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MAX2044ETP+T

Analog Devices

MAX2044ETP+T by Analog Devices

Analog Devices' MAX2044ETP+T is a Cellphone IC with 20 terminals in a square package. It operates at -40 to 85 °C, with power supplies of 3.3/5V. Ideal for RF and baseband circuits, it features BICMOS technology and a terminal pitch of 0.65mm.

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MAX2044ETP+T by Analog Devices
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Vyrian

USA . 6,686 parts In-Stock

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Anansix

USA . 2,359 parts In-Stock

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2,359

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Digiode

USA . 874 parts In-Stock

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874

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MARBEL Systems

Belgium . 840 parts In-Stock

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$9.919

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840

$9.919

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Texas Native Microelectronics

USA . 26,080 parts In-Stock

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$11.401

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$10.945

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$10.603

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$10.033

26,080

$11.401

$10.945

$10.603

$10.033

Kenton Components

USA . 3,056 parts In-Stock

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$13.681

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$12.039

3,056

$13.681

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$12.039

AZTECH Wire

Italy . 734 parts In-Stock

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$15.289

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734

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Qasali Group International

UK . 2,221 parts In-Stock

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$30.783

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$28.628

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$27.089

2,221

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$27.089

One Stop Electronics

USA . 973 parts In-Stock

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$605.000

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973

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Semicontronic

India . 370 parts In-Stock

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$984.000

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$959.400

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$954.480

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370

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QUARKTWIN TECHNOLOGY LTD

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Corphita

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Overview

Meet the MAX2044ETP+T by Analog Devices, a top-quality Cellphone IC that offers unbeatable performance and reliability. With Analog Devices' renowned reputation for excellence in manufacturing, this IC is guaranteed to meet your highest expectations. Whether you're looking to enhance the efficiency of your cellphone or improve overall performance, the MAX2044ETP+T is the perfect solution for you. Upgrade your device today and experience the difference!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape is commonly used in ICs for efficient use of space and ease of handling during assembly.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages (3.3V and 5V) provides flexibility in designing and integrating this IC into various systems.

No. of Terminals: 20

With 20 terminals, this IC offers a good number of connections for interfacing with other components and peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier package, heat sink/slug, and very thin profile design helps in efficient heat dissipation and space-saving on the PCB.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C makes this IC suitable for use in both hot and cold temperature conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finish provides good solderability and reliability in the assembly process.

Terminal Position: QUAD

The quad terminal position allows for easy connection to the PCB, ensuring secure and stable mounting.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8mm helps in compact and slim device designs.

Width: 5 mm

The small width of 5mm contributes to space-saving on the PCB and overall compact device size.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this IC can withstand typical reflow soldering processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C ensures proper soldering and reliability during assembly.

Length: 5 mm

The compact length of 5mm further contributes to space-saving and efficient placement on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this IC can withstand harsh operating conditions in industrial environments.

Technology: BICMOS

The use of BiCMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: NO LEAD

The no-lead terminal form ensures environmentally friendly manufacturing and complies with RoHS regulations.

Maximum Supply Current: 0.155 mA

The low maximum supply current of 0.155mA contributes to energy efficiency and longer battery life in devices.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit functions in one IC simplifies design complexity and reduces component count in telecom applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is common in many electronic systems, ensuring compatibility and ease of integration.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting on the PCB, suitable for compact device designs.

Technical Specifications

Cellphone ICs MAX2044ETP+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.20SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.155 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2044ETP+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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