Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Infineon's OC2321VQFN8XTMA2 is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40°C to 105°C, suitable for RF and baseband circuits. The PLASTIC/EPOXY material, NO LEAD terminal form, and 1.8V supply voltage make it ideal for compact mobile devices.
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$2.980
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$4.162
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$3.400
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$3.524
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$3.150
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Ampacity Inc.
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$3.339
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$3.332
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Bastille Electronics
This material offers a good balance of durability and cost-effectiveness, making it a practical choice for cellphones.
Being surface mountable allows for easier and more efficient PCB assembly, reducing overall production time and costs.
The rectangular shape is space-efficient and easy to integrate into a variety of designs, providing flexibility in product development.
With a sufficient number of terminals, this IC can support complex circuitry and functionalities, making it suitable for advanced cellphone applications.
This package style combines compact size with efficient heat dissipation, ideal for slim and high-performance cellphone designs.
The high maximum operating temperature ensures reliable performance even under demanding usage conditions, enhancing the longevity of the device.
With a low minimum operating temperature, this IC remains functional in cold environments, increasing its versatility and reliability.
Dual terminal positions provide additional connection options, enabling more versatile circuit designs and configurations in cellphones.
The low seated height allows for a compact and sleek design, perfect for thin and lightweight cellphone models.
The moderate width of the IC provides a good balance between space efficiency and ease of handling during the manufacturing process.
The compact length of the IC contributes to a space-saving design, making it suitable for smaller cellphone form factors.
The no-lead terminal form simplifies PCB assembly and promotes environmental sustainability, making it an eco-friendly choice for cellphone manufacturers.
The integration of RF and baseband circuits in a single IC offers enhanced performance and efficiency, making it a valuable component for cellphone communication systems.
The low nominal supply voltage helps to conserve battery power, prolonging the battery life of cellphones and improving overall energy efficiency.
The small terminal pitch allows for high-density mounting, enabling more compact and feature-rich cellphone designs.
Cellphone ICs OC2321VQFN8XTMA2 attributes and parameters. Explore more Cellphone ICs devices from Infineon Technologies
JESD-30 Code:
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OC2321VQFN8XTMA2 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
LL4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
STM32F103C8T6
STMicroelectronics
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
MMBT2907ALT1G
Onsemi
MMBT2907ALT1G by Onsemi is a PNP BJT transistor with 100 min hFE, 60V VCEO, and 200MHz fT. Ideal for switching applications, it has a small outline package with Gull Wing terminals and can handle up to 0.6A of collector current.
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
1N4148W-7-F
Diodes Incorporated
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
1N4148WS
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
Fairchild Semiconductor
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
LM7805CT/NOPB
LM7805CT/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a package style of flange mount, and offers low line/load regulation making it ideal for various electronic applications requiring stable power supply.
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
MMBF170LT1G
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
SMBJ18CA
Yageo
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Kec
BGC100GN6E6327XTSA1
Infineon Technologies
Infineon's BGC100GN6E6327XTSA1 is a CMOS Cellphone IC with 6 terminals in a rectangular chip carrier package. It features RF and baseband circuitry, suitable for telecom applications. This surface-mount IC has terminals at the bottom and a butt terminal form.
AD6659BCPZ-80
Analog Devices
AD6659BCPZ-80 by Analog Devices is a cellphone IC with 2 functions, operating at 1.8V. It features a square package style with 64 terminals and matte tin finish. Ideal for RF and baseband circuits in telecom applications, it has an industrial temperature grade of -40 to 85 °C.
ADRV9010BBCZ-A-RL
Analog Devices' ADRV9010BBCZ-A-RL is a CELLPHONE IC with 289 terminals in a PLASTIC/EPOXY package. It operates b/w -40 to 110 °C, suitable for RF and baseband circuits. The low-profile GRID ARRAY design with 0.8mm terminal pitch makes it ideal for compact mobile devices.
LMH6522SQE
LMH6522SQE by Texas Instruments is a 54-terminal cellphone IC with a rectangular package style. Operating b/w -40 to 85°C, it's ideal for RF and baseband circuits in telecom applications. With a low profile of 0.8mm, it features a terminal pitch of 0.5mm and nominal voltage of 5V.
HMC686LP4
Analog Devices' HMC686LP4 is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. The RF and baseband circuit has a nominal voltage of 5V, making it ideal for surface mount designs.
ADF7901BRUZ
Analog Devices' ADF7901BRUZ is a cellphone IC with 24 terminals in a small outline package. It operates at 3V, suitable for RF and baseband circuits, with a temperature range of 0-50 °C. The device has a matte tin finish, gull wing terminal form, and shrink pitch package style.
TLV320AC56DW
TLV320AC56DW by Texas Instruments is a Cellphone IC with 20 terminals, operating temperature range of -40 to 85°C. It features Gull Wing terminal form, 3V supply voltage, and is ideal for baseband circuit applications in the telecom industry.
AD6653BCPZ-150
AD6653BCPZ-150 by Analog Devices is a cellphone IC with 64 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with a nominal voltage of 1.8V. Ideal for baseband circuits, it has a very thin profile and matte tin terminal finish.
AD9361BBC-CSH
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
TCM320AC57CN
Texas Instruments TCM320AC57CN is a 20-terminal IC with 5V power supply, operating b/w 0-70°C. It features A-LAW companding law, 13-bit linear coding, and a filter. Ideal for cellphone applications due to its BASEBAND CIRCUIT technology and compact IN-LINE package style.
CC2511F8RSP
Texas Instruments CC2511F8RSP is a cellphone IC with 36 terminals in a square chip carrier package. Operating b/w 0-85°C, it features CMOS technology, RF and baseband circuitry for telecom applications. With a nominal voltage of 3.3V, it has a compact size of 6x6mm and terminal pitch of 0.5mm.
HMC601LP4
Analog Devices' HMC601LP4 is a 24-terminal cellphone IC in a square chip carrier package with a very thin profile. It operates b/w -40 to 85°C, suitable for industrial use. This RF front end circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.
TLV320AC56CPT
TLV320AC56CPT by Texas Instruments is a 48-terminal cellphone IC with 3V supply voltage. It features a 13-bit linear coding, mu-law companding law, and filter for baseband circuits. This CMOS technology IC operates b/w 0-70°C and has low profile flatpack packaging suitable for telecom applications.
CC1050/T&R
CC1050/T&R by Texas Instruments is a cellphone IC with 24 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuit for telecom applications. The package is small outline, thin profile, with 0.65mm terminal pitch suitable for surface mount assembly.
CC2591RGVT
The Texas Instruments CC2591RGVT is a cellphone IC with 16 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V and max current of 4mA. This RF front end circuit has a terminal pitch of 0.65mm and is suitable for industrial applications requiring very thin profile components.
TRF370317IRGET
TRF370317IRGET by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 5V and max current of 0.245mA. Ideal for RF and baseband circuits, it features nickel palladium gold finish and no-lead terminal form.
CC1100RTKRG3
CC1100RTKRG3 by Texas Instruments is a cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 1.8/3.6V, RF and baseband circuit technology, and a compact square package suitable for telecom applications.
TRF370333IRGER
TRF370333IRGER by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 5V and max current of 235mA. This RF and baseband circuit has a terminal pitch of 0.5mm, making it suitable for industrial telecom applications.
HMC682LP6CETR
Analog Devices' HMC682LP6CETR is a 40-terminal cellphone IC in a square chip carrier package with a very thin profile. It operates b/w -40 °C to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits. The IC has a nominal voltage of 5V and can withstand peak reflow temperature of 260°C for up to 30 seconds.
AD6653BCPZ-125
AD6653BCPZ-125 by Analog Devices is a cellphone IC with 64 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with a nominal voltage of 1.8V. Ideal for baseband circuits, it has a very thin profile and matte tin finish for industrial-grade telecom applications.
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