Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
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$14.491
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Cellphone ICs BGA7351 attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
BGA7351 Telecommunications trade compliance attributes, and parameters.
HTS
8542.33.00.01
SB
8542.33.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
NC7WZ17P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
1N4148
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
SMBJ18CA
Good-ark Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Maximum Time At Peak Reflow Temperature (s): 10; JESD-609 Code: e3;
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Transistor & Electronic
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Renesas Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
American Power Devices
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NC7WZ07P6X
Onsemi
The Onsemi NC7WZ07P6X is a logic gate with 2 functions, featuring a propagation delay of 4.8 ns at 1.8V supply voltage. With open-drain output characteristics, it operates in industrial temperatures from -40 to 85°C. Ideal for applications requiring fast signal processing and low power consumption in compact designs.
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
Thinking Electronic Industrial
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
Micro Commercial Components
CC2511F8RSPR
Texas Instruments
The Texas Instruments CC2511F8RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating at 3V, it features RF and baseband circuitry for telecom applications. With a compact size of 6x6mm and CMOS technology, it offers high performance in a small form factor suitable for mobile devices.
TRF370315IRGER
TRF370315IRGER by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 5V supply voltage, RF and baseband circuit for telecom applications, and terminal finish of nickel palladium gold. The package style is chip carrier with very thin profile, suitable for industrial use.
AD8340ACPZ-REEL7
Analog Devices
AD8340ACPZ-REEL7 by Analog Devices is a cellphone IC with 24 terminals, operating at -40 to 85 °C. It features a 5V supply, 0.15mA current, and RF/baseband circuitry. This square-shaped chip carrier is surface-mountable and has a very thin profile for industrial telecom applications.
MAX4003EUA
Maxim Integrated
MAX4003EUA by Maxim Integrated is a cellphone IC with 8 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, RF and baseband circuit for telecom applications.
TLV320AC57CN
TLV320AC57CN by Texas Instruments is a 20-terminal IC with 3V supply, operating b/w 0-70°C. It features A-LAW companding law, 13-bit linear coding, and a filter. Ideal for cellphone applications due to its BASEBAND CIRCUIT telecom IC type and compact IN-LINE package style.
TCM320AC57IPT
Texas Instruments TCM320AC57IPT is a 48-terminal cellphone IC with 5V power supply, operating from -40 to 85°C. Featuring A-LAW companding law, it has a flatpack package style and gull wing terminal form. Ideal for baseband circuits in telecom applications due to its low profile design and fine pitch terminals.
ADF4360-4BCPZRL7
Analog Devices' ADF4360-4BCPZRL7 is a BICMOS technology Cellphone IC with 24 terminals, operating at 3.3V. It features a square package shape, matte tin finish, and industrial temperature grade. Ideal for baseband circuits in cellphones due to its compact size and low power consumption.
HMC381LP6TR
Analog Devices' HMC381LP6TR is a cellphone IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features RF and baseband circuits, with a nominal voltage of 5V, making it ideal for telecom applications.
MAX2900ETI+T
Analog Devices' MAX2900ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for industrial telecom applications requiring RF and baseband circuit integration. With a nominal voltage of 4.5V, this IC features a very thin profile and matte tin terminal finish for robust performance.
CC1000_UCSP/T&R
CC1000_UCSP/T&R by Texas Instruments is a Cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V and uses CMOS technology for RF and baseband circuits. This rectangular package with grid array style is ideal for telecom applications requiring compact design and high performance in industrial temperature environments.
HL7692
Sierra Wireless
Sierra Wireless' HL7692 is a surface-mount RF and baseband circuit IC with 146 terminals in a grid array package. Operating b/w -40°C to 85°C, it has a compact size of 22mm width and 23mm length, making it ideal for cellphone applications requiring high-performance telecom capabilities.
MAX5865ETM+T
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
CC2420Z-RTB1
CC2420Z-RTB1 by Texas Instruments is a cellphone IC with 48 terminals, operating temperature range of -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuit for telecom applications, and CMOS technology. The package style includes chip carrier and heat sink/slug, making it suitable for industrial use in compact devices.
TOBY-L210-03S
U-blox Ag
TOBY-L210-03S by U-blox Ag is a Cellphone IC with 152 terminals in a rectangular grid array package. Operating b/w -20°C to 65°C, it integrates RF and baseband circuits at 3.8V supply voltage. Ideal for compact mobile devices due to its small dimensions of 24.8mm width and 35.6mm length.
HMC683LP6CTR
Analog Devices' HMC683LP6CTR is a 40-terminal cellphone IC in a square chip carrier package with very thin profile. It operates b/w -40 °C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
LMH2120UM
LMH2120UM by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C, suitable for RF and baseband circuits in telecom applications. The package body material is plastic/epoxy with 6 terminals on the bottom side.
HMC832LP6GE
Analog Devices' HMC832LP6GE is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating from -40 to 85°C, it's ideal for RF and baseband circuits, featuring a nominal voltage of 3.3V. With a very thin profile and terminal pitch of 0.5mm, this industrial-grade IC suits compact telecom applications.
TRF37T05IRGER
TRF37T05IRGER by Texas Instruments is a 24-terminal cellphone IC in a square chip carrier package. Operating b/w -40°C to 85°C, it's ideal for industrial telecom applications requiring RF and baseband circuits at 3.3V supply voltage. With nickel palladium gold finish, it offers high reliability in compact dimensions of 4mm x 4mm x 1mm.
ADL5363XCPZ-R7
ADL5363XCPZ-R7 by Analog Devices is a cellphone IC with BICMOS technology. It operates b/w -40 to 85°C, has 20 terminals in a square package style, and requires a nominal voltage of 5V. This RF and baseband circuit is ideal for telecom applications due to its compact size and surface mount capability.
TOBY-L210-62S
TOBY-L210-62S by U-blox Ag is a CELL IC with 152 terminals in GRID ARRAY package. It operates b/w -20°C to 65°C, ideal for RF and baseband circuits in cellphones. With a compact size of 24.8mm x 35.6mm and low supply voltage of 3.8V, it's suitable for mobile communication applications.
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ADL5202ACPZ-R7
BGA725L6E6327FTSA1
Infineon Technologies
Infineon's BGA725L6E6327FTSA1 is a cellphone IC with 6 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features a nominal voltage of 1.8V and is designed for baseband circuit applications.
BGA7H1BN6E6327XTSA1
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VQCCN; Package Shape: RECTANGULAR;
BGA725L6E6327FTSA1/SAMPLE
BASEBAND CIRCUIT;
BGA713N7E6327XTSA1
BGA713N7E6327XTSA1 by Infineon Technologies is a cellphone IC with 6 terminals in a small outline package. It operates b/w -30°C to 85°C, suitable for RF and baseband circuits. With a nominal voltage of 2.8V, it features tin terminal finish and measures 1.3mm in width and 2mm in length.
BGA7351,515
BGA7351,115
BGA7210,515
BGA7210X
BGA7350
BGA7204,115
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
BGA7350,115
BGA7210
BGA7204
BGA7204,515
BGA7350,515
BGA735L16
RF FRONT END CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
BGA713L7E6327XTSA1
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: HVBCC; Package Shape: RECTANGULAR;
BGA735L16E6327XTSA1
BGA713L7
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