various systems.

Package Style (Meter) : CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The compact and thin profile of the package style allows for more efficient use of space on the circuit board.

Maximum Operating Temperature : 85 °C

Can operate effectively in high temperature environments, ensuring reliable performance under varying conditions.

Terminal Finish : NICKEL PALLADIUM GOLD

Nickel, palladium, and gold finish provides excellent conductivity and corrosion resistance, ensuring a strong and durable connection.

Nominal Supply Voltage : 3 V

The 3V supply voltage is commonly used in cellphone applications, making it a suitable choice for this specific purpose.

Temperature Grade : INDUSTRIAL

Designed to meet industrial temperature requirements, making it suitable for use in harsh environments and industrial applications.

Technical Specifications

Cellphone ICs CC1101RTKR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

Maximum Seated Height:

.95 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

CC1101RTKR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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