Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
Median Price
$2.678
Lifecycle Status
Suppliers In-Stock
6
In-Stock Inventory
1k+
Chip1Stop
1+ parts
$3.180
100+ parts
$1.790
1k+ parts
$1.610
10k+ parts
-
Verical
$2.175
$1.962
Digiode
$3.021
Vyrian
Flip Electronics
Anansix
Northwest PG Solutions
$2.455
Corphita
$2.862
Component Stockers USA
$3.140
AZTECH Wire
$20.280
QUARKTWIN TECHNOLOGY LTD
Authorized Procurement Solutions
UNI Independent Distributors
Native Components
$2.165
Cellphone ICs BGA7204,115 attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
BGA7204,115 Telecommunications trade compliance attributes, and parameters.
HTS
8542.33.00.01
SB
8542.33.00.00
PCN Obsolescence/ EOL - BB1x/BGUx/BGAx obs 01/Jul/2022 BGA7204 20/Feb/2020 Mult Dec EOL 04/Dec/2019
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Bkc Semiconductors
STM32F401CDY6TR
STMicroelectronics
STM32F401CDY6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words, 50 MHz clock frequency, and 36 I/O lines. It is used in applications requiring high-speed processing, such as industrial automation and consumer electronics.
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
MMBT3904LT1G
Onsemi
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
International Semiconductor
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LT5558EUF#PBF
Analog Devices' LT5558EUF#PBF is a cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
CC1150RSTR
Texas Instruments
The Texas Instruments CC1150RSTR is a cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 1.8/3.6V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits in industrial telecom applications due to its CMOS technology and compact size.
TRF4000PWP
TRF4000PWP by Texas Instruments is a cellphone IC with 14 terminals, operating temperature range of -30 to 80°C. It features RF and baseband circuits, suitable for telecom applications. The package is small outline, heat sink/slug, with gull wing terminals and 0.65mm pitch.
SARA-R412M-02B-03
U-blox Ag
SARA-R412M-02B-03 by U-blox Ag is a Cellphone IC with RF and baseband circuit. It operates at -20 to 65°C, with a supply voltage of 3.8V. Suitable for telecom applications due to its compact size and grid array package style.
AD6653BCPZ-80
AD6653BCPZ-80 by Analog Devices is a cellphone IC with 64 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. This baseband circuit has a nominal voltage of 1.8V and terminal pitch of 0.5mm, making it ideal for telecom applications.
TLV321AC37CDW
TLV321AC37CDW by Texas Instruments is a 20-terminal cellphone IC in small outline package. Operating temp range: 0-70°C, supply voltage: 3V. Ideal for baseband circuits due to CMOS technology and gull wing terminal form.
AD6634BBCZ
AD6634BBCZ by Analog Devices is a Cellphone IC with 196 terminals in a square grid array package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. Features CMOS technology, 2.5V supply voltage, and baseband circuit for telecom applications.
LMH2110TMX/NOPB
LMH2110TMX/NOPB by Texas Instruments is a cellphone IC with a package style of GRID ARRAY, very thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) with a supply current of 5.5mA at 4.5V. This RF and baseband circuit has 6 terminals in a rectangular shape for surface mount applications.
MAX5864ETM+
Analog Devices' MAX5864ETM+ is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a terminal pitch of 0.5mm, making it ideal for telecom applications.
CC1070-RTY1
CC1070-RTY1 by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 105°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This square-shaped chip carrier is surface-mountable with a very thin profile, ideal for industrial telecom applications.
LMV228UR/NOPB
RF AND BASEBAND CIRCUIT; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER;
TCM320AC56CPT
TCM320AC56CPT by Texas Instruments is a cellphone IC with 48 terminals, operating at 0-70°C. It features a 13-bit linear coding, μ-law companding law, and operates on a 5V supply voltage. This baseband circuit IC has a low profile flatpack package suitable for telecom applications.
MAX2309ETI+
MAX2309ETI+ by Analog Devices is a cellphone IC with 28 terminals in a square package. It operates at -40 to 85°C, with power supplies of 3/3.3V and max supply current of 0.0415mA. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and is suitable for industrial temperature grades.
AD6634XBC
AD6634XBC by Analog Devices is a Cellphone IC with 196 terminals in a square GRID ARRAY package. Operating temp range -40 to 70 °C, CMOS tech, and 2.5V supply voltage make it ideal for BASEBAND CIRCUIT applications.
TLV321AC36IDW
TLV321AC36IDW by Texas Instruments is a Cellphone IC with 20 terminals in a small outline package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features CMOS technology, Gull Wing terminal form, and is ideal for baseband circuit applications.
SI4721-B20-GMR
Silicon Labs
Silicon Labs' SI4721-B20-GMR is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this IC has a compact size of 3x3mm suitable for surface mount designs.
ADF4360-2BCPZRL
Analog Devices' ADF4360-2BCPZRL is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 3.3V supply, BICMOS technology, and matte tin finish. This square chip carrier is ideal for baseband circuits in industrial telecom applications due to its compact size and low profile design.
TCM8002IFR
Texas Instruments TCM8002IFR is a cellphone IC with 44 terminals in a square flatpack package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. Features include CMOS technology, 3.3V supply voltage, and baseband circuit for telecom applications.
LMH2110TM
LMH2110TM by Texas Instruments is a Cellphone IC with a package style of GRID ARRAY, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C and has RF and baseband circuit capabilities. With a nominal voltage of 4.5V, it is suitable for telecommunications applications.
LMH9226IRRLR
LMH9226IRRLR by Texas Instruments is a Cellphone IC with 12 terminals in a square package. It operates b/w -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for cellphone applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
BGA725L6E6327FTSA1
Infineon Technologies
Infineon's BGA725L6E6327FTSA1 is a cellphone IC with 6 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features a nominal voltage of 1.8V and is designed for baseband circuit applications.
BGA7H1BN6E6327XTSA1
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGA725L6E6327FTSA1/SAMPLE
BASEBAND CIRCUIT;
BGA713N7E6327XTSA1
BGA713N7E6327XTSA1 by Infineon Technologies is a cellphone IC with 6 terminals in a small outline package. It operates b/w -30°C to 85°C, suitable for RF and baseband circuits. With a nominal voltage of 2.8V, it features tin terminal finish and measures 1.3mm in width and 2mm in length.
BGA7351,515
NXP Semiconductors
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
BGA7351,115
BGA7210,515
BGA7210X
BGA7350
BGA7351
BGA7350,115
BGA7210
BGA7204
BGA7204,515
BGA7350,515
BGA735L16
RF FRONT END CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
BGA713L7E6327XTSA1
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: HVBCC; Package Shape: RECTANGULAR;
BGA735L16E6327XTSA1
BGA713L7
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved