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ADL5502ACBZ-P2

Analog Devices

ADL5502ACBZ-P2 by Analog Devices

ADL5502ACBZ-P2 by Analog Devices is a BICMOS technology Cellphone IC with 8 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for RF and baseband circuits in telecom applications. The package has a very thin profile, measures 1.46mm in width and length, with terminal pitch of 0.5mm.

Median Price

$8.250

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 75 parts In-Stock

1+ parts

$8.250

100+ parts

$7.830

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75

$8.250

$7.830

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Vyrian

USA . 4,014 parts In-Stock

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4,014

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Digiode

USA . 747 parts In-Stock

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747

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Distributors (Availability)

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AZTECH Wire

Italy . 756 parts In-Stock

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$6.305

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756

$6.305

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Parana Technologies

USA . 4,205 parts In-Stock

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$11.406

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$10.608

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$11.406

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IDEA Electronic Components Group

UK . 2,338 parts In-Stock

1+ parts

$12.265

100+ parts

$11.652

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$11.652

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2,338

$12.265

$11.652

$11.652

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DigiPath Technology Company

USA . 1,733 parts In-Stock

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$19.133

100+ parts

$18.368

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$18.368

1,733

$19.133

$18.368

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$18.368

One Stop Electronics

USA . 1,528 parts In-Stock

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$622.000

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1,528

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Semicontronic

India . 1,437 parts In-Stock

1+ parts

$862.000

100+ parts

$840.450

1k+ parts

$836.140

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1,437

$862.000

$840.450

$836.140

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Native Components

USA . 989 parts In-Stock

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Corphita

USA . 597 parts In-Stock

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Northwest PG Solutions

USA . 283 parts In-Stock

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283

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Overview

Unlock the full potential of your cellphone with the ADL5502ACBZ-P2 by Analog Devices. Known for their top-quality products, Analog Devices brings you a cutting-edge Cellphone IC that promises unparalleled performance and reliability. Whether you're looking to enhance signal processing, improve battery life, or optimize power consumption, this innovative device has got you covered. Say goodbye to dropped calls and slow data speeds - upgrade to the ADL5502ACBZ-P2 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability, making the product suitable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly, saving time and effort during manufacturing.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space, making it ideal for compact devices.

No. of Terminals: 8

Having 8 terminals offers flexibility in connectivity options and allows for more versatile usage of the product.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, ensuring reliable performance in various conditions.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40°C makes this product suitable for use in a wide range of environments, including extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides excellent conductivity and corrosion resistance, ensuring stable and reliable connections.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom enables easy and secure connection, contributing to the overall reliability of the product.

Width: 1.46 mm

The width of 1.46 mm allows for a compact design, making the product suitable for integration into small devices without compromising performance.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range ensures that the product can perform reliably in demanding industrial environments.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption for efficient operation.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Featuring RF and baseband circuitry makes this product well-suited for use in telecommunications applications, providing seamless integration and reliable performance.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V ensures compatibility with common power sources, making deployment and integration easier.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for high-density mounting, enabling efficient use of board space and facilitating compact designs.

Technical Specifications

Cellphone ICs ADL5502ACBZ-P2 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B8

JESD-609 Code:

e1

Length:

1.46 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

1.46 mm

Trade Compliance

ADL5502ACBZ-P2 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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