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CC2420-RTR1

Texas Instruments

CC2420-RTR1 by Texas Instruments

CC2420-RTR1 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuitry, and CMOS technology. Ideal for telecom applications, this surface-mount chip carrier has a compact square package style with nickel palladium gold finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,587 parts In-Stock

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Digiode

USA . 4,680 parts In-Stock

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Velocity Electronics

USA . 352 parts In-Stock

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Zilex Electronics Inc.

Canada . 59 parts In-Stock

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AZTECH Wire

Italy . 544 parts In-Stock

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$11.749

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544

$11.749

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Parana Technologies

USA . 572 parts In-Stock

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$15.549

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$15.925

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572

$15.549

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$15.925

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DigiPath Technology Company

USA . 1,409 parts In-Stock

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$17.122

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$15.752

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$17.122

$15.752

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ChromeModa Solutions

Germany . 1,117 parts In-Stock

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$17.471

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$14.326

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$17.471

$14.326

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IDEA Electronic Components Group

UK . 412 parts In-Stock

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$17.471

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$16.597

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$15.724

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412

$17.471

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$15.724

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Native Components

USA . 785 parts In-Stock

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$24.680

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785

$24.680

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Northwest PG Solutions

USA . 104 parts In-Stock

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$27.148

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$24.433

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One Stop Electronics

USA . 1,443 parts In-Stock

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$90.000

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A-Z Elektronik GmbH

Germany . 5,907 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

USA . 4,814 parts In-Stock

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Corphita

USA . 4,365 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,938 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Lixinc

USA . 2,439 parts In-Stock

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Computer Components Inc. - USA

USA . 3 parts In-Stock

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Overview

Discover the cutting-edge CC2420-RTR1 by Texas Instruments, a top-of-the-line Cellphone IC that promises superior quality and performance. With Texas Instruments' reputation for excellence in technology, this product delivers unmatched reliability and innovation. Ideal for various applications, this chip boasts a sleek square package shape, making it perfect for any project. Experience seamless integration with its surface mount design and multiple power supply options. Elevate your designs with the CC2420-RTR1 and unlock a world of possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient assembly and compact design, making this product suitable for small and slim devices.

Package Shape: SQUARE

The square package shape provides better space utilization and easier handling during assembly, contributing to overall product efficiency.

Power Supplies (V): 1.8,1.8/3.3

Having multiple power supply options allows flexibility in designing and powering the device in different operational scenarios, enhancing overall versatility.

No. of Terminals: 48

Having a high number of terminals enables complex connectivity and functionality, making the product suitable for advanced applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability even under demanding environmental conditions, enhancing product durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can operate in a wide range of environments, making it suitable for various use cases.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of high-quality terminal finish enhances conductivity and corrosion resistance, ensuring long-term performance and reliability of the product.

Width: 7 mm

The compact width of the product allows for space-efficient PCB layout and integration into compact devices, making it ideal for handheld applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for extended operation.

Technical Specifications

Cellphone ICs CC2420-RTR1 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC2420-RTR1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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