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LP3939ILQX

Texas Instruments

LP3939ILQX by Texas Instruments

LP3939ILQX by Texas Instruments is a cellphone IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, operates at 3V supply voltage, and has a terminal pitch of 0.5mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,291 parts In-Stock

1+ parts

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4,291

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Vyrian

USA . 3,050 parts In-Stock

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3,050

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Anansix

USA . 1,675 parts In-Stock

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1,675

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,765 parts In-Stock

1+ parts

$6.646

100+ parts

-

1k+ parts

$7.360

10k+ parts

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1,765

$6.646

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$7.360

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DigiPath Technology Company

USA . 275 parts In-Stock

1+ parts

$7.318

100+ parts

$6.732

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275

$7.318

$6.732

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AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$7.446

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766

$7.446

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ChromeModa Solutions

Germany . 5,288 parts In-Stock

1+ parts

$7.467

100+ parts

$6.123

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5,288

$7.467

$6.123

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IDEA Electronic Components Group

UK . 2,073 parts In-Stock

1+ parts

$7.467

100+ parts

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$6.720

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2,073

$7.467

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$6.720

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One Stop Electronics

USA . 1,254 parts In-Stock

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$580.000

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1,254

$580.000

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Corphita

USA . 1,049 parts In-Stock

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1,049

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Overview

Upgrade your cellphone technology with the LP3939ILQX by Texas Instruments. Experience top-notch quality and reliability from a trusted manufacturer known for pushing the boundaries of innovation. This versatile Cellphone IC is designed for seamless integration, ensuring optimal performance in various telecom applications. With its compact design and advanced features, this product offers unmatched value, benefits, and advantages to customers looking to elevate their communication devices. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the IC, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square shape of the package allows for a compact design, saving space in electronic devices.

No. of Terminals: 16

With 16 terminals, this IC can support multiple functions and connections, providing versatility in cellphone applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and stability even in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the IC to function effectively in cold environments.

Terminal Position: QUAD

The quad terminal position provides efficient connectivity and allows for better signal transmission in the IC.

Width: 4 mm

The narrow width of 4mm enables the IC to fit into compact cellphone designs without sacrificing functionality.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is common in cellphone applications, ensuring compatibility with existing power systems.

Technical Specifications

Cellphone ICs LP3939ILQX attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

LP3939ILQX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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