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LMH2110TM

Texas Instruments

LMH2110TM by Texas Instruments

LMH2110TM by Texas Instruments is a Cellphone IC with a package style of GRID ARRAY, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C and has RF and baseband circuit capabilities. With a nominal voltage of 4.5V, it is suitable for telecommunications applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,371 parts In-Stock

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1,371

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Anansix

USA . 552 parts In-Stock

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552

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ECAB

Sweden . 500 parts In-Stock

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500

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Vyrian

USA . 258 parts In-Stock

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258

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 286 parts In-Stock

1+ parts

$6.480

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-

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286

$6.480

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Corohmni

South Africa . 223 parts In-Stock

1+ parts

$9.071

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223

$9.071

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Parana Technologies

USA . 633 parts In-Stock

1+ parts

$13.123

100+ parts

-

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$13.625

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633

$13.123

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$13.625

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DigiPath Technology Company

USA . 302 parts In-Stock

1+ parts

$14.450

100+ parts

$13.294

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302

$14.450

$13.294

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ChromeModa Solutions

Germany . 3,845 parts In-Stock

1+ parts

$14.745

100+ parts

$12.091

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3,845

$14.745

$12.091

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IDEA Electronic Components Group

UK . 695 parts In-Stock

1+ parts

$14.745

100+ parts

$14.008

1k+ parts

$13.270

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695

$14.745

$14.008

$13.270

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AZTECH Wire

Italy . 707 parts In-Stock

1+ parts

$16.353

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707

$16.353

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Ampacity Inc.

Singapore . 1,552 parts In-Stock

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$41.000

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$41.000

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One Stop Electronics

USA . 521 parts In-Stock

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$121.000

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521

$121.000

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Lixinc

USA . 8,401 parts In-Stock

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Continental Prestige Electronics

USA . 6,742 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,649 parts In-Stock

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5,649

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Alle Elektronik GmbH

Germany . 3,766 parts In-Stock

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3,766

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Corphita

USA . 2,910 parts In-Stock

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2,910

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Assy Fe

Spain . 1,730 parts In-Stock

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1,730

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Argo Parts USA

USA . 399 parts In-Stock

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399

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Kepictronics

USA . 232 parts In-Stock

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232

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Elevate your cellphone technology with the LMH2110TM by Texas Instruments. Known for their exceptional quality and cutting-edge innovation, Texas Instruments delivers a powerful RF and baseband circuit solution that takes your cellphone performance to the next level. With a sleek rectangular package design and industrial-grade temperature rating, this highly advanced IC is designed for optimal performance in a variety of applications. Say goodbye to dropped calls and slow data speeds - experience the value and benefits of the LMH2110TM today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the package, ensuring long-term performance of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a PCB, saving time and cost in the manufacturing process.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, enabling compact design and integration of the product into small electronic devices.

No. of Terminals: 6

Having 6 terminals provides enough connectivity options for the IC, allowing it to interface with other components and subsystems in the cellphone.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures that the IC can withstand harsh environmental conditions and high temperature environments, increasing its reliability and lifespan.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IC to function in cold temperatures without any degradation in performance, making it suitable for a wide range of operating conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting of the IC onto the PCB, ensuring stable connection and efficient heat dissipation.

Width: 0.84 mm

Compact width of the IC allows for space-efficient design and integration into slim and sleek cellphone devices.

Length: 1.24 mm

The length of the IC is optimized for compact PCB layout and efficient use of space within the cellphone, enabling a sleek and lightweight design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation of the IC in demanding industrial environments, making it suitable for rugged applications in cellphones.

Nominal Supply Voltage: 4.5 V

Nominal supply voltage of 4.5V is ideal for powering the IC in a cellphone, providing stable and efficient operation for various functions and features.

Terminal Pitch: 0.4 mm

Compact terminal pitch allows for high-density mounting of the IC on the PCB, enabling efficient use of space and integration of multiple components in a limited area.

Technical Specifications

Cellphone ICs LMH2110TM attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B6

Length:

1.24 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

.84 mm

Trade Compliance

LMH2110TM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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