Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Infineon's OC2321VQFN8XTMA2 is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40°C to 105°C, suitable for RF and baseband circuits. The PLASTIC/EPOXY material, NO LEAD terminal form, and 1.8V supply voltage make it ideal for compact mobile devices.
Median Price
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Rochester
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100+ parts
$3.330
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$2.980
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$2.800
Verical
$4.162
$3.725
$3.500
Nova Conductors
$3.400
Digiode
$3.524
Vyrian
Semicontronic
$3.150
$3.071
$3.056
Ampacity Inc.
Corphita
$3.339
Continental Prestige Electronics
$3.332
Argo Parts USA
Advanced Electronics
$3.944
$3.628
Bastille Electronics
This material offers a good balance of durability and cost-effectiveness, making it a practical choice for cellphones.
Being surface mountable allows for easier and more efficient PCB assembly, reducing overall production time and costs.
The rectangular shape is space-efficient and easy to integrate into a variety of designs, providing flexibility in product development.
With a sufficient number of terminals, this IC can support complex circuitry and functionalities, making it suitable for advanced cellphone applications.
This package style combines compact size with efficient heat dissipation, ideal for slim and high-performance cellphone designs.
The high maximum operating temperature ensures reliable performance even under demanding usage conditions, enhancing the longevity of the device.
With a low minimum operating temperature, this IC remains functional in cold environments, increasing its versatility and reliability.
Dual terminal positions provide additional connection options, enabling more versatile circuit designs and configurations in cellphones.
The low seated height allows for a compact and sleek design, perfect for thin and lightweight cellphone models.
The moderate width of the IC provides a good balance between space efficiency and ease of handling during the manufacturing process.
The compact length of the IC contributes to a space-saving design, making it suitable for smaller cellphone form factors.
The no-lead terminal form simplifies PCB assembly and promotes environmental sustainability, making it an eco-friendly choice for cellphone manufacturers.
The integration of RF and baseband circuits in a single IC offers enhanced performance and efficiency, making it a valuable component for cellphone communication systems.
The low nominal supply voltage helps to conserve battery power, prolonging the battery life of cellphones and improving overall energy efficiency.
The small terminal pitch allows for high-density mounting, enabling more compact and feature-rich cellphone designs.
Cellphone ICs OC2321VQFN8XTMA2 attributes and parameters. Explore more Cellphone ICs devices from Infineon Technologies
JESD-30 Code:
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OC2321VQFN8XTMA2 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SMBJ18CA
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
KYOCERA AVX
LM555CN
Texas Instruments
LM555CN by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V. It operates b/w 0°C to 70°C, making it suitable for commercial applications. This rectangular package IC has dual terminals and uses bipolar technology for pulse generation in various electronic circuits.
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
MURS160T3G
Onsemi
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
Meritek Electronics
MMBT2907ALT1G
MMBT2907ALT1G by Onsemi is a PNP BJT transistor with 100 min hFE, 60V VCEO, and 200MHz fT. Ideal for switching applications, it has a small outline package with Gull Wing terminals and can handle up to 0.6A of collector current.
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
Yageo
1N4148WS
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
Bkc Semiconductors
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
SI4721-B20-GMR
Silicon Labs
Silicon Labs' SI4721-B20-GMR is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this IC has a compact size of 3x3mm suitable for surface mount designs.
CC2400-STR1
CC2400-STR1 by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include CMOS technology, RF and baseband circuit for telecom applications, and nominal voltage of 1.8V.
LMH2110TM/NOPB
LMH2110TM/NOPB by Texas Instruments is a Cellphone IC with 6 terminals in a rectangular grid array package. It operates b/w -40 to 85°C, with a supply current of 5.5mA at 4.5V. This RF and baseband circuit is ideal for telecom applications due to its thin profile and fine pitch design.
HMC696LP4E
Analog Devices' HMC696LP4E is a cellphone IC in a square chip carrier package with 24 terminals. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 5V, it is ideal for baseband circuit applications in telecommunications.
ADF4360-4BCPZRL
Analog Devices' ADF4360-4BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, quad terminal position, and matte tin finish. Ideal for baseband circuits in telecom applications, it has a compact square package with a very thin profile and can withstand industrial temperatures from -40 to 85°C.
AD8366ACPZ-R7
AD8366ACPZ-R7 by Analog Devices is a Cellphone IC with 2 functions, operating at -40 to 85 °C. It features a square package style, 32 terminals, and matte tin finish. Ideal for telecom applications as a baseband circuit with a nominal voltage of 5V.
MAX2308ETI+T
Analog Devices' MAX2308ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. It operates at -40 to 85 °C, with power supplies of 3/3.3V and max supply current of 0.0415mA. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and is suitable for industrial temperature grade applications.
SARA-R422-01B
U-blox Ag
RF AND BASEBAND CIRCUIT;
SARA-R422M10S-01B
CC1050PWRG3
CC1050PWRG3 by Texas Instruments is a cellphone IC with 24 terminals, operating at 2.5/3.3V. It features a small outline package style and CMOS technology for RF and baseband circuits. With a temperature range of -40 to 85°C, it is ideal for industrial telecom applications.
MAX2609EUT+
MAX2609EUT+ by Analog Devices is a Cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. Telecom IC type: Baseband Circuit, with nominal voltage of 2.75V for cellphone applications.
LMH2100TM/NOPB
LMH2100TM/NOPB by Texas Instruments is a Cellphone IC with 6 terminals in a rectangular package. It operates b/w -40 to 85°C, with a supply current of 9.2mA at 2.7V. Ideal for RF and baseband circuits due to its thin profile and fine pitch grid array design.
1166
The Texas Instruments 1166 is a cellphone IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, RF and baseband circuit for telecom applications at 3V supply voltage.
MAX2042AETP+T
Analog Devices' MAX2042AETP+T is a cellphone IC with 20 terminals, operating at -40 to 85 °C. It features a supply voltage of 3.3V/5V, RF and baseband circuit for telecom applications, and CMOS technology in a square chip carrier package.
ADL5561ACPZ-R7
ADL5561ACPZ-R7 by Analog Devices is a 16-terminal cellphone IC with a square shape and chip carrier package style. It operates b/w -40 to 85°C, suitable for industrial telecom applications. With a nominal voltage of 3.3V, it features RF and baseband circuits for high-performance communication systems.
SKY73208-11
Skyworks Solutions
SKY73208-11 by Skyworks Solutions is a cellphone IC with BICMOS technology. It operates b/w -40 to 85°C, has 36 terminals in a square package, and requires 3.3V supply voltage. Ideal for RF and baseband circuits, it features a compact size of 6x6mm for telecom applications.
TEF8102EN/N1Y
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 2; Peak Reflow Temperature (C): 260;
CC1151QRHBRG4Q1
CC1151QRHBRG4Q1 by Texas Instruments is a Cellphone IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 125 °C, suitable for automotive applications. It features RF and baseband circuit for data rate of 0.25 Mbps, with power supplies at 1.8/3.6 V.
CC115LRGPT
CC115LRGPT by Texas Instruments is a cellphone IC with a square package and 20 terminals. It operates at temperatures ranging from -40 to 85 °C and has a data rate of 0.6 Mbps. This RF and baseband circuit is suitable for telecom applications.
HMC832ALP6GE
Analog Devices' HMC832ALP6GE is a 40-terminal cellphone IC with a square package shape and industrial temperature grade. It operates b/w -40 to 85°C, suitable for RF and baseband circuits in telecom applications. This surface-mount IC has a nominal voltage of 3.3V and terminal pitch of 0.5mm, making it ideal for compact designs requiring high performance.
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