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ADS58C20IPFP

Texas Instruments

ADS58C20IPFP by Texas Instruments

Texas Instruments ADS58C20IPFP is an 80-terminal cellphone IC with a max analog input of 3.45V, operating b/w -40 to 85°C. It features a flatpack package style, gull wing terminal form, and is suitable for RF and baseband circuit applications in the telecom industry.

Median Price

$125.482

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 46 parts In-Stock

1+ parts

$30.840

100+ parts

-

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46

$30.840

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Chip1Stop

Japan . 46 parts In-Stock

1+ parts

$114.400

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-

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46

$114.400

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Texas Instruments

USA . 3,955 parts In-Stock

1+ parts

$125.482

100+ parts

$121.708

1k+ parts

$94.347

10k+ parts

-

3,955

$125.482

$121.708

$94.347

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Verical

USA . 46 parts In-Stock

1+ parts

$129.095

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46

$129.095

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Rochester

USA . 28 parts In-Stock

1+ parts

$129.420

100+ parts

$121.650

1k+ parts

$113.890

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-

28

$129.420

$121.650

$113.890

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DigiKey

USA . 28 parts In-Stock

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28

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Distributors (In-Stock)

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Digiode

USA . 780 parts In-Stock

1+ parts

$108.680

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780

$108.680

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DigiKey Marketplace

USA . 28 parts In-Stock

1+ parts

$136.290

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28

$136.290

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Vyrian

USA . 6,509 parts In-Stock

1+ parts

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6,509

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Connector Distribution Corp

USA . 26 parts In-Stock

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26

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Right Parts Inc.

USA . 26 parts In-Stock

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26

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,800 parts In-Stock

1+ parts

$6.029

100+ parts

-

1k+ parts

$6.804

10k+ parts

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1,800

$6.029

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$6.804

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DigiPath Technology Company

USA . 1,778 parts In-Stock

1+ parts

$6.639

100+ parts

$6.107

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1,778

$6.639

$6.107

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Native Components

USA . 832 parts In-Stock

1+ parts

$6.642

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832

$6.642

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ChromeModa Solutions

Germany . 3,589 parts In-Stock

1+ parts

$6.774

100+ parts

$5.555

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3,589

$6.774

$5.555

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IDEA Electronic Components Group

UK . 440 parts In-Stock

1+ parts

$6.774

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$6.097

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440

$6.774

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$6.097

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Corphita

USA . 3,972 parts In-Stock

1+ parts

$102.960

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3,972

$102.960

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Lixinc

USA . 19,652 parts In-Stock

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19,652

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A-Z Elektronik GmbH

Germany . 7,097 parts In-Stock

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7,097

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Alle Elektronik GmbH

Germany . 4,731 parts In-Stock

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4,731

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QUARKTWIN TECHNOLOGY LTD

USA . 3,215 parts In-Stock

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3,215

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Northwest PG Solutions

USA . 875 parts In-Stock

1+ parts

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$6.509

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875

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$6.509

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Metaverse IC Inc.

Canada . 178 parts In-Stock

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178

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Kepictronics

USA . 70 parts In-Stock

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70

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Overview

Upgrade your cellphone experience with the ADS58C20IPFP by Texas Instruments, a high-quality Cellphone IC that delivers top-notch performance and reliability. Manufactured by industry leader Texas Instruments, this IC offers cutting-edge technology and seamless integration for a wide range of applications. With its advanced features and durable construction, this product ensures optimal functionality and longevity. Trust Texas Instruments for superior quality and innovation in cellphone ICs, and elevate your device's performance to new heights with the ADS58C20IPFP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for mobile applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and simplifying assembly processes.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding environmental conditions without sacrificing performance.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The inclusion of RF and baseband circuitry in this IC makes it suitable for cellphone applications, providing reliable signal processing capabilities.

Technical Specifications

Cellphone ICs ADS58C20IPFP attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Maximum Analog Input:

3.45 V

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

ADS58C20IPFP Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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