Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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LMH2120UMX/NOPB by Texas Instruments is a Cellphone IC with 6 terminals in a very thin profile grid array package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit requires 4mA supply current at 4.5V, making it ideal for cellphone applications.
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$10.795
Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices like cellphones.
Surface mount technology allows for easy and quick assembly of the IC onto the circuit board, saving time and effort during manufacturing.
Rectangular shape allows for efficient use of space on the circuit board, maximizing the functionality of the cellphone IC.
Having 6 terminals provides enough connectivity options for the IC to communicate with other components in the cellphone, ensuring smooth operation.
The grid array style with a thin profile and fine pitch enables high-density mounting, saving valuable space on the circuit board and improving overall design efficiency.
The high maximum operating temperature allows the IC to function reliably in various environmental conditions, increasing its versatility.
The low minimum operating temperature ensures that the IC can perform consistently even in cold climates or cooler environments.
The combination of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, contributing to the longevity of the IC.
Bottom terminal position simplifies the integration of the IC into the circuit board layout, making the installation process more straightforward.
The low maximum seated height reduces the overall profile of the IC, contributing to a slim design for the cellphone.
The narrow width of the IC allows for compact placement on the circuit board, optimizing space utilization within the device.
The short maximum time at peak reflow temperature ensures that the IC is not exposed to high temperatures for long periods, minimizing the risk of damage during assembly.
The high peak reflow temperature tolerance indicates the IC's ability to withstand the heat of the soldering process during manufacturing without compromising its performance.
The compact length of the IC contributes to a space-efficient design, allowing for more components to be accommodated within the cellphone.
The industrial temperature grade ensures that the IC can operate reliably in harsh industrial environments, making it suitable for a wide range of applications.
The ball terminal form provides a secure and reliable connection between the IC and the circuit board, ensuring stable performance over time.
The low maximum supply current requirement helps conserve energy, making the IC more energy-efficient and suitable for battery-powered devices like cellphones.
The RF and baseband circuit type indicates that the IC is specialized for wireless communication and signal processing, making it an ideal choice for cellphone applications.
The nominal supply voltage of 4.5 V is well-suited for operation in standard electronic systems, ensuring compatibility with most cellphone power supplies.
The fine terminal pitch allows for high-density mounting of the IC on the circuit board, improving the overall performance and efficiency of the cellphone.
Cellphone ICs LMH2120UMX/NOPB attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Channels:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Maximum Supply Current:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
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Width:
LMH2120UMX/NOPB Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
STM32F401CDY6TR
STMicroelectronics
STM32F401CDY6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words, 50 MHz clock frequency, and 36 I/O lines. It is used in applications requiring high-speed processing, such as industrial automation and consumer electronics.
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Laube Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
TM4C1294NCPDTI3
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
Secos
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM358AN
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
CRG0805F10K
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10000 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
LMH6522SQE/NOPB
LMH6522SQE/NOPB by Texas Instruments is a 54-terminal cellphone IC with 4 channels, RF and baseband circuit for telecom applications. It operates b/w -40 to 85°C, has a gain tolerance of 25.74 dB, and draws a max supply current of 485 mA.
TCM320AC56IPT
TCM320AC56IPT by Texas Instruments is a Cellphone IC with 48 terminals, operating at temperatures from -40 to 85°C. It features a 13-bit linear codec, companding law MU-LAW, and telecom IC type BASEBAND CIRCUIT. This low-profile flatpack package has a terminal pitch of 0.5mm and is ideal for industrial applications requiring fine-pitch technology.
ADF4360-2BCP
Analog Devices
Analog Devices' ADF4360-2BCP is a Cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 3.3V supply, BICMOS technology, and a compact square package suitable for baseband circuits in telecom applications.
TCM320AC57IDWR
TCM320AC57IDWR by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 5V supply voltage. It operates b/w -40 to 85°C, suitable for industrial use in baseband circuits. The package is small outline, rectangular in shape, with gull wing terminals for surface mount applications.
ADRV9029BBCZ
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
TCM8030PN
Texas Instruments TCM8030PN is a cellphone IC with 80 terminals in a square package. It operates at -40 to 85°C, suitable for industrial use. With a supply voltage of 3V, it features CMOS technology and is ideal for baseband circuit applications.
TLV320AC57IDWR
TLV320AC57IDWR by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 3V supply voltage. It operates b/w -40 to 85°C, suitable for industrial use in baseband circuits. The small outline package measures 7.5mm x 12.8mm with a seated height of 2.65mm, making it ideal for compact cellphone designs.
CC2420Z-RTR1
CC2420Z-RTR1 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, CMOS technology, and RF/baseband circuitry. This square-shaped chip carrier is surface-mountable and suitable for industrial applications requiring a compact form factor.
MAX2051ETP+
MAX2051ETP+ by Analog Devices is a Cellphone IC with 20 terminals in a square package. It operates at -40 to 85 °C, with a supply voltage of 5V and current draw of 0.13mA. This RF and baseband circuit uses BICMOS technology for industrial telecom applications.
MAX4003EUA+
MAX4003EUA+ by Analog Devices is an 8-terminal cellphone IC with a small outline, thin profile package. It operates b/w -40 to 85°C and has a peak reflow temperature of 260°C. Ideal for RF and baseband circuits in telecom applications.
CC1021RSS
The Texas Instruments CC1021RSS is a cellphone IC with 32 terminals in a square package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.65mm, making it suitable for industrial telecom applications.
TLV320AC56DWR
TLV320AC56DWR by Texas Instruments is a cellphone IC with 20 terminals, operating from -40 to 85°C. It features a small outline package style, Gull Wing terminal form, and 3V supply voltage. Ideal for telecom applications as a baseband circuit due to its industrial temperature grade and compact rectangular shape.
HMC830LP6GE
Hittite Microwave
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
RFFM6903TR13
Rf Micro Devices
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 28; Package Code: HLGA; Package Shape: SQUARE;
CC113LRGPT
The Texas Instruments CC113LRGPT is a cellphone IC with 20 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it supports RF and baseband circuits with a data rate of 0.6 Mbps. Ideal for industrial applications, this IC has a nominal voltage of 3V and terminal pitch of 0.5mm.
CC1101RTKG3
CC1101RTKG3 by Texas Instruments is a cellphone IC with 20 terminals, operating at 1.8-3.6V. It features a square shape, nickel palladium gold finish, and industrial temperature grade suitable for RF and baseband circuits. This chip carrier has a very thin profile, measures 4x4mm in size, and can withstand peak reflow temperatures up to 260°C in surface mount applications.
MAX2676EWT+T
MAX2676EWT+T by Analog Devices is a CELLPHONE IC with BICMOS tech. Features include 3.3V supply, -40 to 85 °C temp range, and RF/BASEBAND circuitry. Package: GRID ARRAY, 0.4mm pitch, 1.27x.865x.69mm dimensions for compact telecom applications.
GC5325IZND
GC5325IZND by Texas Instruments is a cellphone IC with 352 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 1.2V, making it ideal for telecom applications.
MAX2904ETI+T
MAX2904ETI+T by Analog Devices is a Cellphone IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It integrates RF and baseband circuits, with a nominal voltage of 4.5V for telecom applications.
AD6672BCPZRL7-250
Analog Devices' AD6672BCPZRL7-250 is a cellphone IC with 32 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, consumes 0.145mA, and integrates RF and baseband circuits. This surface-mount chip carrier is ideal for industrial telecom applications requiring high performance in a compact form factor.
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
LMH2110TMX/NOPB
LMH2110TMX/NOPB by Texas Instruments is a cellphone IC with a package style of GRID ARRAY, very thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) with a supply current of 5.5mA at 4.5V. This RF and baseband circuit has 6 terminals in a rectangular shape for surface mount applications.
LMH2110TM/NOPB
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;
LMH2110TM
LMH2100TM/NOPB
LMH2100TMX/NOPB
LMH2100TMX/NOPB by Texas Instruments is a CELLPHONE IC with 6 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, consuming 9.2mA at 2.7V. Ideal for RF and baseband circuits due to its thin profile and fine pitch design.
LMH2110TMX
LMH2120UM
LMH2120UM/NOPB
LMH2120UMX
LMH2121TME
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
LMH2121TME/NOPB
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 4; Package Code: VFBGA; Package Shape: RECTANGULAR;
LMH2121TMX
LMH2121TMX/NOPB
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