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TRF3710IRGZT

Texas Instruments

TRF3710IRGZT by Texas Instruments

TRF3710IRGZT by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 5V, making it ideal for telecom applications.

Median Price

$19.400

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,700 parts In-Stock

1+ parts

$20.079

100+ parts

$17.539

1k+ parts

$12.096

10k+ parts

-

1,700

$20.079

$17.539

$12.096

-

DigiKey

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

$19.900

1k+ parts

-

10k+ parts

-

12,500

-

$19.900

-

-

Rochester

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

$15.120

1k+ parts

$13.530

10k+ parts

$12.740

12,500

-

$15.120

$13.530

$12.740

Verical

USA . 7,750 parts In-Stock

1+ parts

-

100+ parts

$18.900

1k+ parts

$16.913

10k+ parts

$15.925

7,750

-

$18.900

$16.913

$15.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,764 parts In-Stock

1+ parts

$15.960

100+ parts

-

1k+ parts

-

10k+ parts

-

1,764

$15.960

-

-

-

Nova Conductors

Japan . 57 parts In-Stock

1+ parts

$16.640

100+ parts

-

1k+ parts

-

10k+ parts

-

57

$16.640

-

-

-

Vyrian

USA . 4,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,760

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,286 parts In-Stock

1+ parts

$8.139

100+ parts

-

1k+ parts

$8.737

10k+ parts

-

1,286

$8.139

-

$8.737

-

ChromeModa Solutions

Germany . 3,182 parts In-Stock

1+ parts

$9.145

100+ parts

$7.499

1k+ parts

-

10k+ parts

-

3,182

$9.145

$7.499

-

-

IDEA Electronic Components Group

UK . 1,894 parts In-Stock

1+ parts

$9.145

100+ parts

$8.688

1k+ parts

$8.230

10k+ parts

-

1,894

$9.145

$8.688

$8.230

-

AZTECH Wire

Italy . 521 parts In-Stock

1+ parts

$11.600

100+ parts

-

1k+ parts

-

10k+ parts

-

521

$11.600

-

-

-

Ampacity Inc.

Singapore . 6,609 parts In-Stock

1+ parts

$14.280

100+ parts

-

1k+ parts

-

10k+ parts

-

6,609

$14.280

-

-

-

Corphita

USA . 2,514 parts In-Stock

1+ parts

$15.120

100+ parts

-

1k+ parts

-

10k+ parts

-

2,514

$15.120

-

-

-

Continental Prestige Electronics

USA . 3,648 parts In-Stock

1+ parts

$16.640

100+ parts

-

1k+ parts

-

10k+ parts

$16.307

3,648

$16.640

-

-

$16.307

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$16.640

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$16.640

-

-

-

DigiPath Technology Company

USA . 1,904 parts In-Stock

1+ parts

-

100+ parts

$8.245

1k+ parts

-

10k+ parts

-

1,904

-

$8.245

-

-

Argo Parts USA

USA . 1,645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,645

-

-

-

-

Overview

Experience the seamless connectivity and enhanced performance with the TRF3710IRGZT by Texas Instruments. As a leading manufacturer in cellphone ICs, Texas Instruments delivers superior quality and reliability in every product. This versatile RF and baseband circuit offers a wide range of applications, ensuring optimal performance in various telecom devices. With its advanced features and innovative design, the TRF3710IRGZT provides customers with exceptional value, benefits, and advantages, making it the ideal choice for all your connectivity needs. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides a lightweight and durable package for the Cellphone ICs, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology allows for easy assembly and compact design, making it ideal for modern cellphone applications.

Package Shape: SQUARE

Square package shape helps in efficient space utilization and easy PCB layout design.

No. of Terminals: 48

With 48 terminals, this Cellphone ICs can support a wide range of functions and connectivity options.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the Cellphone ICs can operate reliably in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the Cellphone ICs can function even in extreme cold conditions.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Being optimized for RF and Baseband circuit operations, this IC is well-suited for cellphone communication applications.

Technical Specifications

Cellphone ICs TRF3710IRGZT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF3710IRGZT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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