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CC1101QRHBRG4Q1

Texas Instruments

CC1101QRHBRG4Q1 by Texas Instruments

CC1101QRHBRG4Q1 by Texas Instruments is a cellphone IC with 32 terminals, operating at 1.8/3.6V and data rate of 0.25 Mbps. It is an RF and baseband circuit suitable for automotive applications due to AEC-Q100 screening, -40 to 125°C temperature range, and moisture sensitivity level of 2.

Median Price

$6.486

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,530 parts In-Stock

1+ parts

$4.911

100+ parts

$4.684

1k+ parts

$4.456

10k+ parts

-

1,530

$4.911

$4.684

$4.456

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Texas Instruments

USA . 12,466 parts In-Stock

1+ parts

$5.577

100+ parts

$4.547

1k+ parts

$3.031

10k+ parts

-

12,466

$5.577

$4.547

$3.031

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Chip1Stop

Japan . 1,550 parts In-Stock

1+ parts

$7.396

100+ parts

$5.075

1k+ parts

$3.887

10k+ parts

-

1,550

$7.396

$5.075

$3.887

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Mouser Electronics

USA . 1,695 parts In-Stock

1+ parts

$8.620

100+ parts

$6.530

1k+ parts

$5.220

10k+ parts

$5.080

1,695

$8.620

$6.530

$5.220

$5.080

DigiKey

USA . 341 parts In-Stock

1+ parts

$8.620

100+ parts

$6.535

1k+ parts

$5.796

10k+ parts

$5.444

341

$8.620

$6.535

$5.796

$5.444

Verical

USA . 1,530 parts In-Stock

1+ parts

-

100+ parts

$4.684

1k+ parts

$4.456

10k+ parts

-

1,530

-

$4.684

$4.456

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EXC GmbH

Germany . 1,600 parts In-Stock

1+ parts

$2.856

100+ parts

-

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1,600

$2.856

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.547

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-

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10

$4.547

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Digiode

USA . 3,867 parts In-Stock

1+ parts

$5.298

100+ parts

-

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3,867

$5.298

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Vyrian

USA . 2,893 parts In-Stock

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2,893

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Right Parts Inc.

USA . 2,789 parts In-Stock

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2,789

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Distributors (Availability)

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Semicontronic

India . 2,848 parts In-Stock

1+ parts

$3.480

100+ parts

$3.393

1k+ parts

$3.376

10k+ parts

-

2,848

$3.480

$3.393

$3.376

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Ampacity Inc.

Singapore . 3,062 parts In-Stock

1+ parts

$4.240

100+ parts

-

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3,062

$4.240

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Continental Prestige Electronics

USA . 6,595 parts In-Stock

1+ parts

$4.547

100+ parts

-

1k+ parts

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10k+ parts

$4.456

6,595

$4.547

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-

$4.456

Netroflash

USA . 50 parts In-Stock

1+ parts

$4.547

100+ parts

$4.456

1k+ parts

-

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50

$4.547

$4.456

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Corohmni

South Africa . 1,114 parts In-Stock

1+ parts

$4.670

100+ parts

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1,114

$4.670

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Corphita

USA . 1,386 parts In-Stock

1+ parts

$5.019

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1,386

$5.019

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Parana Technologies

USA . 1,366 parts In-Stock

1+ parts

$11.506

100+ parts

$1,068.499

1k+ parts

$10.355

10k+ parts

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1,366

$11.506

$1,068.499

$10.355

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DigiPath Technology Company

USA . 1,151 parts In-Stock

1+ parts

$12.669

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1,151

$12.669

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ChromeModa Solutions

Germany . 2,065 parts In-Stock

1+ parts

$12.928

100+ parts

$10.601

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-

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2,065

$12.928

$10.601

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IDEA Electronic Components Group

UK . 943 parts In-Stock

1+ parts

$12.928

100+ parts

$12.282

1k+ parts

$11.635

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943

$12.928

$12.282

$11.635

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Lixinc

USA . 13,160 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,411 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,607 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 2,182 parts In-Stock

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Argo Parts USA

USA . 2,120 parts In-Stock

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2,120

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Overview

Experience seamless connectivity and superior performance with the CC1101QRHBRG4Q1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in cellphone ICs, ensuring reliability and efficiency. Perfect for automotive applications, this RF and baseband circuit offers a wide operating temperature range, high data rates, and low power consumption. Trust in Texas Instruments to provide cutting-edge technology that enhances your communication needs. Elevate your products with the CC1101QRHBRG4Q1 and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the cellphone IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during production.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance in harsh operating conditions.

Power Supplies (V): 1.8/3.6

Supports a wide range of power supply voltages, making it versatile for different applications.

No. of Terminals: 32

Provides ample connectivity options for various input and output signals, enhancing functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers multiple package styles to cater to different design requirements, allowing for flexibility in integration.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures without compromising performance, ideal for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably in cold environments, ensuring consistent performance in a wide range of conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and reliable electrical connections, contributing to the longevity of the product.

Terminal Position: QUAD

Quad terminal configuration allows for efficient signal routing and reduced interference, enhancing signal integrity.

Maximum Seated Height: 1 mm

Low profile design saves space in compact devices, facilitating sleek and slim product designs.

Width: 5 mm

Compact width allows for easier integration into densely populated circuit boards, optimizing space usage.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow processes during assembly, resulting in reliable connections.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during manufacturing, ensuring component integrity and reliability.

Length: 5 mm

Compact length enables space-saving designs and versatile placement options in electronic devices.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature tolerance and reliability, suitable for automotive applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces the risk of contamination.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and baseband circuits allows for comprehensive communication processing capabilities within the IC.

Nominal Supply Voltage: 3 V

Optimal supply voltage for efficient operation and performance of the cellphone IC in various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact design implementation in electronic devices.

Data Rate: 0.25 Mbps

Supports data transmission at a moderate speed, suitable for basic communication requirements in cellphones and similar devices.

Moisture Sensitivity Level (MSL): 2

With MSL 2 rating, the cellphone IC can withstand moderate exposure to moisture during handling and assembly processes.

Technical Specifications

Cellphone ICs CC1101QRHBRG4Q1 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Data Rate:

.25 Mbps

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CC1101QRHBRG4Q1 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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