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CC2510F8RSPR

Texas Instruments

CC2510F8RSPR by Texas Instruments

CC2510F8RSPR by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.5/3.3V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits in industrial telecom applications due to its CMOS technology and compact size (6x6mm).

Median Price

$2.710

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30,372 parts In-Stock

1+ parts

$2.710

100+ parts

$2.660

1k+ parts

$2.600

10k+ parts

-

30,372

$2.710

$2.660

$2.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,882 parts In-Stock

1+ parts

-

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6,882

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Digiode

USA . 4,569 parts In-Stock

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4,569

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Cyclops Electronics Ltd

UK . 734 parts In-Stock

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734

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Distributors (Availability)

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Parana Technologies

USA . 29 parts In-Stock

1+ parts

$9.863

100+ parts

-

1k+ parts

$10.435

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29

$9.863

-

$10.435

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DigiPath Technology Company

USA . 1,283 parts In-Stock

1+ parts

$10.860

100+ parts

$9.992

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-

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1,283

$10.860

$9.992

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ChromeModa Solutions

Germany . 4,228 parts In-Stock

1+ parts

$11.082

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$9.087

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4,228

$11.082

$9.087

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IDEA Electronic Components Group

UK . 1,932 parts In-Stock

1+ parts

$11.082

100+ parts

$10.528

1k+ parts

$9.974

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-

1,932

$11.082

$10.528

$9.974

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AZTECH Wire

Italy . 424 parts In-Stock

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$12.976

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424

$12.976

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One Stop Electronics

USA . 1,000 parts In-Stock

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$507.000

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1,000

$507.000

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Kepictronics

USA . 50,000 parts In-Stock

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GreenTree Electronics

Israel . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,452 parts In-Stock

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7,452

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Alle Elektronik GmbH

Germany . 4,968 parts In-Stock

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4,968

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 1,986 parts In-Stock

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1,986

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Assy Fe

Spain . 1,000 parts In-Stock

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Northwest PG Solutions

USA . 148 parts In-Stock

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148

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Native Components

USA . 129 parts In-Stock

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129

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Overview

Unlock the potential of your cellphone with the Texas Instruments CC2510F8RSPR. Manufactured by a leader in the industry, this Cellphone IC offers unmatched quality and reliability. With a wide range of applications in the telecommunications sector, this product delivers exceptional performance and efficiency. Experience the value and benefits of seamless connectivity and optimized power supplies with the CC2510F8RSPR. Trust Texas Instruments for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, making this product suitable for high volume production.

Package Shape: SQUARE

The square package shape provides better thermal dissipation and allows for a more compact design.

Power Supplies (V): 2.5/3.3

Supporting multiple power supply voltages allows for versatile compatibility with various systems and devices.

No. of Terminals: 36

Having 36 terminals enables a higher level of connectivity and functionality in the cellphone ICs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier and thin profile design with heat sink ensures efficient heat dissipation and compact integration of the ICs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the ICs can withstand harsh environmental conditions and deliver reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the ICs can operate in extremely cold environments without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances the conductivity and durability of the terminals, improving overall reliability.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of signals and power, optimizing performance and signal integrity.

Maximum Seated Height: 0.9 mm

The low maximum seated height makes the ICs suitable for slim and compact cellphone designs.

Width: 6 mm

The compact width of the ICs enables them to be easily integrated into small form factor devices without occupying too much space.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the ICs can withstand the soldering process without any damage, ensuring robust assembly.

Length: 6 mm

The compact length of the ICs further contributes to their suitability for small and portable cellphone designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the ICs can operate reliably in a wide range of temperature conditions typically found in industrial environments.

Technology: CMOS

The CMOS technology used in the ICs provides low power consumption and high speed performance, making them ideal for cellphone applications.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and compliant with RoHS regulations, making the product more sustainable.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The inclusion of RF and baseband circuit technology in the ICs ensures high-quality wireless communication capabilities for the cellphone.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is commonly used in cellphone applications, ensuring compatibility and efficient power consumption.

Terminal Pitch: 0.5 mm

The tight terminal pitch allows for high density mounting of the ICs, maximizing functionality in a limited space.

Moisture Sensitivity Level (MSL): 3

The MSL of 3 indicates that the ICs can withstand moderate levels of moisture exposure, ensuring reliability in varied operating environments.

Technical Specifications

Cellphone ICs CC2510F8RSPR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC2510F8RSPR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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