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ADRF6602ACPZ-R7

Analog Devices

ADRF6602ACPZ-R7 by Analog Devices

Analog Devices' ADRF6602ACPZ-R7 is a 40-terminal cellphone IC in a square chip carrier package. With BICMOS technology, it operates b/w -40 to 85°C and has a nominal voltage of 5V. This RF and baseband circuit is ideal for telecom applications due to its compact size and industrial temperature grade suitability.

Median Price

$9.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 953 parts In-Stock

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-

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$9.000

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$8.050

10k+ parts

$7.580

953

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$9.000

$8.050

$7.580

Distributors (In-Stock)

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Digiode

USA . 16 parts In-Stock

1+ parts

$13.196

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$13.196

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Vyrian

USA . 2,344 parts In-Stock

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Cyclops Electronics Ltd

UK . 261 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 719 parts In-Stock

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$12.501

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719

$12.501

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Parana Technologies

USA . 2,369 parts In-Stock

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$16.378

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$15.232

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2,369

$16.378

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$15.232

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$17.188

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$15.641

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$14.094

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-

5,000

$17.188

$15.641

$14.094

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IDEA Electronic Components Group

UK . 1,181 parts In-Stock

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$17.611

100+ parts

$16.730

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$16.730

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$16.730

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AZTECH Wire

Italy . 785 parts In-Stock

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$21.820

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785

$21.820

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DigiPath Technology Company

USA . 3,142 parts In-Stock

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$27.473

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$26.374

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$26.374

3,142

$27.473

$26.374

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$26.374

QUARKTWIN TECHNOLOGY LTD

USA . 29,870 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,175 parts In-Stock

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Northwest PG Solutions

USA . 1,231 parts In-Stock

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Native Components

USA . 797 parts In-Stock

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RC Electronics

USA . 228 parts In-Stock

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Overview

Elevate your cellphone's performance with the ADRF6602ACPZ-R7 by Analog Devices. Known for their top-notch quality and innovation, Analog Devices delivers cutting-edge solutions for the telecom industry. This Cellphone IC offers unparalleled value with its advanced technology, ensuring seamless RF and baseband circuit integration. With a compact square package shape and matte tin terminal finish, this product is designed for efficiency and reliability. Upgrade your device with the ADRF6602ACPZ-R7 and experience enhanced functionality like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient integration into circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square packages are compact and efficient, making them ideal for applications where space is limited.

No. of Terminals: 40

The high number of terminals allows for complex connections and functionality in the cellphone IC, enhancing its capabilities.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extremely cold environments.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, ensuring a reliable connection over time.

Terminal Position: QUAD

Quad terminal position provides stability and secure mounting on the circuit board, reducing the risk of disconnection.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in a wide range of operating conditions.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent performance and compatibility with standard power sources.

Technical Specifications

Cellphone ICs ADRF6602ACPZ-R7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

ADRF6602ACPZ-R7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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