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AD6659BCPZ-80

Analog Devices

AD6659BCPZ-80 by Analog Devices

AD6659BCPZ-80 by Analog Devices is a cellphone IC with 2 functions, operating at 1.8V. It features a square package style with 64 terminals and matte tin finish. Ideal for RF and baseband circuits in telecom applications, it has an industrial temperature grade of -40 to 85 °C.

Median Price

$43.770

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,380 parts In-Stock

1+ parts

-

100+ parts

$43.770

1k+ parts

$39.160

10k+ parts

$36.860

2,380

-

$43.770

$39.160

$36.860

DigiKey

USA . 2,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,380

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 824 parts In-Stock

1+ parts

$46.312

100+ parts

-

1k+ parts

-

10k+ parts

-

824

$46.312

-

-

-

Vyrian

USA . 472 parts In-Stock

1+ parts

$48.750

100+ parts

-

1k+ parts

-

10k+ parts

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472

$48.750

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,216 parts In-Stock

1+ parts

$14.293

100+ parts

-

1k+ parts

$13.293

10k+ parts

-

1,216

$14.293

-

$13.293

-

IDEA Electronic Components Group

UK . 9 parts In-Stock

1+ parts

$15.369

100+ parts

$14.601

1k+ parts

$14.601

10k+ parts

-

9

$15.369

$14.601

$14.601

-

Native Components

USA . 557 parts In-Stock

1+ parts

$19.344

100+ parts

-

1k+ parts

-

10k+ parts

-

557

$19.344

-

-

-

Northwest PG Solutions

USA . 65 parts In-Stock

1+ parts

$21.279

100+ parts

$19.151

1k+ parts

-

10k+ parts

-

65

$21.279

$19.151

-

-

DigiPath Technology Company

USA . 119 parts In-Stock

1+ parts

$23.976

100+ parts

$23.017

1k+ parts

-

10k+ parts

$23.017

119

$23.976

$23.017

-

$23.017

Ampacity Inc.

Singapore . 2,297 parts In-Stock

1+ parts

$41.440

100+ parts

-

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10k+ parts

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2,297

$41.440

-

-

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Semicontronic

India . 2,198 parts In-Stock

1+ parts

$41.440

100+ parts

$40.404

1k+ parts

$40.197

10k+ parts

-

2,198

$41.440

$40.404

$40.197

-

Corphita

USA . 910 parts In-Stock

1+ parts

$43.875

100+ parts

-

1k+ parts

-

10k+ parts

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910

$43.875

-

-

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Component Stockers USA

USA . 2,983 parts In-Stock

1+ parts

$49.250

100+ parts

$46.300

1k+ parts

$41.860

10k+ parts

-

2,983

$49.250

$46.300

$41.860

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S.R.D Solutions

India . 40,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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40,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

-

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RC Electronics

USA . 2,060 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,060

-

-

-

-

A-Z Elektronik GmbH

Germany . 300 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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300

-

-

-

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Perfect Parts

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10

-

-

-

-

Overview

Enhance the performance of your cellphone with the AD6659BCPZ-80 by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-quality Cellphone ICs that are designed to optimize functionality and reliability. With advanced features and a compact square package shape, this product offers customers seamless integration and superior performance. Whether you're looking to improve signal processing or enhance overall efficiency, the AD6659BCPZ-80 is the solution you need. Upgrade your cellphone experience today with Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing overall manufacturing costs.

No. of Functions: 2

Having multiple functions in one IC can save space on the PCB and reduce the overall component count in the system.

Package Shape: SQUARE

The square package shape offers better alignment and space utilization on the PCB compared to other shapes.

Power Supplies (V): 1.8

Operating at a low voltage of 1.8V helps in reducing power consumption and heat dissipation, making the product more energy-efficient.

No. of Terminals: 64

Having a higher number of terminals allows for more connectivity options and functionality within the IC.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient thermal management and space-saving design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the IC can withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the IC to function effectively in cold environments without compromising performance.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term durability.

Terminal Position: QUAD

Quad terminal position allows for easy PCB layout and routing, enabling efficient signal flow and minimizing interference.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm helps in achieving a slim and compact design for the overall product.

Width: 9 mm

The compact width of 9mm contributes to space-saving design and efficient PCB layout.

Length: 9 mm

The compact length of 9mm complements the width and overall dimensions of the IC, making it suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures that the IC can withstand extended temperature ranges and harsh operating conditions in industrial environments.

Terminal Form: NO LEAD

The no-lead terminal form provides a reliable and environmentally friendly soldering solution, avoiding the use of toxic lead-based materials.

Maximum Supply Current: 0.119 mA

With a low maximum supply current of 0.119mA, the IC helps in reducing power consumption and optimizing energy efficiency in the system.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit functionality in one IC simplifies the design, reduces component count, and enhances overall system performance.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V ensures stable and consistent performance of the IC under various operating conditions.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm enables high-density packaging and efficient use of PCB space, making it suitable for compact electronic devices.

Technical Specifications

Cellphone ICs AD6659BCPZ-80 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.119 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

AD6659BCPZ-80 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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