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CC2420ZRTC

Texas Instruments

CC2420ZRTC by Texas Instruments

CC2420ZRTC by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, CMOS technology, and RF/baseband circuitry. Ideal for telecom applications due to its compact square package and low profile design.

Median Price

$5.930

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 129 parts In-Stock

1+ parts

$5.930

100+ parts

$5.810

1k+ parts

$5.690

10k+ parts

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129

$5.930

$5.810

$5.690

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Distributors (In-Stock)

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Vyrian

USA . 8,971 parts In-Stock

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Digiode

USA . 4,511 parts In-Stock

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4,511

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Distributors (Availability)

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Parana Technologies

USA . 1,671 parts In-Stock

1+ parts

$13.203

100+ parts

-

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$13.709

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1,671

$13.203

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$13.709

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AZTECH Wire

Italy . 411 parts In-Stock

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$13.490

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411

$13.490

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DigiPath Technology Company

USA . 502 parts In-Stock

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$14.538

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$13.375

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502

$14.538

$13.375

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ChromeModa Solutions

Germany . 4,378 parts In-Stock

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$14.835

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$12.165

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4,378

$14.835

$12.165

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IDEA Electronic Components Group

UK . 521 parts In-Stock

1+ parts

$14.835

100+ parts

$14.093

1k+ parts

$13.352

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521

$14.835

$14.093

$13.352

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One Stop Electronics

USA . 834 parts In-Stock

1+ parts

$90.000

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834

$90.000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 1,767 parts In-Stock

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Northwest PG Solutions

USA . 1,337 parts In-Stock

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Native Components

USA . 178 parts In-Stock

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Overview

Elevate your cellphone technology with the CC2420ZRTC by Texas Instruments. Designed with precision and expertise, this cutting-edge Cellphone IC offers unparalleled performance and reliability. With its surface mount capability, versatile package styles, and industrial-grade temperature grade, this product is ideal for a wide range of applications. Trust in Texas Instruments' reputation for quality and innovation as you experience the value and benefits that the CC2420ZRTC brings to your projects. Upgrade your devices today with this exceptional Telecom IC.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space in the manufacturing process.

Package Shape: SQUARE

Square package shape provides stability and ease of handling during installation, reducing the risk of damage.

Power Supplies (V): 1.8,1.8/3.3

Support for multiple power supply voltages allows for versatility in different circuit configurations and compatibility with various systems.

No. of Terminals: 48

Higher number of terminals allow for more connections and functionality within the circuit, providing flexibility in design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Different package styles offer options for thermal management, space constraints, and overall performance optimization based on specific application requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in a wide range of environments, making the product suitable for various applications.

Terminal Position: QUAD

Quad terminal position offers efficient layout and connection possibilities, enabling improved signal integrity and easier assembly.

Maximum Seated Height: 0.9 mm

Low maximum seated height contributes to a compact overall design, ideal for space-constrained applications.

Width: 7 mm

Narrow width enables efficient placement on circuit boards, optimizing space utilization and allowing for dense packing.

Length: 7 mm

Compact length facilitates easier integration into electronic devices, enhancing overall product design aesthetics and functionality.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in harsh operating conditions typically found in industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, making the product energy-efficient and versatile.

Terminal Form: NO LEAD

No-lead terminal form eliminates the risk of solder joint fatigue and improves signal integrity, ensuring long-term reliability and performance.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and baseband circuit type enables seamless integration of wireless communication capabilities, making the product suitable for cellular phone applications.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources commonly used in electronic devices.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for high-density mounting of components, enabling miniaturization of devices and improving overall circuit performance.

Technical Specifications

Cellphone ICs CC2420ZRTC attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.8,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

CC2420ZRTC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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