Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CC2510F32RSPRG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.5/3.3V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits in industrial telecom applications due to its CMOS technology and compact size.
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$6.713
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$6.042
AZTECH Wire
$17.298
Native Components
$49.720
$47.731
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$54.692
Ampacity Inc.
$340.000
Semicontronic
$870.000
$848.250
$843.900
One Stop Electronics
$968.000
Corphita
DigiPath Technology Company
$6.052
Corohmni
Surface mount technology allows for easy and efficient assembly on PCBs, making this IC a convenient choice for manufacturers.
The square package shape saves space on PCBs and allows for efficient layout design, making this IC ideal for compact devices.
Support for multiple power supplies gives flexibility in design and compatibility with different voltage requirements in cellphones.
With a high number of terminals, this IC offers more connectivity options and functionality for cellphone applications.
The various package styles offer versatility in thermal management and form factor options for cellphone designs.
The high maximum operating temperature range ensures reliability and performance in different environmental conditions.
The low minimum operating temperature range allows for use in extreme cold environments without compromising functionality.
The terminal finish provides excellent conductivity and corrosion resistance for reliable connections in cellphone circuits.
The quad terminal position offers increased stability and secure connections when soldered onto PCBs.
The low maximum seated height allows for slim and compact cellphone designs while ensuring proper clearance on the PCB.
The small width dimension saves space on the PCB and contributes to a more compact overall design for cellphones.
The short maximum time at peak reflow temperature ensures quick and efficient soldering during manufacturing processes.
The high peak reflow temperature capability allows for reliable soldering connections during the assembly process.
The compact length dimension contributes to space-saving design considerations for cellphone PCB layouts.
The industrial temperature grade ensures reliable performance in harsh operating conditions commonly encountered in cellphone usage.
Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high speed, making this IC energy-efficient and fast for cellphone applications.
The no-lead terminal form is environmentally friendly and compliant with RoHS regulations for reducing hazardous substances in electronics.
Support for both RF and baseband circuit integration in a single IC simplifies design complexity and optimizes performance for cellular communication.
The 3V nominal supply voltage aligns with common voltage requirements in cellphone circuits, ensuring compatibility and stable operation.
The small terminal pitch enables high-density integration and efficient routing of signals on the PCB, enhancing overall performance and functionality.
Moisture sensitivity level 3 indicates moderate sensitivity to moisture exposure, prompting proper handling and storage to maintain product quality.
Cellphone ICs CC2510F32RSPRG3 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
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No. of Terminals:
Maximum Operating Temperature:
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CC2510F32RSPRG3 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
1N4148WS-7-F
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
2N2222A
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
LL4148
Semtech Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Lite-on Semiconductor
1N4148
Philips Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
HPA01083RGVR
Texas Instruments' HPA01083RGVR is a cellphone IC with 16 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for RF and baseband circuits. With a compact size of 4x4mm and no-lead terminal form, it suits industrial telecom applications.
ADF7020BCP
Analog Devices
Analog Devices' ADF7020BCP is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The chip carrier package style with a square shape makes it suitable for industrial temperature-grade applications.
MAX2044ETP+
MAX2044ETP+ by Analog Devices is a Cellphone IC with 20 terminals, operating at -40 to 85 °C. It features BICMOS technology, RF and baseband circuit for telecom applications, and requires 3.3V nominal voltage. The package style is chip carrier with a very thin profile, suitable for surface mount applications.
SI4713-B30-GM
Silicon Labs
SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.
LMH2120UMX
LMH2120UMX by Texas Instruments is a Cellphone IC with RF and baseband circuit. It features 6 terminals in a rectangular grid array package style, suitable for telecom applications. Operating temperature ranges from -40 to 85°C, making it ideal for industrial use.
TLV320AC57IPT
TLV320AC57IPT by Texas Instruments is a 48-terminal cellphone IC with 3V supply voltage, operating from -40 to 85°C. It features A-LAW companding law, 13-bit linear coding, and a baseband circuit for telecom applications. The package is a low-profile flatpack with gull wing terminals, suitable for industrial temperature grades.
ADF4360-8BCPZRL7
Analog Devices' ADF4360-8BCPZRL7 is a cellphone IC with 24 terminals, BICMOS technology, and 3.3V supply voltage. It operates in industrial temperature range (-40 to 85°C) and has a square package suitable for surface mount applications. Ideal for baseband circuits in telecommunications due to its compact size (4x4mm) and low profile design (1mm).
HMC485MS8GE
Analog Devices' HMC485MS8GE is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
MAX5865ETM+T
Analog Devices' MAX5865ETM+T is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit make it ideal for industrial telecom applications. Matte Tin finish, 0.8mm height, and 3V supply voltage are key specs for this versatile IC.
CC2400RSU
CC2400RSU by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, CMOS technology, and a nominal voltage of 1.8V for telecom applications.
AD8340ACPZ-REEL7
AD8340ACPZ-REEL7 by Analog Devices is a cellphone IC with 24 terminals, operating at -40 to 85 °C. It features a 5V supply, 0.15mA current, and RF/baseband circuitry. This square-shaped chip carrier is surface-mountable and has a very thin profile for industrial telecom applications.
NRF24L01-REEL7
Nordic Semiconductor Asa
NRF24L01-REEL7 by Nordic Semiconductor Asa is a cellphone IC with 20 terminals, operating from -40 to 85°C. It features a square package shape, matte tin finish, and RF/baseband circuit type. Ideal for industrial applications due to its low profile and no lead terminal form.
MAX2150ETI+T
Analog Devices' MAX2150ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. It operates at -40 to 85 °C, with power supplies of 3/3.3V and max supply current of 0.107mA. Ideal for RF and baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.
HMC696LP4ETR
HMC696LP4ETR by Analog Devices is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with a supply voltage of 5V and max current of 0.18mA. Ideal for baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.
MAX19995ETX+
MAX19995ETX+ by Analog Devices is a 36-terminal cellphone IC with BICMOS technology. It operates b/w -40 to 85 °C, has a package style of chip carrier, and matte tin terminal finish. Ideal for RF front end circuits in telecom applications due to its compact square shape and industrial temperature grade.
LMH6521SQ/NOPB
LMH6521SQ/NOPB by Texas Instruments is a cellphone IC with 2 channels, RF and baseband circuit. It operates in industrial temperature range (-40 to 85°C) with a supply voltage of 5V. With a max gain tolerance of 26dB, it is suitable for telecom applications requiring high performance in compact square chip carrier package.
HMC832LP6GETR
Analog Devices' HMC832LP6GETR is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.
LMV225URX
LMV225URX by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature grades from -40 to 85°C, suitable for RF and baseband circuits in telecom applications. The IC has a nominal voltage of 2.7V and features surface mount technology with tin lead terminal finish.
LENA-R8001M10-00C
U-blox Ag
RF AND BASEBAND CIRCUIT;
TRF370315IRGET
TRF370315IRGET by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, max current of 235mA, and RF/baseband circuit type. Ideal for telecom applications due to its compact square chip carrier package and surface-mount capability.
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC2510F32RHHR
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
CC2591RGVR
RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
CC2591RGVRG4
CC2510F8RSPR
CC2510F8RHHT
CC2510F8RSP
CC2510F16RHHR
CC2511F16RSP
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
CC2510F16RSPG3
CC2510F32RSP
CC2510F32RSPG3
CC2510F8RHHR
CC2510F32RHH
CC2510F16RSP
CC2510F16RSPR
CC2510F32RSPR
CC2510F32RHHT
CC2510F16RHH
CC2510F16RHHT
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