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ADF4360-3BCPZRL

Analog Devices

ADF4360-3BCPZRL by Analog Devices

Analog Devices ADF4360-3BCPZRL is a 24-terminal cellphone IC with 3.3V power supply, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in industrial telecom applications due to its compact square chip carrier package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 15,905 parts In-Stock

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Vyrian

USA . 2,580 parts In-Stock

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2,580

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Inventory MP

USA . 2,332 parts In-Stock

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Bristol Electronics

USA . 1,832 parts In-Stock

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Digiode

USA . 277 parts In-Stock

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277

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Nova Conductors

Japan . 62 parts In-Stock

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62

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J2 Sourcing AB

Sweden . 20 parts In-Stock

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Vigor

Singapore . 2,381 parts In-Stock

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$4.300

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AZTECH Wire

Italy . 268 parts In-Stock

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$8.002

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Corohmni

South Africa . 250 parts In-Stock

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$14.998

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Parana Technologies

USA . 1,274 parts In-Stock

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$15.910

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$14.797

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Aztec Data Supply Inc.

USA . 4,307 parts In-Stock

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$16.149

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IDEA Electronic Components Group

UK . 1,028 parts In-Stock

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$17.108

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$16.253

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One Stop Electronics

USA . 164 parts In-Stock

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$19.000

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DigiPath Technology Company

USA . 3,104 parts In-Stock

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$26.688

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$25.621

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$25.621

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$25.621

Semicontronic

India . 1,453 parts In-Stock

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$312.000

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$304.200

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$302.640

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Ampacity Inc.

Singapore . 1,447 parts In-Stock

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$423.000

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Continental Prestige Electronics

USA . 6,237 parts In-Stock

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Argo Parts USA

USA . 3,780 parts In-Stock

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Corphita

USA . 725 parts In-Stock

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725

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Advanced Electronics

New Zealand . 650 parts In-Stock

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650

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Aranea Global

USA . 100 parts In-Stock

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Perfect Parts

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Lixinc

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Overview

Unleash the power of innovation with the ADF4360-3BCPZRL by Analog Devices. As a leader in cellphone ICs, Analog Devices delivers cutting-edge technology in a compact SQUARE package perfect for your mobile device needs. With a focus on quality and reliability, this product offers unmatched performance and efficiency. Whether you're designing a smartphone or tablet, the ADF4360-3BCPZRL provides the value and benefits you need to stay ahead in today's competitive market. Elevate your products with the trusted expertise of Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort.

Package Shape: SQUARE

Square shape provides efficient use of space on the circuit board, maximizing component density.

Power Supplies (V): 3.3

Operates at a standard voltage, ensuring compatibility with a wide range of systems and devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design allows for efficient heat dissipation and compact size.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold conditions, increasing its versatility and reliability.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term performance.

Maximum Seated Height: 1 mm

Low profile design allows for compact and space-saving installation.

Temperature Grade: INDUSTRIAL

Designed for industrial use, providing reliability and durability in harsh environments.

Nominal Supply Voltage: 3.3 V

Operates at a standard voltage, ensuring compatibility and ease of integration.

Technical Specifications

Cellphone ICs ADF4360-3BCPZRL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ADF4360-3BCPZRL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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