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TRF370333IRGER

Texas Instruments

TRF370333IRGER by Texas Instruments

TRF370333IRGER by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 5V and max current of 235mA. This RF and baseband circuit has a terminal pitch of 0.5mm, making it suitable for industrial telecom applications.

Median Price

$11.034

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,500 parts In-Stock

1+ parts

$11.034

100+ parts

$8.996

1k+ parts

$5.997

10k+ parts

-

2,500

$11.034

$8.996

$5.997

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,500 parts In-Stock

1+ parts

$10.482

100+ parts

-

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3,500

$10.482

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Vyrian

USA . 6,183 parts In-Stock

1+ parts

-

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6,183

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Bristol Electronics

USA . 4,189 parts In-Stock

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4,189

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Sea View Technologies

USA . 2,713 parts In-Stock

1+ parts

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2,713

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Cyclops Electronics Ltd

UK . 2,609 parts In-Stock

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2,609

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 482 parts In-Stock

1+ parts

$8.820

100+ parts

-

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482

$8.820

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Corphita

USA . 4,951 parts In-Stock

1+ parts

$9.931

100+ parts

-

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4,951

$9.931

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Parana Technologies

USA . 756 parts In-Stock

1+ parts

$14.143

100+ parts

-

1k+ parts

$14.603

10k+ parts

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756

$14.143

-

$14.603

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DigiPath Technology Company

USA . 1,586 parts In-Stock

1+ parts

$15.573

100+ parts

$14.327

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1,586

$15.573

$14.327

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ChromeModa Solutions

Germany . 2,264 parts In-Stock

1+ parts

$15.891

100+ parts

$13.031

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-

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2,264

$15.891

$13.031

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IDEA Electronic Components Group

UK . 394 parts In-Stock

1+ parts

$15.891

100+ parts

$15.096

1k+ parts

$14.302

10k+ parts

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394

$15.891

$15.096

$14.302

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Authorized Procurement Solutions

USA . 24,000 parts In-Stock

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24,000

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Lixinc

USA . 9,722 parts In-Stock

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9,722

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S.R.D Solutions

India . 9,000 parts In-Stock

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9,000

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A-Z Elektronik GmbH

Germany . 6,267 parts In-Stock

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6,267

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Cyclops Electronics Ltd (Excess)

UK . 301 parts In-Stock

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301

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Overview

Elevate your cellphone's performance with the TRF370333IRGER by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability. This RF and baseband circuit IC is designed for optimal power efficiency and performance, ensuring seamless connectivity and enhanced user experience. With its compact size and advanced features, this product offers exceptional value and benefits to customers looking to upgrade their mobile devices. Experience the difference with Texas Instruments' cutting-edge technology in cellphone ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the cellphone ICs.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in various environmental conditions, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, expanding the range of applications for the product.

Telecom IC Type: RF AND BASEBAND CIRCUIT

This versatile IC type allows for efficient communication and data processing within a cellphone, enhancing its overall performance.

Technical Specifications

Cellphone ICs TRF370333IRGER attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

235 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TRF370333IRGER Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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