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MAX2306ETI+T

Analog Devices

MAX2306ETI+T by Analog Devices

Analog Devices' MAX2306ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. Operating at -40 to 85 °C, it has a supply voltage of 3/3.3V and max current of 0.0415mA. Ideal for baseband circuits, this IC is designed for telecom applications requiring industrial temperature grade performance.

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1k+

MAX2306ETI+T by Analog Devices
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Vyrian

USA . 3,908 parts In-Stock

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Digiode

USA . 2,228 parts In-Stock

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Anansix

USA . 2,057 parts In-Stock

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A&K Electronics

USA . 1,430 parts In-Stock

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Bristol Electronics

USA . 1,430 parts In-Stock

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Rotakorn

Sweden . 1,404 parts In-Stock

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Standard Data Resources

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ComSIT Distribution GmbH

Germany . 62 parts In-Stock

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MARBEL Systems

Belgium . 500 parts In-Stock

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$12.808

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AZTECH Wire

Italy . 256 parts In-Stock

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$13.778

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Texas Native Microelectronics

USA . 689 parts In-Stock

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$14.722

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$14.133

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$13.691

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$12.955

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Kenton Components

USA . 16,614 parts In-Stock

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Qasali Group International

UK . 336 parts In-Stock

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Semicontronic

India . 1,151 parts In-Stock

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One Stop Electronics

USA . 1,750 parts In-Stock

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Kepictronics

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Metaverse IC Inc.

Canada . 7,103 parts In-Stock

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RC Electronics

USA . 7,035 parts In-Stock

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Authorized Procurement Solutions

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Glotronic Ltd.

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Corphita

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Overview

Elevate your cellphone performance with the MAX2306ETI+T by Analog Devices, a top-of-the-line Cellphone IC that promises reliability and efficiency. With a sleek surface mount design and industrial-grade temperature grade, this product ensures seamless operation even in extreme conditions. Experience superior connectivity and power management with its baseband circuit technology, making it ideal for various telecom applications. Trust Analog Devices to deliver cutting-edge solutions for your mobile devices, providing unmatched value and performance for all your needs. Upgrade your communication experience today with the MAX2306ETI+T.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting onto circuit boards, saving space and reducing manufacturing costs.

Package Shape: SQUARE

Square packages are generally more space-efficient and easier to handle during assembly.

Power Supplies (V): 3/3.3

Compatible with common power supply voltages, ensuring easy integration into different systems.

No. of Terminals: 28

Provides a sufficient number of connection points for various functions and features.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier and heat sink/slub design ensures efficient heat dissipation and compact size, suitable for small form factor devices.

Maximum Operating Temperature: 85 °C

Can operate at higher temperatures without compromising performance, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, making it suitable for a wide range of environments.

Terminal Finish: Matte Tin (Sn) - annealed

Provides a reliable and durable finish for the terminals, ensuring long-term performance and stability.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and secure connections, improving reliability.

Maximum Seated Height: 0.8 mm

Low profile design helps in reducing the overall height of the product, making it suitable for slim devices.

Width: 5 mm

Compact width allows for efficient use of space on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures that the product can withstand reflow soldering without damaging components or performance.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes, ensuring reliable solder joints.

Length: 5 mm

Compact length contributes to the overall small form factor design of the product.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes this product suitable for harsh operating conditions.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and ensure safe handling during manufacturing and disposal.

Maximum Supply Current: 0.0415 mA

Low supply current consumption helps in minimizing power usage and extending battery life.

Telecom IC Type: BASEBAND CIRCUIT

Specifically designed for baseband circuit applications, providing optimized performance for telecommunications devices.

Nominal Supply Voltage: 2.75 V

Compatible with a common supply voltage, ensuring easy integration into telecom systems.

Terminal Pitch: 0.5 mm

Fine pitch terminals allow for high-density mounting, enabling more functionality in a smaller footprint.

Technical Specifications

Cellphone ICs MAX2306ETI+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0415 mA

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2306ETI+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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