Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Infineon's BGA7H1BN6E6327XTSA1 is a cellphone IC with 6 terminals, operating temp. range of -40 to 85°C, and supply voltage of 2.8V. It features RF & baseband circuits in a very thin profile chip carrier package for telecom applications.
Median Price
$0.620
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1k+
Farnell
1+ parts
$0.527
100+ parts
$0.286
1k+ parts
$0.198
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$0.179
Mouser Electronics
$0.344
$0.294
$0.264
Newark
$0.628
$0.348
$0.302
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DigiKey
$0.730
$0.405
$0.345
$0.322
Element14
$0.882
$0.448
$0.400
$0.350
Rochester
$0.325
$0.270
$0.240
Verical
$0.301
Digiode
$0.253
Nova Conductors
$0.335
Vyrian
VNN
Ampacity Inc.
$0.226
Semicontronic
$0.220
$0.219
Corphita
$0.239
Argo Parts USA
Aztec Data Supply Inc.
$8.498
Corohmni
$9.309
Advanced Electronics
$11.468
$10.895
Modulus Dynamics
$17.069
$16.386
$15.703
Epart123
Legend Electronics Inc. (Excess)
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$0.369
$0.272
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Netroflash
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$0.312
Perfect Parts
Plastic and epoxy materials offer durability and protection for the IC, ensuring longevity and reliability.
Surface mount technology allows for easy installation and soldering onto circuit boards, saving time and effort during assembly.
Rectangular package shape provides efficient use of space and allows for easy integration into electronic devices.
Having 6 terminals allows for multiple connections and functionality within the IC's design, making it versatile for different applications.
High maximum operating temperature ensures stability and performance even in demanding environments or conditions.
Low nominal supply voltage reduces power consumption and heat dissipation, contributing to energy efficiency and longer battery life.
Cellphone ICs BGA7H1BN6E6327XTSA1 attributes and parameters. Explore more Cellphone ICs devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
BGA7H1BN6E6327XTSA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Packing Box Chg 18/Oct/2019
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148-GS08
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
1N4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
PIC18F4550-I/PT
Microchip Technology
PIC18F4550-I/PT by Microchip: 8-bit microcontroller with 44 terminals, 48 MHz clock frequency, and USB connectivity. Ideal for industrial applications requiring low power mode and 10-bit ADC channels.
LD1117S33TR
STMicroelectronics
LD1117S33TR by STMicroelectronics is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It has a small outline package style, operates at an adjustable temperature range from 0 to 125°C, and is ideal for applications requiring stable voltage regulation in compact electronic devices.
LM7805CT
Silicon Group
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Package Body Material: PLASTIC/EPOXY; Maximum Load Regulation: .05 %;
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
American Power Devices
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Meritek Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
STM32F405RGT6
STM32F405RGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 16 external interrupts, and 196608 RAM bytes. Ideal for industrial applications, it features CAN(2), I2C(3), SPI(3) connectivity options and operates at a max clock frequency of 26 MHz. With low power mode and DMA support, it offers versatile performance in compact dimensions.
STM32F407VGT6
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
BAV99
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
USB2514BI-AEZG
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
ADF7901BRU-REEL
Analog Devices
ADF7901BRU-REEL by Analog Devices is a cellphone IC with 24 terminals in a small outline package. It operates at temperatures from 0 to 50 °C, with a supply voltage of 3V. This RF and baseband circuit is ideal for telecom applications requiring surface mount technology.
ST25R3912-AQWT
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
HMC485MS8GTR
Analog Devices' HMC485MS8GTR is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85 °C and has a peak reflow temperature of 235°C. Ideal for RF and baseband circuits in telecom applications due to its dual terminal position and tin lead finish.
SARA-U201-04B-00
U-blox Ag
SARA-U201-04B-00 by U-blox Ag is a CELLPHONE IC with 96 terminals in RECTANGULAR CHIP CARRIER package. It operates b/w -20 to 65 °C, suitable for TELECOM CIRCUITS with 3.8V supply voltage.
TRF370333IRGET
TRF370333IRGET by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 5V supply, RF and baseband circuit for telecom applications, and terminal finish of NiPdAu. The chip carrier package has a square shape, measures 4x4mm in size, and is suitable for industrial temperature grades.
TRF96001GQE
TRF96001GQE by Texas Instruments is a cellphone IC with 80 terminals in a square grid array package. It operates b/w -20°C to 70°C, suitable for commercial telecom applications. Featuring RF and baseband circuits, it has a nominal voltage of 3V and very thin profile at 1mm seated height.
AFE7921IABJ
AFE7921IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a compact size of 17x17 mm and is surface mountable.
TLV320AC56IDWR
TLV320AC56IDWR by Texas Instruments is a Cellphone IC with 20 terminals, operating temperature range of -40 to 85°C. It features CMOS technology, 3V supply voltage, and Gull Wing terminal form. Ideal for baseband circuit applications in the telecom industry due to its small outline package style.
HMC420QS16ETR
Analog Devices' HMC420QS16ETR is a 16-terminal cellphone IC with PLASTIC/EPOXY body, suitable for RF and baseband circuits. It operates b/w -40 to 85 °C, with a nominal voltage of 5V. The small outline package measures 4.9mm x 3.9mm x 1.75mm, making it ideal for telecom applications requiring compact components.
WFM200S022XNN2
Silicon Labs
Cellular Telephone Circuits; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
CC2420RGZR
CC2420RGZR by Texas Instruments is a cellphone IC with 48 terminals and operates at temperatures ranging from -40 to 85°C. It features a CMOS technology, RF and baseband circuit for telecom applications, and a nominal voltage of 3.3V. This chip carrier package with a square shape is suitable for industrial use due to its low profile design and surface mount capability.
AD6653BCPZ-150
AD6653BCPZ-150 by Analog Devices is a cellphone IC with 64 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with a nominal voltage of 1.8V. Ideal for baseband circuits, it has a very thin profile and matte tin terminal finish.
CC1000YZR
CC1000YZR by Texas Instruments is a Cellphone IC with 28 terminals in a rectangular package. It operates at temperatures ranging from -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
LT5526EUF#PBF
Linear Technology
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
ADF4360-8BCPZ
Analog Devices ADF4360-8BCPZ is a Cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, powered by 3.3V supply voltage. Ideal for baseband circuits, it features BICMOS technology and matte tin terminal finish.
MAX2902ETI+T
Analog Devices' MAX2902ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial telecom applications. Features RF and baseband circuits, nominal voltage of 4.5V, and terminal pitch of 0.5mm.
TLV320AC57DW
TLV320AC57DW by Texas Instruments is a cellphone IC with 20 terminals, operating b/w -40 to 85°C. It has a small outline package style and gull wing terminal form, suitable for baseband circuits in telecom applications. The package dimensions are 7.5mm x 12.8mm with a seated height of 2.65mm, making it ideal for compact designs.
ADL5561ACPZ-WP
ADL5561ACPZ-WP by Analog Devices is a 16-terminal cellphone IC with a square package shape and matte tin terminal finish. It operates b/w -40 to 85°C, suitable for industrial use in RF and baseband circuits at a nominal voltage of 3.3V. The chip carrier has a very thin profile, making it ideal for surface mount applications.
CC1100RTKRG3
CC1100RTKRG3 by Texas Instruments is a cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 1.8/3.6V, RF and baseband circuit technology, and a compact square package suitable for telecom applications.
TCM320AC56IN
TCM320AC56IN by Texas Instruments is a 20-terminal IC for cellphones. It operates at temperatures from -40 to 85°C, with a supply voltage of 5V. Featuring companding law MU-LAW and a filter, it is ideal for baseband circuit applications in the telecom industry.
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BGA725L6E6327FTSA1
Infineon Technologies
Infineon's BGA725L6E6327FTSA1 is a cellphone IC with 6 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features a nominal voltage of 1.8V and is designed for baseband circuit applications.
BGA725L6E6327FTSA1/SAMPLE
BASEBAND CIRCUIT;
BGA713N7E6327XTSA1
BGA713N7E6327XTSA1 by Infineon Technologies is a cellphone IC with 6 terminals in a small outline package. It operates b/w -30°C to 85°C, suitable for RF and baseband circuits. With a nominal voltage of 2.8V, it features tin terminal finish and measures 1.3mm in width and 2mm in length.
BGA7351,515
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
BGA7351,115
BGA7210,515
BGA7210X
BGA7350
BGA7204,115
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
BGA7351
BGA7350,115
BGA7210
BGA7204
BGA7204,515
BGA7350,515
BGA735L16
RF FRONT END CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
BGA713L7E6327XTSA1
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: HVBCC; Package Shape: RECTANGULAR;
BGA735L16E6327XTSA1
BGA713L7
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