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TLV320AC56PT

Texas Instruments

TLV320AC56PT by Texas Instruments

TLV320AC56PT by Texas Instruments is a Cellphone IC with 48 terminals in a square package. Operating temperature range from -40 to 85°C, suitable for industrial use. Telecom IC type: Baseband Circuit, with nominal voltage of 3V for cellphone applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,837 parts In-Stock

1+ parts

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5,837

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Digiode

USA . 2,086 parts In-Stock

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2,086

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 670 parts In-Stock

1+ parts

$9.502

100+ parts

-

1k+ parts

$10.103

10k+ parts

-

670

$9.502

-

$10.103

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DigiPath Technology Company

USA . 2,098 parts In-Stock

1+ parts

$10.462

100+ parts

$9.625

1k+ parts

-

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2,098

$10.462

$9.625

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ChromeModa Solutions

Germany . 4,512 parts In-Stock

1+ parts

$10.676

100+ parts

$8.754

1k+ parts

-

10k+ parts

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4,512

$10.676

$8.754

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IDEA Electronic Components Group

UK . 708 parts In-Stock

1+ parts

$10.676

100+ parts

$10.142

1k+ parts

$9.608

10k+ parts

-

708

$10.676

$10.142

$9.608

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AZTECH Wire

Italy . 512 parts In-Stock

1+ parts

$13.199

100+ parts

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512

$13.199

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One Stop Electronics

USA . 736 parts In-Stock

1+ parts

$201.000

100+ parts

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736

$201.000

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Corphita

USA . 3,231 parts In-Stock

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3,231

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Overview

Enhance the performance of your cellphone with the TLV320AC56PT from Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers reliable solutions for the telecommunications industry. This Cellphone IC offers unmatched value with its compact design and industrial-grade temperature range. Elevate your device's baseband circuit with this high-performance IC, ideal for a wide range of applications. Trust Texas Instruments to provide innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material ensures durability and reliability of the IC, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on a circuit board, saving time and effort.

Package Shape: SQUARE

Square shape provides stability and efficient use of space on the PCB.

No. of Terminals: 48

High number of terminals allow for more connectivity options, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style enables compact design and efficient signal processing.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the IC to function in extreme cold environments.

Terminal Position: QUAD

Quad terminal position allows for secure and reliable connections on the PCB.

Maximum Seated Height: 1.6 mm

Low seated height minimizes space requirements and facilitates compact device designs.

Width: 7 mm

Narrow width of the IC enables efficient use of PCB real estate and allows for compact layouts.

Length: 7 mm

Short length of the IC contributes to space-saving design and compact form factor of the product.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and secure connections on the PCB.

Telecom IC Type: BASEBAND CIRCUIT

Baseband circuit type is essential for communication functions in cellphones, ensuring seamless network connectivity.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V is commonly used in cellphones, ensuring compatibility and reliable performance.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for finer connections on the PCB, enhancing signal integrity and performance.

Technical Specifications

Cellphone ICs TLV320AC56PT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLV320AC56PT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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