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ADF4360-8BCPRL7

Analog Devices

ADF4360-8BCPRL7 by Analog Devices

Analog Devices' ADF4360-8BCPRL7 is a 24-terminal cellphone IC with 3.3V supply, operating from -40 to 85 °C. It features BICMOS technology, quad terminal position, and a square chip carrier package suitable for baseband circuits in telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,228 parts In-Stock

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PC Components Company LLC

USA . 775 parts In-Stock

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775

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Bristol Electronics

USA . 775 parts In-Stock

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775

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Digiode

USA . 293 parts In-Stock

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293

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Distributors (Availability)

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Native Components

USA . 176 parts In-Stock

1+ parts

$0.419

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$0.402

176

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$0.402

Northwest PG Solutions

USA . 1,327 parts In-Stock

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$0.461

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$0.406

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$0.461

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$0.406

Parana Technologies

USA . 4,509 parts In-Stock

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$14.804

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$13.767

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4,509

$14.804

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$13.767

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IDEA Electronic Components Group

UK . 327 parts In-Stock

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$15.918

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$15.122

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$15.122

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327

$15.918

$15.122

$15.122

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AZTECH Wire

Italy . 741 parts In-Stock

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$19.588

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741

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DigiPath Technology Company

USA . 4,509 parts In-Stock

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$24.832

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$23.839

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$23.839

4,509

$24.832

$23.839

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$23.839

Semicontronic

India . 656 parts In-Stock

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$382.000

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$372.450

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$370.540

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656

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One Stop Electronics

USA . 293 parts In-Stock

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$737.000

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293

$737.000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 842 parts In-Stock

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Overview

Discover the cutting-edge ADF4360-8BCPRL7 by Analog Devices, a high-quality Cellphone IC that promises top-notch performance and reliability. With Analog Devices' reputation for excellence in manufacturing, this square-shaped chip carrier offers unparalleled value and benefits to customers. Ideal for various telecom applications, this industrial-grade IC boasts a nominal supply voltage of 3.3V and a terminal pitch of 0.5mm. Upgrade your devices with the ADF4360-8BCPRL7 and experience the difference in quality and efficiency today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient placement on a circuit board, saving space and improving reliability.

Package Shape: SQUARE

The square package shape provides good mechanical stability and ease of handling during assembly.

Power Supplies (V): 3.3

Operating at 3.3V allows for compatibility with a wide range of electronic devices and power sources.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for integrating the IC into various circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal performance and overall compactness of the IC.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can withstand high temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures reliable performance in extreme cold conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, enhancing the reliability of the connections.

Terminal Position: QUAD

The quad terminal position simplifies the PCB layout and allows for efficient routing of connections.

Maximum Seated Height: 1 mm

A low maximum seated height of 1mm enables a slim and compact design for space-constrained applications.

Width: 4 mm

The 4mm width contributes to the overall small form factor of the IC, making it suitable for portable devices.

Peak Reflow Temperature °C: 240

With a peak reflow temperature of 240 °C, this IC can withstand the high temperatures of the soldering process during assembly.

Length: 4 mm

The 4mm length complements the width and height dimensions, resulting in a compact and uniform package size.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this IC is reliable and stable in harsh operating environments.

Technology: BICMOS

Utilizing Bipolar CMOS (BICMOS) technology offers a balance between speed and power consumption, making the IC versatile for different applications.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of tin whiskers and improves the overall reliability of the IC.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit IC, it is essential for processing and modulating the signals in telecommunications systems, making it a crucial component for such applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is commonly used in many electronic devices, ensuring compatibility and ease of integration.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting on the PCB, enabling more connections in a limited space.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this IC can withstand moderate exposure to humidity during storage and handling without compromising performance.

Technical Specifications

Cellphone ICs ADF4360-8BCPRL7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

ADF4360-8BCPRL7 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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