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TRF3702IRHC

Texas Instruments

TRF3702IRHC by Texas Instruments

TRF3702IRHC by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a supply voltage of 5V and consumes 0.17mA current. Ideal for RF and baseband circuits in telecom applications due to its compact square chip carrier package style.

Median Price

$12.190

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 71,540 parts In-Stock

1+ parts

-

100+ parts

$12.190

1k+ parts

-

10k+ parts

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71,540

-

$12.190

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Rochester

USA . 70,984 parts In-Stock

1+ parts

-

100+ parts

$10.550

1k+ parts

$9.440

10k+ parts

$8.890

70,984

-

$10.550

$9.440

$8.890

Verical

USA . 41,300 parts In-Stock

1+ parts

-

100+ parts

$13.188

1k+ parts

$11.800

10k+ parts

$11.113

41,300

-

$13.188

$11.800

$11.113

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,021 parts In-Stock

1+ parts

$11.134

100+ parts

-

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1,021

$11.134

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Vyrian

USA . 3,847 parts In-Stock

1+ parts

$11.720

100+ parts

-

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3,847

$11.720

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DigiKey Marketplace

USA . 71,540 parts In-Stock

1+ parts

-

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71,540

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Bristol Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,341 parts In-Stock

1+ parts

$8.783

100+ parts

-

1k+ parts

$9.470

10k+ parts

-

2,341

$8.783

-

$9.470

-

DigiPath Technology Company

USA . 977 parts In-Stock

1+ parts

$9.671

100+ parts

-

1k+ parts

-

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-

977

$9.671

-

-

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ChromeModa Solutions

Germany . 3,178 parts In-Stock

1+ parts

$9.868

100+ parts

$8.092

1k+ parts

-

10k+ parts

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3,178

$9.868

$8.092

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IDEA Electronic Components Group

UK . 65 parts In-Stock

1+ parts

$9.868

100+ parts

$9.375

1k+ parts

$8.881

10k+ parts

-

65

$9.868

$9.375

$8.881

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Corphita

USA . 2,545 parts In-Stock

1+ parts

$10.548

100+ parts

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2,545

$10.548

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Component Stockers USA

USA . 48,467 parts In-Stock

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48,467

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A-Z Elektronik GmbH

Germany . 5,918 parts In-Stock

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5,918

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Kepictronics

USA . 3,772 parts In-Stock

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3,772

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Perfect Parts

USA . 1,296 parts In-Stock

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1,296

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Overview

Elevate your cellphone performance with the TRF3702IRHC by Texas Instruments, a cutting-edge RF and baseband circuit that delivers unrivaled quality and reliability. Manufactured with precision and expertise, this cellphone IC offers seamless integration, exceptional power efficiency, and superior connectivity for a seamless user experience. Whether you're looking to enhance your smartphone's signal strength, optimize data transfer speeds, or improve overall performance, the TRF3702IRHC is the ultimate solution. Upgrade your device today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and helps protect the internal components of the cellphone ICs, ensuring a long lifespan.

Surface Mount: YES

Surface mount technology simplifies the manufacturing process and allows for compact designs, making the cellphone ICs easier to integrate into devices.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of devices and power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, these cellphone ICs can withstand harsh environmental conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and performance over time.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF (Radio Frequency) and baseband circuitry in one IC results in improved signal processing and communication capabilities in the cellphone.

Technical Specifications

Cellphone ICs TRF3702IRHC attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,32

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.17 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TRF3702IRHC Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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