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ADS58C23IPFP

Texas Instruments

ADS58C23IPFP by Texas Instruments

The Texas Instruments ADS58C23IPFP is an 80-terminal cellphone IC with a max analog input of 3.45V and operating temperatures ranging from -40 to 85°C. This RF and baseband circuit features a flatpack package style, gull wing terminal form, and thin profile for industrial telecom applications.

Median Price

$105.011

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,837 parts In-Stock

1+ parts

$105.011

100+ parts

$101.853

1k+ parts

$78.956

10k+ parts

-

4,837

$105.011

$101.853

$78.956

-

Rochester

USA . 6,090 parts In-Stock

1+ parts

-

100+ parts

$98.700

1k+ parts

$88.310

10k+ parts

$83.110

6,090

-

$98.700

$88.310

$83.110

DigiKey

USA . 6,090 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,090

-

-

-

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Verical

USA . 5,280 parts In-Stock

1+ parts

-

100+ parts

$123.375

1k+ parts

$110.388

10k+ parts

$103.888

5,280

-

$123.375

$110.388

$103.888

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,221 parts In-Stock

1+ parts

$99.760

100+ parts

-

1k+ parts

-

10k+ parts

-

1,221

$99.760

-

-

-

Vyrian

USA . 1,528 parts In-Stock

1+ parts

$105.011

100+ parts

-

1k+ parts

-

10k+ parts

-

1,528

$105.011

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 787 parts In-Stock

1+ parts

$1.245

100+ parts

-

1k+ parts

-

10k+ parts

-

787

$1.245

-

-

-

Northwest PG Solutions

USA . 1,867 parts In-Stock

1+ parts

$1.370

100+ parts

-

1k+ parts

-

10k+ parts

-

1,867

$1.370

-

-

-

Parana Technologies

USA . 1,769 parts In-Stock

1+ parts

$11.258

100+ parts

-

1k+ parts

$11.693

10k+ parts

-

1,769

$11.258

-

$11.693

-

DigiPath Technology Company

USA . 974 parts In-Stock

1+ parts

$12.396

100+ parts

$11.404

1k+ parts

-

10k+ parts

-

974

$12.396

$11.404

-

-

ChromeModa Solutions

Germany . 1,915 parts In-Stock

1+ parts

$12.649

100+ parts

$10.372

1k+ parts

-

10k+ parts

-

1,915

$12.649

$10.372

-

-

IDEA Electronic Components Group

UK . 860 parts In-Stock

1+ parts

$12.649

100+ parts

$12.017

1k+ parts

$11.384

10k+ parts

-

860

$12.649

$12.017

$11.384

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Corphita

USA . 2,429 parts In-Stock

1+ parts

$94.510

100+ parts

-

1k+ parts

-

10k+ parts

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2,429

$94.510

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-

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A-Z Elektronik GmbH

Germany . 7,017 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,017

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-

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Alle Elektronik GmbH

Germany . 4,678 parts In-Stock

1+ parts

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4,678

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Authorized Procurement Solutions

USA . 3,400 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,400

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-

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Kepictronics

USA . 80 parts In-Stock

1+ parts

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100+ parts

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80

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Overview

Unlock the power of cutting-edge technology with the ADS58C23IPFP by Texas Instruments, a leading manufacturer known for its high-quality products. This cellphone IC offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From enhancing signal processing to improving overall functionality, this product provides unmatched value and benefits to customers looking to stay ahead in today's fast-paced tech world. Trust Texas Instruments to deliver innovation that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product suitable for portable devices like cellphones.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the IC onto a circuit board, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape offers a balanced footprint and facilitates efficient PCB layout design.

No. of Terminals: 80

Having 80 terminals provides ample connectivity options for various functions in a cellphone application.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the IC can withstand high temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40°C to 85°C ensures reliable operation in diverse environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The NICKEL PALLADIUM GOLD terminal finish offers excellent corrosion resistance and ensures long-term reliability.

Width: 12 mm

With a width of 12mm, the IC can fit into compact and slim cellphone designs.

Maximum Analog Input: 3.45 V

The high maximum analog input voltage of 3.45V allows for versatile signal processing capabilities.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during assembly processes.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC can withstand harsh operating conditions in industrial environments.

Terminal Form: GULL WING

The GULL WING terminal form facilitates easy inspection and rework during the assembly process.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The RF AND BASEBAND CIRCUIT type is specifically designed for efficient communication and data processing in cellular network systems.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the IC can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Cellphone ICs ADS58C23IPFP attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Maximum Analog Input:

3.45 V

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

ADS58C23IPFP Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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