Loading...

CC115LRTKT

Texas Instruments

CC115LRTKT by Texas Instruments

CC115LRTKT by Texas Instruments is a cellphone IC with a package style of chip carrier, suitable for RF and baseband circuits. It operates in industrial temperature range (-40 to 85°C) with a nominal voltage of 3.6V. This surface-mount device has 20 terminals, nickel palladium gold finish, and compact dimensions (4x4mm).

Median Price

$1.100

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 768 parts In-Stock

1+ parts

$1.100

100+ parts

$1.080

1k+ parts

$1.060

10k+ parts

-

768

$1.100

$1.080

$1.060

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,004

-

-

-

-

Digiode

USA . 1,591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,591

-

-

-

-

Nova Conductors

Japan . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Euro-Tech

UK . 55 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

55

-

-

-

-

Cogito LLC

Ukraine . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 671 parts In-Stock

1+ parts

$0.940

100+ parts

$0.916

1k+ parts

$0.912

10k+ parts

-

671

$0.940

$0.916

$0.912

-

Ampacity Inc.

Singapore . 352 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

352

$0.940

-

-

-

Parana Technologies

USA . 2,110 parts In-Stock

1+ parts

$6.129

100+ parts

-

1k+ parts

$6.898

10k+ parts

-

2,110

$6.129

-

$6.898

-

DigiPath Technology Company

USA . 1,184 parts In-Stock

1+ parts

$6.748

100+ parts

$6.208

1k+ parts

-

10k+ parts

-

1,184

$6.748

$6.208

-

-

IDEA Electronic Components Group

UK . 1,050 parts In-Stock

1+ parts

$6.886

100+ parts

-

1k+ parts

$6.197

10k+ parts

-

1,050

$6.886

-

$6.197

-

ChromeModa Solutions

Germany . 118 parts In-Stock

1+ parts

$6.886

100+ parts

$5.647

1k+ parts

-

10k+ parts

-

118

$6.886

$5.647

-

-

Corohmni

South Africa . 209 parts In-Stock

1+ parts

$7.360

100+ parts

-

1k+ parts

-

10k+ parts

-

209

$7.360

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$15.394

100+ parts

$14.009

1k+ parts

$12.623

10k+ parts

-

500

$15.394

$14.009

$12.623

-

AZTECH Wire

Italy . 719 parts In-Stock

1+ parts

$17.067

100+ parts

-

1k+ parts

-

10k+ parts

-

719

$17.067

-

-

-

Component Stockers USA

USA . 600 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$99.990

-

-

-

Continental Prestige Electronics

USA . 5,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,373

-

-

-

-

Corphita

USA . 4,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,779

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Argo Parts USA

USA . 2,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,407

-

-

-

-

Perfect Parts

USA . 332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

332

-

-

-

-

Bastille Electronics

Australia . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

120

-

-

-

-

Overview

Upgrade your cellphone performance with the Texas Instruments CC115LRTKT. Designed with high-quality materials and advanced technology, this RF and baseband circuit IC offers unmatched reliability and efficiency. With a compact square shape and surface mount design, this chip carrier provides seamless integration into your device. Whether you're enhancing connectivity or optimizing power consumption, this industrial-grade component delivers exceptional value and performance. Trust Texas Instruments for cutting-edge solutions that elevate your mobile experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, durable, and cost-effective, making the product suitable for mobile devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto circuit boards, saving time and reducing production costs.

Package Shape: SQUARE

Square package shape helps optimize space utilization on circuit boards, allowing for more components to be placed in a smaller area.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Nominal Supply Voltage: 3.6 V

Compatibility with a standard supply voltage of 3.6 V makes the product versatile and easy to integrate into various electronic devices.

Technical Specifications

Cellphone ICs CC115LRTKT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

CC115LRTKT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19