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HMC601LP4TR

Analog Devices

HMC601LP4TR by Analog Devices

Analog Devices' HMC601LP4TR is a 24-terminal cellphone IC in a square chip carrier package. Operating from -40 to 85 °C, it's an industrial-grade RF front end circuit with a nominal voltage of 3.3V. Ideal for telecom applications, this surface-mount IC has a very thin profile and no-lead terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,200 parts In-Stock

1+ parts

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6,200

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Digiode

USA . 430 parts In-Stock

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430

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,203 parts In-Stock

1+ parts

$6.920

100+ parts

-

1k+ parts

$6.436

10k+ parts

-

1,203

$6.920

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$6.436

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IDEA Electronic Components Group

UK . 122 parts In-Stock

1+ parts

$7.441

100+ parts

-

1k+ parts

$7.069

10k+ parts

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122

$7.441

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$7.069

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AZTECH Wire

Italy . 661 parts In-Stock

1+ parts

$11.037

100+ parts

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661

$11.037

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DigiPath Technology Company

USA . 1,389 parts In-Stock

1+ parts

$11.608

100+ parts

$11.144

1k+ parts

-

10k+ parts

$11.144

1,389

$11.608

$11.144

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$11.144

One Stop Electronics

USA . 1,104 parts In-Stock

1+ parts

$533.000

100+ parts

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1,104

$533.000

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Semicontronic

India . 455 parts In-Stock

1+ parts

$857.000

100+ parts

$835.575

1k+ parts

$831.290

10k+ parts

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455

$857.000

$835.575

$831.290

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Corphita

USA . 602 parts In-Stock

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602

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Overview

Enhance the performance of your cellphone with the HMC601LP4TR by Analog Devices. Known for their top-notch quality and reliability, Analog Devices brings you a cutting-edge RF front end circuit that is perfect for enhancing the signal quality and connectivity of your device. With a compact square shape and a very thin profile, this chip carrier offers superior performance in a small package. Whether you're looking to improve call clarity or enhance data speeds, the HMC601LP4TR is the perfect choice for your cellphone needs. Experience the difference today and stay connected like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

No. of Terminals: 24

With a sufficient number of terminals, this product can accommodate complex circuit designs and functionalities.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for usability in a wide range of temperature environments.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is common in many electronic devices, making this product compatible with various systems.

Technical Specifications

Cellphone ICs HMC601LP4TR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

HMC601LP4TR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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