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TRF370315IRGET

Texas Instruments

TRF370315IRGET by Texas Instruments

TRF370315IRGET by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, max current of 235mA, and RF/baseband circuit type. Ideal for telecom applications due to its compact square chip carrier package and surface-mount capability.

Median Price

$12.252

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,822 parts In-Stock

1+ parts

$11.766

100+ parts

$10.278

1k+ parts

$7.088

10k+ parts

-

15,822

$11.766

$10.278

$7.088

-

Rochester

USA . 26,500 parts In-Stock

1+ parts

-

100+ parts

$10.190

1k+ parts

$9.120

10k+ parts

$8.580

26,500

-

$10.190

$9.120

$8.580

DigiKey

USA . 26,500 parts In-Stock

1+ parts

-

100+ parts

$13.410

1k+ parts

-

10k+ parts

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26,500

-

$13.410

-

-

Verical

USA . 15,795 parts In-Stock

1+ parts

-

100+ parts

$12.738

1k+ parts

$11.400

10k+ parts

$10.725

15,795

-

$12.738

$11.400

$10.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,023 parts In-Stock

1+ parts

$9.348

100+ parts

-

1k+ parts

-

10k+ parts

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4,023

$9.348

-

-

-

Vyrian

USA . 2,797 parts In-Stock

1+ parts

$9.840

100+ parts

-

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-

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-

2,797

$9.840

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-

-

Pegasus Components GmbH

Germany . 250 parts In-Stock

1+ parts

-

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250

-

-

-

-

Netsource Technology, Inc.

USA . 185 parts In-Stock

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185

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Speed Components Ltd

Israel . 15 parts In-Stock

1+ parts

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,365 parts In-Stock

1+ parts

$8.856

100+ parts

-

1k+ parts

-

10k+ parts

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4,365

$8.856

-

-

-

Parana Technologies

USA . 1,269 parts In-Stock

1+ parts

$11.364

100+ parts

-

1k+ parts

$11.789

10k+ parts

-

1,269

$11.364

-

$11.789

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DigiPath Technology Company

USA . 630 parts In-Stock

1+ parts

$12.513

100+ parts

$11.512

1k+ parts

-

10k+ parts

-

630

$12.513

$11.512

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-

ChromeModa Solutions

Germany . 4,631 parts In-Stock

1+ parts

$12.768

100+ parts

$10.470

1k+ parts

-

10k+ parts

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4,631

$12.768

$10.470

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IDEA Electronic Components Group

UK . 1,884 parts In-Stock

1+ parts

$12.768

100+ parts

$12.130

1k+ parts

$11.491

10k+ parts

-

1,884

$12.768

$12.130

$11.491

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Lixinc

USA . 16,793 parts In-Stock

1+ parts

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16,793

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Perfect Parts

USA . 2,575 parts In-Stock

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2,575

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Overview

Discover the cutting-edge TRF370315IRGET by Texas Instruments, a top-of-the-line Cellphone IC that sets the standard for quality and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this product delivers unparalleled performance in a compact package. Ideal for a wide range of applications in the telecom industry, this IC offers customers unmatched value and benefits. Trust Texas Instruments to provide you with the innovative solutions you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and helps reduce overall product weight, making it a good choice for portable devices.

Surface Mount: YES

Surface mount technology offers compactness and allows for efficient assembly, making the product suitable for space-constrained applications.

Power Supplies (V): 5

Operating at 5V ensures compatibility with standard power sources, making integration easier in various systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, increasing reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent corrosion resistance and conductivity, enhancing the product's longevity and performance.

Maximum Supply Current: 235 mA

The high supply current allows for efficient power consumption and operation, making the product suitable for demanding applications.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuits in a single IC simplifies system design and reduces component count, offering cost-effective solutions.

Technical Specifications

Cellphone ICs TRF370315IRGET attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

235 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TRF370315IRGET Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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