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TRF6903PTRG4

Texas Instruments

TRF6903PTRG4 by Texas Instruments

TRF6903PTRG4 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, CMOS technology, and RF/baseband circuit for telecom applications in a square-shaped plastic package suitable for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,606 parts In-Stock

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Digiode

USA . 2,013 parts In-Stock

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2,013

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 527 parts In-Stock

1+ parts

$5.986

100+ parts

-

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$6.762

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527

$5.986

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$6.762

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DigiPath Technology Company

USA . 2,229 parts In-Stock

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$6.591

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2,229

$6.591

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ChromeModa Solutions

Germany . 1,566 parts In-Stock

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$6.726

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$5.515

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1,566

$6.726

$5.515

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IDEA Electronic Components Group

UK . 548 parts In-Stock

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$6.726

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$6.053

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548

$6.726

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$6.053

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Advanced Electronics

New Zealand . 1,500 parts In-Stock

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$9.598

100+ parts

$9.502

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$9.118

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$9.598

$9.502

$9.118

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AZTECH Wire

Italy . 448 parts In-Stock

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$14.440

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448

$14.440

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One Stop Electronics

USA . 1,338 parts In-Stock

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$89.000

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$89.000

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Semicontronic

India . 153 parts In-Stock

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$305.000

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$297.375

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$295.850

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153

$305.000

$297.375

$295.850

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Ampacity Inc.

Singapore . 1,013 parts In-Stock

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$657.000

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$657.000

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Kepictronics

USA . 50,000 parts In-Stock

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Corphita

USA . 1,189 parts In-Stock

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Corohmni

South Africa . 115 parts In-Stock

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Overview

Unlock new possibilities with the TRF6903PTRG4 by Texas Instruments. This high-quality cellphone IC offers unmatched performance and reliability, making it the perfect choice for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will exceed your expectations. Experience the value and benefits that this RF and baseband circuit brings to your projects, from improved efficiency to seamless connectivity. Upgrade your designs with the TRF6903PTRG4 and revolutionize your creations today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and ensures the IC is able to withstand various environmental conditions, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly processes, saving time and effort during production.

Power Supplies (V): 2.5/3.3

Having multiple power supply options gives flexibility in different applications, making this IC suitable for a variety of devices.

No. of Terminals: 48

Having a higher number of terminals allows for more connectivity options, enabling the IC to support complex functionalities and features.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can function reliably even in challenging thermal conditions, ensuring stability and performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC energy-efficient and reliable in noisy environments.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Supporting both RF and baseband circuits, this IC is versatile and can be used in a wide range of communication devices, enhancing its usability and compatibility.

Technical Specifications

Cellphone ICs TRF6903PTRG4 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF6903PTRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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