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AD9361BBCZ-REEL

Analog Devices

AD9361BBCZ-REEL by Analog Devices

AD9361BBCZ-REEL by Analog Devices is a CELLPHONE IC with 144 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, suitable for INDUSTRIAL telecom applications. Features include TIN SILVER COPPER finish, 1.3V supply voltage, and RF/BASEBAND circuit type.

Median Price

$354.310

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 11,344 parts In-Stock

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$354.310

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$258.410

10k+ parts

$280.875

11,344

$354.310

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$258.410

$280.875

DigiKey

USA . 4,216 parts In-Stock

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$410.880

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$323.012

4,216

$410.880

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$323.012

Verical

USA . 6,000 parts In-Stock

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$321.000

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$321.000

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Nova Conductors

Japan . 50 parts In-Stock

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$340.420

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50

$340.420

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VNN

France . 29,558 parts In-Stock

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Vyrian

USA . 7,079 parts In-Stock

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Chip Stock

USA . 6,140 parts In-Stock

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NexGen Digital

USA . 1,936 parts In-Stock

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Digiode

USA . 624 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 326 parts In-Stock

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$6.634

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326

$6.634

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$9.492

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$9.018

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$9.018

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$9.492

$9.018

$9.018

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Parana Technologies

USA . 4,250 parts In-Stock

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$14.449

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$13.438

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4,250

$14.449

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$13.438

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Aztec Data Supply Inc.

USA . 2,315 parts In-Stock

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$15.410

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$15.410

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IDEA Electronic Components Group

UK . 179 parts In-Stock

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$15.537

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$14.760

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$14.760

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179

$15.537

$14.760

$14.760

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DigiPath Technology Company

USA . 4,250 parts In-Stock

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$24.238

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$23.268

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$23.268

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$24.238

$23.268

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$23.268

Ampacity Inc.

Singapore . 2,788 parts In-Stock

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$272.850

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2,788

$272.850

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Semicontronic

India . 2,745 parts In-Stock

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$272.850

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$266.029

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$264.664

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$272.850

$266.029

$264.664

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Aranea Global

USA . 2,000 parts In-Stock

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$333.612

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$320.267

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$333.612

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$320.267

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Continental Prestige Electronics

USA . 6,643 parts In-Stock

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$337.050

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$330.309

6,643

$337.050

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$330.309

Modulus Dynamics

Lithuania . 650 parts In-Stock

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$374.125

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$370.384

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$359.160

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$374.125

$370.384

$359.160

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Component Stockers USA

USA . 11,113 parts In-Stock

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Lixinc

USA . 6,742 parts In-Stock

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Robosynatics

Brazil . 3,000 parts In-Stock

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$0.291

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$0.291

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$0.291

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$0.291

$0.291

$0.291

Lucentia Tech

USA . 3,000 parts In-Stock

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$0.291

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$0.291

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$0.291

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$0.291

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 955 parts In-Stock

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Argo Parts USA

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Perfect Parts

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S.R.D Solutions

India . 100 parts In-Stock

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iodParts Technologies Inc.

India . 31 parts In-Stock

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Overview

Unlock the full potential of your cellphone with the AD9361BBCZ-REEL by Analog Devices. This cutting-edge RF and baseband circuit offers unmatched quality and reliability, thanks to its top-tier manufacturer. With a compact design and advanced features, this telecom IC is perfect for a wide range of applications. Experience seamless connectivity and improved performance with this innovative product that is sure to exceed your expectations. Elevate your mobile device with the AD9361BBCZ-REEL and enjoy the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and heat resistance, making this IC suitable for various operating conditions.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

Square shape of the package provides efficient use of space on the circuit board, optimizing the overall design.

No. of Terminals: 144

Having 144 terminals allows for a high level of connectivity and functionality in the IC, enabling it to perform complex tasks efficiently.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The combination of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, enhancing the overall longevity of the IC.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connection to the circuit board, ensuring stable performance.

Maximum Seated Height: 1.7 mm

Low maximum seated height helps in reducing the overall profile of the IC, making it suitable for compact electronic devices.

Width: 10 mm

Compact width dimension enables efficient placement of the IC on the circuit board, saving valuable space.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure soldering during the manufacturing process, leading to reliable performance.

Length: 10 mm

Compact length dimension contributes to the overall space-saving design of the IC.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the IC can operate reliably in harsh industrial environments.

Terminal Form: BALL

Ball terminal form enhances solder joint reliability and mechanical strength, ensuring long-term performance.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and baseband circuit type makes this IC suitable for telecommunication applications, offering versatility and high performance.

Nominal Supply Voltage: 1.3 V

Stable nominal supply voltage of 1.3V ensures consistent and reliable operation of the IC.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm allows for high-density mounting, enabling more functionality in a compact space.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this IC can withstand exposure to moderate levels of moisture during storage and handling.

Technical Specifications

Cellphone ICs AD9361BBCZ-REEL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.7 mm

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

AD9361BBCZ-REEL Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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