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ADF4602BCPZ-RL

Analog Devices

ADF4602BCPZ-RL by Analog Devices

Analog Devices' ADF4602BCPZ-RL is a cellphone IC with 40 terminals, operating at 3.3V. It features a square package shape, matte tin terminal finish, and telecom IC type for RF and baseband circuits. Ideal for applications requiring a compact design and reliable performance in temperature range of 0-85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 3,724 parts In-Stock

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Digiode

USA . 872 parts In-Stock

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Sensible Micro Corp

USA . 10 parts In-Stock

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EMSNET

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Native Components

USA . 334 parts In-Stock

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$0.550

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Northwest PG Solutions

USA . 688 parts In-Stock

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$0.605

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AZTECH Wire

Italy . 315 parts In-Stock

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$6.287

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Parana Technologies

USA . 689 parts In-Stock

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$8.894

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$8.271

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IDEA Electronic Components Group

UK . 2,103 parts In-Stock

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$9.563

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$9.085

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DigiPath Technology Company

USA . 123 parts In-Stock

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$14.918

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$14.322

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$14.322

Semicontronic

India . 497 parts In-Stock

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$609.000

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$593.775

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$590.730

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One Stop Electronics

USA . 661 parts In-Stock

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Corphita

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Overview

Enhance the performance of your cellphone with the ADF4602BCPZ-RL by Analog Devices. Known for their top-notch quality and innovation, Analog Devices brings you a cutting-edge Cellphone IC that is designed to optimize the functionality and efficiency of your device. With its surface mount capability and compact square package shape, this IC offers seamless integration and space-saving benefits. Perfect for telecom applications requiring RF and baseband circuitry, this product operates at 3.3V, ensuring reliable performance in a wide range of temperatures. Upgrade your cellphone experience with the ADF4602BCPZ-RL and enjoy enhanced connectivity and functionality like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, making this product convenient for manufacturers.

Package Shape: SQUARE

The square package shape helps optimize space on the circuit board, allowing for more compact and efficient designs.

Power Supplies (V): 3.3

Operating at a low power supply of 3.3V makes this product energy efficient and ideal for mobile devices.

No. of Terminals: 40

Having 40 terminals provides flexibility in connectivity and allows for multiple functions to be integrated into one component.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options offer versatility in design, thermal management, and space-saving capabilities.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even under harsh conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable operation in a variety of environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and durability for long-lasting connections.

Terminal Position: QUAD

The quad terminal position allows for efficient signal routing and connection to other components.

Maximum Seated Height: 1 mm

The low seated height saves space and allows for slim and compact device designs.

Width: 6 mm

The compact width contributes to a smaller footprint on the circuit board and efficient use of space.

Length: 6 mm

The small length size complements the square package shape for optimized space utilization.

Terminal Form: NO LEAD

The lead-free terminal form is environmentally friendly and complies with regulations, making the product sustainable.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuits in one IC simplifies system design and enhances performance in wireless communication applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures consistent and stable power delivery for reliable operation.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density integration on the circuit board, enabling complex functionality in a compact space.

Technical Specifications

Cellphone ICs ADF4602BCPZ-RL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

ADF4602BCPZ-RL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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