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HMC687LP4ETR

Analog Devices

HMC687LP4ETR by Analog Devices

Analog Devices' HMC687LP4ETR is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial telecom applications. With matte tin finish and 5V supply voltage, it's ideal for RF and baseband circuits requiring surface mount assembly.

Median Price

$21.210

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 395 parts In-Stock

1+ parts

-

100+ parts

$21.210

1k+ parts

$18.980

10k+ parts

$17.860

395

-

$21.210

$18.980

$17.860

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 538 parts In-Stock

1+ parts

$22.448

100+ parts

-

1k+ parts

-

10k+ parts

-

538

$22.448

-

-

-

Vyrian

USA . 3,437 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,437

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,216 parts In-Stock

1+ parts

$11.160

100+ parts

-

1k+ parts

$10.379

10k+ parts

-

1,216

$11.160

-

$10.379

-

IDEA Electronic Components Group

UK . 774 parts In-Stock

1+ parts

$12.000

100+ parts

$11.400

1k+ parts

$11.400

10k+ parts

-

774

$12.000

$11.400

$11.400

-

DigiPath Technology Company

USA . 1,722 parts In-Stock

1+ parts

$18.720

100+ parts

$17.971

1k+ parts

-

10k+ parts

$17.971

1,722

$18.720

$17.971

-

$17.971

Semicontronic

India . 429 parts In-Stock

1+ parts

$20.090

100+ parts

$19.588

1k+ parts

$19.487

10k+ parts

-

429

$20.090

$19.588

$19.487

-

Corphita

USA . 231 parts In-Stock

1+ parts

$21.267

100+ parts

-

1k+ parts

-

10k+ parts

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231

$21.267

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 15,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,458

-

-

-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

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Overview

Enhance the performance of your cellphone with the HMC687LP4ETR by Analog Devices. Manufactured with superior quality and expertise, this cellphone IC offers unmatched value and benefits to customers. Perfect for RF and baseband circuits, this product is designed for industrial-grade applications, ensuring reliability and efficiency. With a compact square package style and surface mount capabilities, the HMC687LP4ETR provides seamless integration and optimal functionality. Upgrade your device today with this cutting-edge technology from Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices like cellphones.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto the PCB, saving space and simplifying the manufacturing process.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, optimizing the layout of components in the cellphone design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand extended use in various environmental conditions without overheating.

Technology: BICMOS

The use of BiCMOS technology combines the benefits of both bipolar and CMOS technologies, providing high-speed performance and low power consumption for the cellphone IC.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage makes the IC compatible with a wide range of electronic systems, ensuring versatility and ease of integration.

Technical Specifications

Cellphone ICs HMC687LP4ETR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

HMC687LP4ETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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