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HMC6000LP711E

Analog Devices

HMC6000LP711E by Analog Devices

Analog Devices' HMC6000LP711E is a cellphone IC with 60 terminals in a rectangular chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,302 parts In-Stock

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4,302

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Digiode

USA . 143 parts In-Stock

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143

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,204 parts In-Stock

1+ parts

$7.150

100+ parts

-

1k+ parts

$6.649

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2,204

$7.150

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$6.649

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AZTECH Wire

Italy . 876 parts In-Stock

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$7.430

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876

$7.430

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IDEA Electronic Components Group

UK . 538 parts In-Stock

1+ parts

$7.688

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$7.304

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538

$7.688

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$7.304

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DigiPath Technology Company

USA . 1,640 parts In-Stock

1+ parts

$11.993

100+ parts

$11.514

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$11.514

1,640

$11.993

$11.514

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$11.514

One Stop Electronics

USA . 961 parts In-Stock

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$212.000

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961

$212.000

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Semicontronic

India . 1,039 parts In-Stock

1+ parts

$361.000

100+ parts

$351.975

1k+ parts

$350.170

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1,039

$361.000

$351.975

$350.170

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Corphita

USA . 773 parts In-Stock

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773

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Overview

Unlock the potential of your cellphone with the cutting-edge HMC6000LP711E by Analog Devices. Manufactured with precision and expertise, this Cellphone IC delivers unparalleled performance and reliability. From RF to baseband circuits, this versatile component ensures seamless communication. Its sleek design and compact size make it ideal for a wide range of applications. Trust Analog Devices to provide you with quality products that exceed expectations. Experience the difference with the HMC6000LP711E and elevate your device to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight without compromising on durability, making it suitable for portable devices like cellphones.

Surface Mount: YES

Being surface mountable allows for easier assembly onto the PCB, saving space and enabling efficient manufacturing processes.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand heat without malfunctioning, ensuring reliable performance even in challenging conditions.

Nominal Supply Voltage: 2.7 V

The low nominal supply voltage helps in reducing power consumption, making the cellphone more energy-efficient and extending battery life.

Moisture Sensitivity Level (MSL): 3

Having MSL 3 rating means that the IC has a moderate level of sensitivity to moisture, making it suitable for use in environments with moderate humidity levels.

Technical Specifications

Cellphone ICs HMC6000LP711E attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PQCC-N60

JESD-609 Code:

e3

Length:

10.995 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

60

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.85 mm

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6.995 mm

Trade Compliance

HMC6000LP711E Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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