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BGA713N7E6327XTSA1

Infineon Technologies

BGA713N7E6327XTSA1 by Infineon Technologies

BGA713N7E6327XTSA1 by Infineon Technologies is a cellphone IC with 6 terminals in a small outline package. It operates b/w -30°C to 85°C, suitable for RF and baseband circuits. With a nominal voltage of 2.8V, it features tin terminal finish and measures 1.3mm in width and 2mm in length.

Median Price

$0.562

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,498 parts In-Stock

1+ parts

-

100+ parts

$0.551

1k+ parts

$0.457

10k+ parts

$0.408

7,498

-

$0.551

$0.457

$0.408

Verical

USA . 7,498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.572

10k+ parts

$0.509

7,498

-

-

$0.572

$0.509

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 619 parts In-Stock

1+ parts

$0.429

100+ parts

-

1k+ parts

-

10k+ parts

-

619

$0.429

-

-

-

Nova Conductors

Japan . 36 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

-

10k+ parts

-

36

$0.569

-

-

-

Vyrian

USA . 5,459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,459

-

-

-

-

VNN

France . 628 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

628

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,255 parts In-Stock

1+ parts

$0.384

100+ parts

-

1k+ parts

-

10k+ parts

-

7,255

$0.384

-

-

-

Corphita

USA . 587 parts In-Stock

1+ parts

$0.407

100+ parts

-

1k+ parts

-

10k+ parts

-

587

$0.407

-

-

-

Component Stockers USA

USA . 7,567 parts In-Stock

1+ parts

$0.460

100+ parts

$0.430

1k+ parts

$0.390

10k+ parts

-

7,567

$0.460

$0.430

$0.390

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.558

100+ parts

-

1k+ parts

$0.535

10k+ parts

-

50

$0.558

-

$0.535

-

Argo Parts USA

USA . 2,514 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

-

10k+ parts

$0.552

2,514

$0.569

-

-

$0.552

Continental Prestige Electronics

USA . 1,845 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

-

10k+ parts

$0.558

1,845

$0.569

-

-

$0.558

Modulus Dynamics

Lithuania . 4,568 parts In-Stock

1+ parts

$6.397

100+ parts

$6.141

1k+ parts

$5.885

10k+ parts

-

4,568

$6.397

$6.141

$5.885

-

Corohmni

South Africa . 141 parts In-Stock

1+ parts

$10.878

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$10.878

-

-

-

Aztec Data Supply Inc.

USA . 558 parts In-Stock

1+ parts

$13.390

100+ parts

-

1k+ parts

-

10k+ parts

-

558

$13.390

-

-

-

AZTECH Wire

Italy . 251 parts In-Stock

1+ parts

$13.610

100+ parts

-

1k+ parts

-

10k+ parts

-

251

$13.610

-

-

-

Overview

Elevate your cellphone performance with the BGA713N7E6327XTSA1 by Infineon Technologies. Crafted with precision and expertise, this Cellphone IC offers reliable connectivity and seamless communication, making it an essential component for your device. With a package body material of PLASTIC/EPOXY and a compact rectangular shape, this IC is designed for maximum efficiency and durability. Whether you're browsing the web or making calls, this product ensures top-notch performance. Upgrade your cellphone experience today with the BGA713N7E6327XTSA1 and enjoy the unmatched quality and value it brings to your daily life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components.

Surface Mount: YES

Easy to install and perfect for compact electronic devices.

Package Shape: RECTANGULAR

Compact shape allows for efficient use of space on circuit boards.

No. of Terminals: 6

Provides ample connectivity options for different functions and features.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This design minimizes space requirements and allows for better heat dissipation.

Maximum Operating Temperature: 85 °C

Can operate in a wide range of temperatures, suitable for various applications.

Minimum Operating Temperature: -30 °C

Can withstand cold temperatures, ideal for outdoor or harsh environments.

Terminal Finish: TIN

Offers good conductivity and corrosion resistance.

Terminal Position: DUAL

Provides redundancy and ensures reliable connections.

Maximum Seated Height: 0.4 mm

Low profile design is suitable for slim devices.

Width: 1.3 mm

Compact size allows for easy integration into small electronics.

Length: 2 mm

Takes up minimal space on the circuit board.

Terminal Form: NO LEAD

Environmentally friendly and safe for use.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Suitable for wireless communication devices.

Nominal Supply Voltage: 2.8 V

Compatible with common power sources, making it versatile.

Terminal Pitch: 0.5 mm

Allows for close spacing of terminals, maximizing connectivity options.

Technical Specifications

Cellphone ICs BGA713N7E6327XTSA1 attributes and parameters. Explore more Cellphone ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.3 mm

Trade Compliance

BGA713N7E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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