Loading...

CC1150RSTRG3

Texas Instruments

CC1150RSTRG3 by Texas Instruments

The Texas Instruments CC1150RSTRG3 is a cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 1.8/3.6V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits in industrial telecom applications due to its CMOS technology and compact size.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,771 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,771

-

-

-

-

Digiode

USA . 4,697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,697

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 861 parts In-Stock

1+ parts

$14.087

100+ parts

-

1k+ parts

-

10k+ parts

-

861

$14.087

-

-

-

Parana Technologies

USA . 1,676 parts In-Stock

1+ parts

$15.151

100+ parts

-

1k+ parts

$15.554

10k+ parts

-

1,676

$15.151

-

$15.554

-

DigiPath Technology Company

USA . 2,340 parts In-Stock

1+ parts

$16.684

100+ parts

$15.349

1k+ parts

-

10k+ parts

-

2,340

$16.684

$15.349

-

-

ChromeModa Solutions

Germany . 5,442 parts In-Stock

1+ parts

$17.024

100+ parts

$13.960

1k+ parts

-

10k+ parts

-

5,442

$17.024

$13.960

-

-

IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$17.024

100+ parts

$16.173

1k+ parts

$15.322

10k+ parts

-

2,087

$17.024

$16.173

$15.322

-

Native Components

USA . 319 parts In-Stock

1+ parts

$23.590

100+ parts

-

1k+ parts

-

10k+ parts

-

319

$23.590

-

-

-

Northwest PG Solutions

USA . 1,823 parts In-Stock

1+ parts

$25.949

100+ parts

$23.354

1k+ parts

-

10k+ parts

-

1,823

$25.949

$23.354

-

-

One Stop Electronics

USA . 985 parts In-Stock

1+ parts

$867.000

100+ parts

-

1k+ parts

-

10k+ parts

-

985

$867.000

-

-

-

Corphita

USA . 2,888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,888

-

-

-

-

Overview

Unleash the power of connectivity with the CC1150RSTRG3 by Texas Instruments, a top-quality cellphone IC that delivers unparalleled performance and reliability. As a trusted manufacturer in the industry, Texas Instruments ensures cutting-edge technology and innovation in every product they create. The CC1150RSTRG3 is perfect for a wide range of applications, offering seamless integration and superior functionality. Experience the value and benefits of this outstanding product, designed to meet your needs and exceed your expectations. Elevate your projects with the CC1150RSTRG3 and stay ahead in today's fast-paced world of communication technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and costs in manufacturing.

Power Supplies (V): 1.8/3.6

Support for multiple power supply voltages allows for flexibility in design and compatibility with different systems.

No. of Terminals: 16

Having a higher number of terminals allows for more connections and functionality in the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and maintain reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable in operation.

Technical Specifications

Cellphone ICs CC1150RSTRG3 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

Maximum Seated Height:

.95 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

CC1150RSTRG3 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20